| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Length | Lead Free | Depth | Factory Lead Time | REACH SVHC | Lead Pitch | Pbfree Code | Connector Type | Number of Positions | Gender | MIL Conformance | DIN Conformance | IEC Conformance | Filter Feature | Mixed Contacts | Option | Number of Contacts | Housing Color | Contact Finish - Mating | Orientation | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Total Number of Contacts | Radiation Hardening | Body/Shell Style | HTS Code | Max Current Rating | Insulation Resistance | JESD-609 Code | Reference Standard | Terminal Pitch | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Pitch | Max Voltage Rating (AC) | Insulation Material | Body Length or Diameter | Body Breadth | Length - Termination | Number of Rows | Number of Conductors | Style | Current Rating (Amps) | Reliability | Number Of PCB Rows | PCB Contact Pattern | Body Depth | Contact Style | PCB Contact Row Spacing | Contact Pattern | Mating Contact Row Spacing | Mounting Option 1 | Rated Current (Signal) | Dielectric Withstanding Voltage | Insulator Color | Plating Thickness | UL Flammability Code | Shrouding | Fastening Type | Material Flammability Rating | Contact Shape | Insulation Color | Contact Type | Number of Positions Loaded | Contact Finish Thickness - Mating | Pitch - Mating | Contact Finish - Post | Insulation Height | Contact Length - Post | Contact Length - Mating | Overall Contact Length | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TMMH-113-06-L-D-EP | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Solder | ROHS3 Compliant | 3 Weeks | BOARD CONNECTOR | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | 26 | EAR99 | Gold | 8536.69.40.40 | e3 | 2mm | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-116-13-L-D-014 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 1.116 28.35mm | 0.014 0.36mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| MTSW-111-13-S-D-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, MTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Solder | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/samtec-mtsw11113sd430-datasheets-3373.pdf | 3 Weeks | yes | Header, Cuttable | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | EAR99 | Phosphor Bronze | 8536.69.40.40 | e3 | Polyester, Glass Filled | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Black | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.700 17.78mm | 0.430 10.92mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-110-13-S-D-730 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.400 10.16mm | 0.730 18.54mm | 1.230 31.24mm | 0.100 (2.54mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-116-13-L-D-990 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11613ld990-datasheets-3375.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.140 3.56mm | 0.990 25.15mm | 1.230 31.24mm | 0.100 (2.54mm) | ||||||||||||||||||||||||||||||||||||||||||||||
| TFC-112-22-L-D-A-TR | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 1 (Unlimited) | Solder | ROHS3 Compliant | 3 Weeks | BOARD CONNECTOR | Male | 24 | PHOSPHOR BRONZE | Gold | e3 | 1.27mm | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-116-13-L-D-740 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.390 9.91mm | 0.740 18.80mm | 1.230 31.24mm | 0.100 (2.54mm) | ||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-109-21-S-Q-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 18 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | No | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.900 22.86mm | 0.430 10.92mm | 1.430 36.32mm | 0.200 (5.08mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| TMMH-117-04-TM-Q | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Solder | ROHS3 Compliant | 3 Weeks | yes | BOARD CONNECTOR | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | 68 | PHOSPHOR BRONZE | Tin | e3 | 2mm | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-116-13-L-D-200 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11613ld200-datasheets-3362.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.930 23.62mm | 0.200 5.08mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-116-13-L-D-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11613ld225-datasheets-3364.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.905 22.99mm | 0.225 5.72mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-120-21-F-D-340 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | Header | 40 | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 3.00μin 0.076μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.990 25.15mm | 0.340 8.64mm | 1.430 36.32mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-116-13-L-D-1040 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | 3 Weeks | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 1.040 26.42mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-205-13-S-D-1040 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | 3 Weeks | yes | Header | 10 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | EAR99 | Phosphor Bronze | No | 8536.69.40.40 | e3 | 5.08mm | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.200 5.08mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 1.040 26.42mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-110-13-S-D-990 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.140 3.56mm | 0.990 25.15mm | 1.230 31.24mm | 0.100 (2.54mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-109-21-S-Q-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw10921sq100-datasheets-3351.pdf | 3 Weeks | yes | Header | 18 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | No | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 1.230 31.24mm | 0.100 2.54mm | 1.430 36.32mm | 0.200 (5.08mm) | ||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-116-13-L-D-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11613ld430-datasheets-3352.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.700 17.78mm | 0.430 10.92mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-110-13-S-D-1040 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11013sd1040-datasheets-3354.pdf | 3 Weeks | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 1.040 26.42mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| TMMH-114-01-LM-T | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Solder | ROHS3 Compliant | 2016 | 3 Weeks | yes | BOARD CONNECTOR | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | 42 | PHOSPHOR BRONZE | Gold | e3 | 2mm | 3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-123-08-L-D-315 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | Header | 46 | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.115 2.92mm | 0.315 8.00mm | 0.530 13.46mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-110-21-L-T-1240-LL | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Kinked Pin, Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 30 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | 2.54mm | Liquid Crystal Polymer (LCP) | 3 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 1.240 31.50mm | 1.430 36.32mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| TMMH-134-04-T-D | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Solder | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/samtec-tmmh13404td-datasheets-3335.pdf | 3 Weeks | No SVHC | yes | BOARD CONNECTOR | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | 68 | EAR99 | Bronze | Tin | RECEPTACLE | 8536.69.40.40 | 5000000000Ohm | e3 | UL | 105°C | -65°C | Headers and Edge Type Connectors | 2mm | LIQUID CRYSTAL POLYMER (LCP) | 0.157 inch | 0.101 inch | 2 | ONE | COMMERCIAL | 2 | RECTANGULAR | 0.079 inch | SQ PIN-SKT | RECTANGULAR | 0.079 inch | 3A | 1000VAC V | BLACK | 150μin | ||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-125-22-F-D-000 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | Header | 50 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 3.00μin 0.076μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.530 13.46mm | 0.630 16.00mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| HTSW-209-27-F-D-RA | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HTSW | Through Hole | Through Hole, Right Angle | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-htsw20927fdra-datasheets-3340.pdf | 3 Weeks | 5.08mm | yes | Header | 18 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | E.L.P. | Phosphor Bronze | No | e3 | Liquid Crystal Polymer (LCP) | 1.7 inch | 2 | ONE | Board to Board or Cable | Varies by WireGAuge | COMMERCIAL | 2 | RECTANGULAR | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 3.00μin 0.076μm | 0.200 5.08mm | Tin | 0.240 6.10mm | 0.890 22.61mm | 0.230 5.84mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||
| HMTSW-116-13-L-D-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 1.030 26.16mm | 0.100 2.54mm | 1.230 31.24mm | 0.100 (2.54mm) | ||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-109-21-S-Q-990 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | 3 Weeks | yes | Header | 18 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | No | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.340 8.64mm | 0.990 25.15mm | 1.430 36.32mm | 0.200 (5.08mm) | ||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-108-08-S-T-048-RA | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole, Right Angle | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | Header | 24 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | 24 | e3 | 2.54mm | Liquid Crystal Polymer (LCP) | 3 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.319 8.10mm | 0.048 1.22mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-110-13-S-D-200 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11013sd200-datasheets-3346.pdf | 3 Weeks | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.930 23.62mm | 0.200 5.08mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-109-21-S-Q-730 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 18 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | No | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.600 15.24mm | 0.730 18.54mm | 1.430 36.32mm | 0.200 (5.08mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| TMMH-115-01-F-T-RA | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BOARD | Solder | 125°C | -55°C | ROHS3 Compliant | 2011 | 30mm | 10.47mm | 3 Weeks | No SVHC | yes | BOARD CONNECTOR | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | 45 | Black | GOLD FLASH OVER NICKEL (50) | Right Angle | E.L.P., FLEXYZ | Bronze | Tin | Polymer | 5.5A | e3 | Headers and Edge Type Connectors | 2mm | 500V | 3 | ONE | COMMERCIAL | 3 | RECTANGULAR | SQ PIN-SKT | 2.0066 mm | RECTANGULAR | 0.079 inch | LOCKING | 4.5A | FLASH inch |
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