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ContactHeaders & Male Pins(495564)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | RoHS Status | Published | Datasheet | Lead Free | Factory Lead Time | REACH SVHC | Lead Pitch | Pbfree Code | Connector Type | Number of Positions | Gender | MIL Conformance | DIN Conformance | IEC Conformance | Filter Feature | Mixed Contacts | Option | Number of Contacts | Mating Information | Contact Gender | Contact Finish - Mating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Total Number of Contacts | Radiation Hardening | HTS Code | JESD-609 Code | Reference Standard | Terminal Pitch | Operating Temperature (Min) | Subcategory | Pitch | Insulation Material | Body Length or Diameter | Body Breadth | Termination Type | Number of Rows | Number of Conductors | Style | Current Rating (Amps) | Mounting Style | Contact Finish Termination | Reliability | Number Of PCB Rows | PCB Contact Pattern | Body Depth | Contact Style | Contact Pattern | Mating Contact Row Spacing | Insulator Color | Plating Thickness | UL Flammability Code | Shrouding | Fastening Type | Material Flammability Rating | Contact Shape | Insulation Color | Contact Type | Number of Positions Loaded | Contact Finish Thickness - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Insulation Height | Contact Length - Post | Contact Length - Mating | Overall Contact Length | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HMTSW-111-12-G-Q-730 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.200 5.08mm | 0.730 18.54mm | 1.030 26.16mm | 0.200 (5.08mm) | ||||||||||||||||||||||||||||||||||||
| HMTSW-111-10-S-D-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | 3 Weeks | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.630 16.00mm | 0.100 2.54mm | 0.830 21.08mm | 0.100 (2.54mm) | ||||||||||||||||||||||||||||||||||||||
| HMTSW-111-08-S-Q-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | 3 Weeks | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.330 8.38mm | 0.100 2.54mm | 0.530 13.46mm | 0.200 (5.08mm) | ||||||||||||||||||||||||||||||||||||||
| HMTSW-111-12-G-Q-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.830 21.08mm | 0.100 2.54mm | 1.030 26.16mm | 0.200 (5.08mm) | ||||||||||||||||||||||||||||||||||||
| HMTSW-111-08-S-Q-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11108sq225-datasheets-7223.pdf | 3 Weeks | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.205 5.21mm | 0.225 5.72mm | 0.530 13.46mm | 0.200 (5.08mm) | |||||||||||||||||||||||||||||||||||||
| HMTSW-111-10-S-D-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.300 7.62mm | 0.430 10.92mm | 0.830 21.08mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||
| HMTSW-120-24-L-D-290 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 40 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 0.290 7.37mm | 0.480 12.19mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||
| MTMM-120-14-T-D-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MTMM | Through Hole | Through Hole | -55°C~105°C | Bulk | Solder | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/samtec-mtmm12014td225-datasheets-7227.pdf | Lead Free | 3 Weeks | yes | Header, Cuttable | 40 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | EAR99 | FLEXYZ | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Black | Male Pin | All | 0.079 2.00mm | 0.059 1.50mm | 0.472 12.00mm | 0.225 5.72mm | 0.751 19.08mm | 0.079 (2.00mm) | |||||||||||||||||||||||||||||||||||||
| HMTSW-112-08-S-D-008-001 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | 3 Weeks | Header | 24 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | POLARIZED | Phosphor Bronze | No | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | 23 | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.422 10.72mm | 0.008 0.20mm | 0.530 13.46mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||
| HMTSW-112-08-SM-D-155-022 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | Header | 24 | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | POLARIZED | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | 23 | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.275 6.99mm | 0.155 3.94mm | 0.530 13.46mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||||
| HMTSW-110-12-SM-D-930 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11012smd930-datasheets-7230.pdf | 3 Weeks | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | 20 | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.930 23.62mm | 1.030 26.16mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||
| TMMH-110-05-S-DV-A-TR | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BOARD | Tape & Reel (TR) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-tmmh11005sdvatr-datasheets-7231.pdf | 3 Weeks | BOARD CONNECTOR | NO | NO | NO | NO | NO | GENERAL PURPOSE | MALE | GOLD (30) | 20 | e3 | 2mm | SURFACE MOUNT | 2 | STRAIGHT | Tin (Sn) - with Nickel (Ni) barrier | 94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HMTSW-111-12-G-Q-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.705 17.91mm | 0.225 5.72mm | 1.030 26.16mm | 0.200 (5.08mm) | |||||||||||||||||||||||||||||||||||
| MTSW-126-21-T-D-200 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, MTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | yes | Header, Cuttable | 52 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Polyester, Glass Filled | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Black | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 1.130 28.70mm | 0.200 5.08mm | 1.430 36.32mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||
| HMTSW-110-24-G-T-290 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | yes | Header | 30 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 3 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.090 2.29mm | 0.290 7.37mm | 0.480 12.19mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||
| HMTSW-110-12-S-D-730 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11012sd730-datasheets-7216.pdf | 3 Weeks | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.200 5.08mm | 0.730 18.54mm | 1.030 26.16mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||
| HMTSW-111-08-S-Q-200 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.230 5.84mm | 0.200 5.08mm | 0.530 13.46mm | 0.200 (5.08mm) | |||||||||||||||||||||||||||||||||||||||
| HMTSW-111-10-S-D-640 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 0.640 16.26mm | 0.830 21.08mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||
| HMTSW-111-12-G-Q-740 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.190 4.83mm | 0.740 18.80mm | 1.030 26.16mm | 0.200 (5.08mm) | ||||||||||||||||||||||||||||||||||||
| HMTSW-111-12-G-Q-200 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.730 18.54mm | 0.200 5.08mm | 1.030 26.16mm | 0.200 (5.08mm) | ||||||||||||||||||||||||||||||||||||
| TMMH-109-05-F-5 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Solder | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/samtec-tmmh10905f5-datasheets-7205.pdf | 3 Weeks | No SVHC | yes | BOARD CONNECTOR | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | 45 | MULTIPLE MATING PARTS AVAILABLE | E.L.P., FLEXYZ | Bronze | Gold | e3 | 2mm | 5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MTMM-125-04-T-D-070 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MTMM | Through Hole | Through Hole | -55°C~105°C | Bulk | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | yes | Header, Cuttable | 50 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | EAR99 | FLEXYZ | Phosphor Bronze | 50 | 8536.69.40.40 | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Black | Male Pin | All | 0.079 2.00mm | 0.059 1.50mm | 0.070 1.78mm | 0.323 8.20mm | 0.079 (2.00mm) | |||||||||||||||||||||||||||||||||||||
| HMTSW-110-12-S-D-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.500 12.70mm | 0.430 10.92mm | 1.030 26.16mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||
| HMTSW-110-12-S-D-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11012sd225-datasheets-7209.pdf | 3 Weeks | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.705 17.91mm | 0.225 5.72mm | 1.030 26.16mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||
| HMTSW-110-12-S-D-740 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.190 4.83mm | 0.740 18.80mm | 1.030 26.16mm | 0.100 (2.54mm) | |||||||||||||||||||||||||||||||||||||||
| HMTSW-111-10-S-D-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11110sd225-datasheets-7211.pdf | 3 Weeks | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.505 12.83mm | 0.225 5.72mm | 0.830 21.08mm | 0.100 (2.54mm) | ||||||||||||||||||||||||||||||||||||||
| HMTSW-111-08-S-Q-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | 3 Weeks | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | 22 | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.430 10.92mm | 0.530 13.46mm | 0.200 (5.08mm) | ||||||||||||||||||||||||||||||||||||||
| HMTSW-111-10-S-D-500 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | EAR99 | Phosphor Bronze | 8536.69.40.40 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.230 5.84mm | 0.500 12.70mm | 0.830 21.08mm | 0.100 (2.54mm) | ||||||||||||||||||||||||||||||||||||||
| TMMH-110-01-S-DV-A-TR | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BOARD | Tape & Reel (TR) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-tmmh11001sdvatr-datasheets-7196.pdf | 3 Weeks | BOARD CONNECTOR | NO | NO | NO | NO | NO | GENERAL PURPOSE | MALE | GOLD (30) | 20 | e3 | 2mm | SURFACE MOUNT | 2 | STRAIGHT | Tin (Sn) - with Nickel (Ni) barrier | 94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TMMH-111-01-F-DV-ES | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BOARD | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-tmmh11101fdves-datasheets-7197.pdf | 3 Weeks | yes | BOARD CONNECTOR | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | 22 | MULTIPLE MATING PARTS AVAILABLE | FLEX SHROUD | PHOSPHOR BRONZE | Gold | e3 | UL | -55°C | Headers and Edge Type Connectors | 2mm | LIQUID CRYSTAL POLYMER (LCP) | 0.866 inch | 0.157 inch | 2 | ONE | STRAIGHT | COMMERCIAL | 2 | RECTANGULAR | 0.099 inch | SQ PIN-SKT | RECTANGULAR | 0.079 inch | BLACK | 3μin |
