Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Type Series Mount Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Termination Max Operating Temperature Min Operating Temperature RoHS Status Published Datasheet Voltage - Rated DC Current Rating Length Width Voltage - Rated AC Lead Free Depth Factory Lead Time Number of Pins Lead Pitch Pbfree Code Number of Positions Number of Contacts Contact Finish - Mating Orientation Flammability Rating ECCN Code Additional Feature Contact Material Contact Plating Housing Material Lead Length HTS Code Insulation Resistance Contact Resistance JESD-609 Code Feature Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Insulation Material Body Length or Diameter Body Breadth Termination Type Number of Rows Row Spacing Device Socket Type Current Rating (Amps) Mounting Style Contact Finish Termination PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch PCB Contact Row Spacing Dielectric Withstanding Voltage Device Type Used On Contact Configuration Number of Positions or Pins (Grid) Material Flammability Rating Contact Finish Thickness - Mating Contact Material - Mating Contact Material - Post Pitch - Mating Termination Post Length Pitch - Post Contact Finish - Post Contact Finish Thickness - Post
515-93-081-12-071003 515-93-081-12-071003 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download Non-RoHS Compliant 3 Weeks no 81 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e0 IC SOCKET Tin/Lead (Sn/Pb) PGA81
614-83-144-15-081112 614-83-144-15-081112 Preci-Dip
RFQ

Min: 1

Mult: 1

0 0x0x0 download PGA 614 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-6148706810061112-datasheets-6299.pdf 1A 10 Weeks 144 Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 3.4544mm 10mOhm Carrier, Open Frame 144 (15 x 15) UL94 V-0 29.5μin 0.75μm Beryllium Copper Brass 0.100 2.54mm 0.136 3.45mm 0.100 2.54mm Tin
551-10-124-14-071005 551-10-124-14-071005 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download ROHS3 Compliant 3 Weeks yes 124 GOLD (10) OVER NICKEL (150) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) - with Nickel (Ni) barrier PGA124
123-11-624-41-001000 123-11-624-41-001000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download ROHS3 Compliant 3 Weeks
522-13-089-13-061001 522-13-089-13-061001 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download ROHS3 Compliant 3 Weeks yes 89 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) PGA89
550-10-121-13-061101 550-10-121-13-061101 Preci-Dip
RFQ

Min: 1

Mult: 1

0 0x0x0 download PGA 550 Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2011 https://pdf.utmel.com/r/datasheets/precidip-5508003710061101-datasheets-1610.pdf 10 Weeks 121 Gold EAR99 STANDARD: UL 94V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 8536.69.40.40 10mOhm Open Frame 1A 121 (13 x 13) UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.164 4.16mm 0.100 2.54mm 10.0μin 0.25μm
28-8800-610C 28-8800-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder 105°C -55°C ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks 28 Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm Closed Frame, Elevated 3A 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm Gold 10.0μin 0.25μm
515-91-136-14-051001 515-91-136-14-051001 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download Non-RoHS Compliant 3 Weeks no 136 GOLD (10) OVER NICKEL (100) EAR99 LOW PROFILE BERYLLIUM COPPER POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e0 IC SOCKET Tin/Lead (Sn/Pb) PGA136
28-8375-610C 28-8375-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2007 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
22-3503-31 22-3503-31 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.3 (7.62mm) Row Spacing 503 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-08250330-datasheets-7188.pdf 3A 5 Weeks 2.54mm 22 22 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 12.7mm Closed Frame 2 22 (2 x 11) UL94 V-0 10.0μin 0.25μm Beryllium Copper Phosphor Bronze 0.100 2.54mm 0.500 12.70mm 0.100 2.54mm 10.0μin 0.25μm
28-8675-610C 28-8675-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
546-87-169-17-101135 546-87-169-17-101135 Preci-Dip
RFQ

Min: 1

Mult: 1

0 0x0x0 download PGA 546 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Press-Fit ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-5468712113061135-datasheets-9727.pdf 1A 10 Weeks 169 yes Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 2.4892mm 10mOhm Open Frame 169 (17 x 17) UL94 V-0 Flash Beryllium Copper Bronze 0.050 1.27mm 0.098 2.50mm 0.100 2.54mm Tin
28-8459-610C 28-8459-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
28-8700-610C 28-8700-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
28-8400-610C 28-8400-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
28-8600-610C 28-8600-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
116-93-642-41-006000 116-93-642-41-006000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 116 Wire Through Hole -55°C~125°C Tube 1 (Unlimited) Solder Non-RoHS Compliant 150V 3A 53.3mm 17.8mm 100V 17.7mm 3 Weeks 42 no 42 Gold Straight EAR99 DIP SOCKET Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 8536.90.40.00 10GOhm 10mOhm e0 Elevated, Open Frame Polychlorinated 2 15.24 mm 42 (2 x 21) 30.0μin 0.76μm Beryllium Copper Brass Alloy 0.100 2.54mm 0.108 2.74mm 0.100 2.54mm Tin-Lead 200.0μin 5.08μm
522-93-135-14-051003 522-93-135-14-051003 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download Non-RoHS Compliant 3 Weeks
28-8750-610C 28-8750-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
28-8620-610C 28-8620-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
28-8495-610C 28-8495-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
515-93-081-09-000001 515-93-081-09-000001 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download Non-RoHS Compliant 1A 3 Weeks no 81 GOLD (30) OVER NICKEL (100) EAR99 LOW PROFILE NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 0.9 inch 0.9 inch SOLDER IC SOCKET STRAIGHT Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RECTANGULAR 0.122 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA81 9X9
123-11-424-41-001000 123-11-424-41-001000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download ROHS3 Compliant 3 Weeks
28-8725-610C 28-8725-610C Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 28 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 28 (2 x 14) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
510-13-224-18-095002 510-13-224-18-095002 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download Through Hole ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/millmax-5101322418095002-datasheets-3133.pdf 1A Contains Lead 3 Weeks 224 yes 224 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.8 inch 1.8 inch SOLDER IC SOCKET Gold (Au) - with Nickel (Ni) barrier RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V 18X18
614-13-281-19-081007 614-13-281-19-081007 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download Bulk ROHS3 Compliant 1A 3 Weeks yes 281 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.9 inch 1.9 inch SOLDER IC SOCKET STRAIGHT Gold (Au) - with Nickel (Ni) barrier RECTANGULAR 0.031 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA281 19X19
551-10-181-14-031003 551-10-181-14-031003 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download ROHS3 Compliant 3 Weeks yes 181 GOLD (10) OVER NICKEL (150) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) - with Nickel (Ni) barrier PGA181
551-10-175-16-005003 551-10-175-16-005003 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download ROHS3 Compliant 3 Weeks yes 175 GOLD (10) OVER NICKEL (150) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) - with Nickel (Ni) barrier PGA175
511-91-361-19-000002 511-91-361-19-000002 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 download Non-RoHS Compliant 3 Weeks
546-87-391-18-101147 546-87-391-18-101147 Preci-Dip
RFQ

Min: 1

Mult: 1

0 0x0x0 download PGA 546 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Press-Fit ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-5468318314091147-datasheets-7573.pdf 1A 10 Weeks 391 Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 2.4892mm 10mOhm Open Frame 391 (18 x 18) UL94 V-0 Flash Beryllium Copper Bronze 0.050 1.27mm 0.098 2.50mm 0.100 2.54mm Tin

In Stock

Please send RFQ , we will respond immediately.