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Transistor Sockets(21155)

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Type Series Mount Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Termination Max Operating Temperature Min Operating Temperature RoHS Status Published Datasheet Current Rating Factory Lead Time Pbfree Code Number of Positions Number of Contacts Contact Finish - Mating Flammability Rating ECCN Code Additional Feature Contact Material Contact Plating Housing Material Lead Length HTS Code Insulation Resistance JESD-609 Code Feature Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Termination Type Device Socket Type Current Rating (Amps) Mounting Style Contact Finish Termination PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch PCB Contact Row Spacing Dielectric Withstanding Voltage Device Type Used On Contact Configuration Number of Positions or Pins (Grid) Material Flammability Rating Contact Finish Thickness - Mating Contact Material - Mating Contact Material - Post Pitch - Mating Termination Post Length Pitch - Post Contact Finish - Post Contact Finish Thickness - Post
523-13-159-16-105002 523-13-159-16-105002 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 1A 3 Weeks yes 159 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.6 inch 1.6 inch WIRE WRAP IC SOCKET STRAIGHT Gold (Au) - with Nickel (Ni) barrier RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA159 16X16
522-13-181-14-031002 522-13-181-14-031002 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks
42-3553-16 42-3553-16 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 6 Weeks yes 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled Closed Frame 1A 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
522-93-238-19-086002 522-93-238-19-086002 Mill-Max Manufacturing Corp.
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 0 0x0x0 download Non-RoHS Compliant 1A 3 Weeks no 238 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 1.9 inch 1.9 inch WIRE WRAP IC SOCKET STRAIGHT Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA238 19X19
522-13-176-15-061002 522-13-176-15-061002 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
69-PLS11031-12 69-PLS11031-12 Aries Electronics
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 0 0x0x0 download PGA, ZIF (ZIP) PLS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2016 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
42-6554-16 42-6554-16 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 1A 6 Weeks yes 42 42 Nickel Boron UL94 V-0 EAR99 STANDARD: UL 94V-0 Nickel Polyphenylene Sulfide (PPS), Glass Filled 2.794mm 1000000000Ohm Closed Frame 2.54mm 200°C 2.69 inch 0.9 inch RECTANGULAR 0.47 inch BELLOWED TYPE 0.1 inch 0.6 mm 1000VAC V 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
522-13-179-15-041003 522-13-179-15-041003 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
523-13-159-16-105001 523-13-159-16-105001 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
42-6551-16 42-6551-16 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 6 Weeks yes 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled Closed Frame 1A 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
175-PGM16003-11 175-PGM16003-11 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download PGA PGM Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Gold 10.0μin 0.25μm
523-13-156-15-061001 523-13-156-15-061001 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
80-PRL13127-12 80-PRL13127-12 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download PGA, ZIF (ZIP) PRL Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2016 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
522-13-181-17-001001 522-13-181-17-001001 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
522-93-240-17-061001 522-93-240-17-061001 Mill-Max Manufacturing Corp.
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 0 0x0x0 download Non-RoHS Compliant 3 Weeks
522-13-181-17-001003 522-13-181-17-001003 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
523-93-196-14-000003 523-93-196-14-000003 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download Non-RoHS Compliant 3 Weeks
551-10-196-14-000005 551-10-196-14-000005 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks yes 196 GOLD (10) OVER NICKEL (150) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) - with Nickel (Ni) barrier PGA196
42-3554-16 42-3554-16 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 1A 6 Weeks yes 42 42 Nickel Boron UL94 V-0 EAR99 STANDARD: UL 94V-0 Nickel Polyphenylene Sulfide (PPS), Glass Filled 2.794mm Closed Frame 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
42-3551-16 42-3551-16 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 6 Weeks yes 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled Closed Frame 1A 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
233-PGM18039-51 233-PGM18039-51 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download PGA PGM Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Gold 10.0μin 0.25μm
522-93-238-19-086001 522-93-238-19-086001 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

 0 0x0x0 download Non-RoHS Compliant 3 Weeks
42-6553-16 42-6553-16 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 6 Weeks yes 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled Closed Frame 1A 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
42-6552-16 42-6552-16 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 6 Weeks yes 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled Closed Frame 1A 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
522-13-181-14-031003 522-13-181-14-031003 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
522-13-181-15-041002 522-13-181-15-041002 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
523-13-132-14-071002 523-13-132-14-071002 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
522-13-179-18-117002 522-13-179-18-117002 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
522-13-181-17-001002 522-13-181-17-001002 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
523-13-156-15-061003 523-13-156-15-061003 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks
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