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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Voltage - Rated DC | Current Rating | Length | Width | Voltage - Rated AC | Depth | Factory Lead Time | Number of Pins | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | HTS Code | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Operating Temperature (Min) | Pitch | Insulation Material | Body Length or Diameter | Body Breadth | Termination Type | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | Mounting Style | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Device Type Used On | Contact Configuration | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 40-8810-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 121-13-952-41-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.9 (22.86mm) Row Spacing | 121 | Wire | Through Hole | -55°C~125°C | Tube | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 150V | 3A | 66mm | 25.4mm | 25.3mm | 3 Weeks | 52 | yes | 52 | Gold | Straight | EAR99 | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 8536.90.40.00 | 10GOhm | 10mOhm | e4 | Open Frame | Polychlorinated | 2 | 22.86 mm | 52 (2 x 26) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.260 6.60mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||
| 40-8785-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 614-13-084-11-045001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 1A | 3 Weeks | yes | 84 | GOLD (30) OVER NICKEL (100) | EAR99 | LOW PROFILE | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e4 | 2.54mm | 125°C | -55°C | 1.1 inch | 1.1 inch | SOLDER | IC SOCKET | STRAIGHT | Gold (Au) - with Nickel (Ni) barrier | RECTANGULAR | 0.031 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA84 | 11X11 | |||||||||||||||||||||||||||||||||||||||||||
| 614-13-084-10-031012 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 1A | 3 Weeks | yes | 84 | GOLD (30) OVER NICKEL (50) | EAR99 | LOW PROFILE | BERYLLIUM COPPER | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e4 | 2.54mm | 125°C | -55°C | 1 inch | 1 inch | SOLDER | IC SOCKET | STRAIGHT | Gold (Au) - with Nickel (Ni) barrier | RECTANGULAR | 0.016 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA84 | 10X10 | |||||||||||||||||||||||||||||||||||||||||||
| 614-13-084-10-031001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 1A | 3 Weeks | yes | 84 | GOLD (30) OVER NICKEL (50) | EAR99 | LOW PROFILE | BERYLLIUM COPPER | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e4 | 2.54mm | 125°C | -55°C | 1 inch | 1 inch | SOLDER | IC SOCKET | STRAIGHT | Gold (Au) - with Nickel (Ni) barrier | RECTANGULAR | 0.031 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA84 | 10X10 | |||||||||||||||||||||||||||||||||||||||||||
| 40-81000-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 110-93-314-61-105000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 510-93-022-05-001002 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | no | 22 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e0 | IC SOCKET | Tin/Lead (Sn/Pb) | PGA22 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 111-43-318-61-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 111-93-420-61-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 510-91-028-06-005001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 1A | 3 Weeks | no | 28 | GOLD (10) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e0 | 2.54mm | 125°C | -55°C | 0.6 inch | 0.6 inch | SOLDER | IC SOCKET | STRAIGHT | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA28 | 6X6 | |||||||||||||||||||||||||||||||||||||||||||
| 40-8770-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 40-8650-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 40-8625-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 116-43-310-61-008000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 614-13-084-13-081001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | yes | 84 | GOLD (30) OVER NICKEL (100) | EAR99 | LOW PROFILE | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e4 | IC SOCKET | Gold (Au) | PGA84 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 510-93-022-05-001003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | no | 22 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e0 | IC SOCKET | Tin/Lead (Sn/Pb) | PGA22 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 40-8785-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 40-8700-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 115-43-318-61-003000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 40-81250-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 104-13-964-41-770000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.9 (22.86mm) Row Spacing | 104 | Through Hole | Through Hole | Tube | 1 (Unlimited) | Press-Fit | 125°C | -55°C | ROHS3 Compliant | 150V | 3A | 81.2mm | 25.4mm | 100V | 25.3mm | 3 Weeks | 64 | yes | 64 | Gold | Straight | EAR99 | DIP SOCKET | Copper | Thermoplastic | 8536.90.40.00 | 10GOhm | 10mOhm | e4 | Open Frame | Polychlorinated | 2 | 22.86 mm | 64 (2 x 32) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.175 4.45mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||
| 116-43-950-41-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 125°C | -55°C | ROHS3 Compliant | 150V | 3A | 63.5mm | 100V | 25.3mm | 3 Weeks | yes | 50 | Straight | EAR99 | DIP SOCKET | NOT SPECIFIED | Gold | PLASTIC | 8536.90.40.00 | 10GOhm | 10mOhm | e3 | 2.54mm | Polychlorinated | 2 | 22.86 mm | IC SOCKET | Matte Tin (Sn) - with Nickel (Ni) barrier | DIP50 | |||||||||||||||||||||||||||||||||||||||||||||
| 551-10-022-05-001004 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | yes | 22 | GOLD (10) OVER NICKEL (150) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e4 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | PGA22 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 40-8460-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | 40 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | Closed Frame, Elevated | 3A | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 116-93-950-41-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.9 (22.86mm) Row Spacing | 116 | Wire | Through Hole | -55°C~125°C | Tube | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/millmax-1169395041001000-datasheets-1929.pdf | 150V | 3A | 63.5mm | 25.4mm | 100V | 25.3mm | 3 Weeks | 50 | no | 50 | Gold | Straight | EAR99 | DIP SOCKET | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 8536.90.40.00 | 10GOhm | 10mOhm | e0 | Elevated, Open Frame | Polychlorinated | 2 | 22.86 mm | 50 (2 x 25) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.108 2.74mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 1109681-324 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/arieselectronics-1109681324-datasheets-3060.pdf | 5 Weeks | 24 | 24 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e4 | Spacer | 3A | 24 (2 x 12) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||||||
| 40-8700-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 40-81000-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm |
