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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Voltage - Rated DC | Current Rating | Length | Width | Voltage - Rated AC | Lead Free | Depth | Factory Lead Time | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | Reach Compliance Code | HTS Code | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Operating Temperature (Min) | Pitch | Insulation Material | Body Length or Diameter | Body Breadth | Termination Type | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | Mounting Style | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Device Type Used On | Contact Configuration | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 32-8312-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 32 | 32 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||||||
| 32-8240-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | 32 | 32 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||||||
| 515-93-132-14-071003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | no | 132 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e0 | IC SOCKET | Tin/Lead (Sn/Pb) | PGA132 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 515-91-159-16-105001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XR3G-6401 | Omron Electronics Inc-EMC Div |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/omron-xr3g6401-datasheets-0491.pdf | 14 Weeks | 64 | GOLD (30) | EAR99 | BERYLLIUM COPPER | 8536.69.40.40 | e4 | IC SOCKET | GOLD (30) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 124-43-636-41-002000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Solder | 125°C | -55°C | ROHS3 Compliant | 2012 | 150V | 3A | 45.7mm | 17.7mm | 3 Weeks | yes | 36 | Straight | EAR99 | DIP SOCKET | Copper | Gold | PLASTIC | 8536.90.40.00 | 10GOhm | 10mOhm | e3 | 2.54mm | Polychlorinated | 2 | 15.24 mm | IC SOCKET | DIP36 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 28-6511-11 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 511 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-14651110-datasheets-3818.pdf | 1A | Lead Free | 7 Weeks | 28 | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | e4 | Closed Frame | 2.54mm | 1.45 inch | 0.69 inch | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 28 (2 x 14) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||
| 515-93-133-14-071002 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | no | 133 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e0 | IC SOCKET | Tin/Lead (Sn/Pb) | PGA133 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 40-6501-31 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-08350130-datasheets-3825.pdf | 1.5A | 7 Weeks | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | e4 | Closed Frame | 2.54mm | 2.05 inch | 0.69 inch | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| 32-8600-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 32 | 32 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||||||
| 515-13-100-10-000003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | yes | 100 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e4 | IC SOCKET | Gold (Au) | PGA100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 550-80-191-18-091101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5508003710061101-datasheets-1610.pdf | 10 Weeks | 191 | Tin | EAR99 | STANDARD: UL 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | not_compliant | 8536.69.40.40 | 10mOhm | e3 | Open Frame | 1A | 191 (18 x 18) | UL94 V-0 | Beryllium Copper | Brass | 0.100 2.54mm | 0.164 4.16mm | 0.100 2.54mm | |||||||||||||||||||||||||||||||||||||||||||||||
| 510-43-085-11-041001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 125°C | -55°C | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/millmax-5104308511041001-datasheets-0489.pdf | 150V | 3A | 27.94mm | 100V | 27.94mm | 3 Weeks | yes | 85 | Straight | EAR99 | Copper | Gold | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10GOhm | 10mOhm | e3 | 2.54mm | Polychlorinated | IC SOCKET | Tin (Sn) | PGA85 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 612-93-650-41-003000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 125°C | -55°C | Non-RoHS Compliant | 150V | 3A | 63.5mm | 100V | 17.78mm | 3 Weeks | no | 50 | Straight | EAR99 | Copper | Gold | PLASTIC | 8536.90.40.00 | 10GOhm | 10mOhm | e0 | 2.54mm | Polychlorinated | 2 | 15.24 mm | IC SOCKET | Tin/Lead (Sn/Pb) | DIP50 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 515-93-133-14-071001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 1A | 3 Weeks | no | 133 | GOLD (30) OVER NICKEL (100) | EAR99 | LOW PROFILE | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e0 | 2.54mm | 125°C | -55°C | 1.4 inch | 1.4 inch | SOLDER | IC SOCKET | STRAIGHT | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RECTANGULAR | 0.122 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA133 | 14X14 | ||||||||||||||||||||||||||||||||||||||||||||||
| 126-91-640-41-003000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | IC SOCKET | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 510-43-084-10-031001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 125°C | -55°C | ROHS3 Compliant | /files/millmax-5104308410031001-datasheets-0471.pdf | 150V | 3A | 25.4mm | 100V | 25.4mm | 3 Weeks | yes | 84 | Straight | EAR99 | Copper | Gold | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10GOhm | 10mOhm | e3 | 2.54mm | Polychlorinated | IC SOCKET | Tin (Sn) | PGA84 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 124-93-636-41-002000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 124 | Wire | Through Hole | -55°C~125°C | Tube | 1 (Unlimited) | Wire Wrap | Non-RoHS Compliant | 2012 | 150V | 3A | 45.7mm | 17.8mm | 17.7mm | 3 Weeks | 36 | no | 36 | Gold | Straight | EAR99 | DIP SOCKET | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10GOhm | 10mOhm | e0 | Open Frame | Polychlorinated | 2 | 15.24 mm | 36 (2 x 18) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.630 16.00mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||
| 40-6518-10E | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-08351810t-datasheets-2464.pdf | 3A | 4 Weeks | 2.54mm | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 105°C | 4 inch | 0.7 inch | 2 | RECTANGULAR | 0.173 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 44-6556-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 6556 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf | 3A | 6 Weeks | yes | 44 | 44 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyphenylene Sulfide (PPS), Glass Filled | 10.7442mm | e3 | Open Frame | 2.54mm | 105°C | 2.79 inch | 1.27 inch | RECTANGULAR | 0.29 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 44 (2 x 22) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.423 10.74mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 24-3574-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 5 Weeks | yes | 24 | 24 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | e3 | Closed Frame | 24 (2 x 12) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||||
| 210-47-306-41-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 16-8325-311C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 7 Weeks | 16 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | Closed Frame, Elevated | 3A | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||||||
| 510-41-145-15-002001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/millmax-5104114515002001-datasheets-0475.pdf | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 511-11-068-11-061001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 32-81000-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | 32 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | Closed Frame, Elevated | 3A | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||||||
| 40-6501-21 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-08350130-datasheets-3825.pdf | 1.5A | 7 Weeks | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.414mm | e4 | Closed Frame | 2.54mm | 2.05 inch | 0.69 inch | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.410 10.41mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| 32-8540-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 32 | 32 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||||||||
| 510-83-192-16-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 192 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 192 (16 x 16) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||||||||||||
| 32-8724-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 32 | 32 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 32 (2 x 16) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm |
