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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Lead Free | Factory Lead Time | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Plating | Housing Material | Lead Length | HTS Code | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Pitch | Body Length or Diameter | Body Breadth | Number of Rows | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 24-6822-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 2.54mm | 1.2 inch | 0.7 inch | RECTANGULAR | 0.428 inch | RND PIN-SKT | 0.1 inch | 0.2 mm | 24 (2 x 12) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||
| 714-43-246-31-018000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.1 (2.54mm) Row Spacing | 714 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 3A | 46 | yes | 46 | Gold | EAR99 | DIP SOCKET | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.318mm | 8536.90.40.00 | e3 | Carrier, Closed Frame | 46 (2 x 23) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.170 4.32mm | 0.100 2.54mm | 30.0μin 0.76μm | ||||||||||||||||||||||||||||
| 36-6513-11H | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 36 | 2.54mm | 36 | Gold | UL94 V-0 | EAR99 | LOW PROFILE, UL 94-HB | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Closed Frame | 1.8 inch | 0.7 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 36 (2 x 18) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||
| 26-6820-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 26 | 26 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 2.54mm | 1.3 inch | 0.7 inch | RECTANGULAR | 0.565 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 26 (2 x 13) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||
| 20-81156-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 510-83-181-15-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 181 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 181 (15 x 15) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||
| 20-8310-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 110-91-304-61-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 20-81000-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 546-83-085-11-002135 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 546 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Press-Fit | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5468712113061135-datasheets-9727.pdf | 1A | 10 Weeks | 85 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 2.4892mm | 10mOhm | Open Frame | 85 (11 x 11) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Bronze | 0.050 1.27mm | 0.098 2.50mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||
| 510-87-299-20-091101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 299 | 299 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Open Frame | 299 (20 x 20) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||
| 15-7635-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 15 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 15 (1 x 15) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||
| 20-81200-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 20-8385-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 20-8300-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 15-7350-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 15 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 15 (1 x 15) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||
| 20-8350-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 510-83-179-15-041101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 179 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 179 (15 x 15) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||
| 20-6823-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 1 inch | 0.7 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||
| 20-3508-202 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-143508301-datasheets-6498.pdf | 3A | 5 Weeks | 2.54mm | 20 | 20 | Gold | UL94 V-0 | EAR99 | STACKABLE | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Open Frame | 1 inch | 0.4 inch | 2 | RECTANGULAR | 0.19 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||
| 20-6820-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 2.54mm | 1 inch | 0.7 inch | RECTANGULAR | 0.565 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||
| 20-8375-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 19-71080-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 19 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 19 (1 x 19) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||
| 614-83-084-10-001112 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 614 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-6148706810061112-datasheets-6299.pdf | 1A | 10 Weeks | 84 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.4544mm | 10mOhm | Carrier, Open Frame | 84 (10 x 10) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.136 3.45mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||
| 24-4518-01 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08351800-datasheets-2355.pdf | 3A | 5 Weeks | 2.54mm | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 2 | 24 (2 x 12) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||
| 15-7500-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 15 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 15 (1 x 15) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||
| 24-0503-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2007 | /files/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 24 | 24 | Gold | UL94 HB | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA), Nylon, Glass Filled | 12.7mm | 2.4 inch | 1 | RECTANGULAR | RND PIN-SKT | 24 (1 x 24) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||
| 15-7695-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | Lead Free | 7 Weeks | 2.54mm | 15 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 15 (1 x 15) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||
| 510-87-300-21-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 300 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 300 (21 x 21) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||
| 20-6822-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 2.54mm | 1 inch | 0.7 inch | RECTANGULAR | 0.428 inch | RND PIN-SKT | 0.1 inch | 0.2 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm |
