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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Voltage - Rated DC | Current Rating | Package / Case | Length | Height | Width | Voltage - Rated AC | Lead Free | Depth | Factory Lead Time | REACH SVHC | Number of Pins | Lead Pitch | Pbfree Code | Connector Type | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Radiation Hardening | Lead Length | Reach Compliance Code | HTS Code | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Pitch | Insulation Material | Body Length or Diameter | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Device Type Used On | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 26-0518-11H | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 26 | yes | 26 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 2.54mm | 2.6 inch | 1 | RECTANGULAR | RND PIN-SKT | 26 (1 x 26) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 116-87-632-41-013101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 32 | yes | 32 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 32 (2 x 16) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| APA-314-G-N | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/samtec-apa314gn-datasheets-9504.pdf | 3 Weeks | yes | Male | 14 | Straight | EAR99 | STANDARD: UL 94V-0 | Bronze | Gold | POLYESTER | No | 8536.69.40.40 | e4 | 2.54mm | 2 | IC SOCKET | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 10-4820-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | Lead Free | 6 Weeks | 10 | 10 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | Closed Frame | 10 (2 x 5) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||||
| 24-3518-111 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-143518101-datasheets-8392.pdf | 3A | 5 Weeks | 2.54mm | yes | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 0.4 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 24 (2 x 12) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||
| 20-6513-10H | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 0.7 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 20 (2 x 10) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||
| 510-87-156-15-062101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 156 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 156 (15 x 15) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||||||||
| 10-6822-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 10 | 10 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 2.54mm | 0.5 inch | 0.7 inch | RECTANGULAR | 0.428 inch | RND PIN-SKT | 0.1 inch | 0.2 mm | 10 (2 x 5) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||
| 116-87-650-41-004101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 50 | yes | 50 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 50 (2 x 25) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 08-810-90C | Aries Electronics | $7.07 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Through Hole, Vertical | Through Hole, Right Angle, Vertical | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281090c-datasheets-3558.pdf | 3A | 6 Weeks | 8 | 8 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-HB | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | Closed Frame | 8 (2 x 4) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||||
| 10-6511-11 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 511 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-14651110-datasheets-3818.pdf | 1A | 7 Weeks | 2.54mm | 10 | 10 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Closed Frame | 0.55 inch | 0.69 inch | 2 | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 10 (2 x 5) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||
| HIC-764-SST | Samtec |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.75 (19.05mm) Row Spacing | HIC | Through Hole | Through Hole | Tube | 1 (Unlimited) | Solder | ROHS3 Compliant | 2000 | 3 Weeks | yes | 64 | Gold | Straight | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyester, Glass Filled | No | 2.9972mm | 8536.69.40.40 | e3 | Open Frame | 2 | 64 (2 x 32) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.070 1.78mm | 0.118 3.00mm | 0.070 1.78mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||||
| 510-83-095-14-091101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 95 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 95 (14 x 14) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||||||||
| 40-9513-10T | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.9 (22.86mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 4 inch | 1 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.9 mm | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||
| 15-0511-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 511 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-12051110-datasheets-7232.pdf | 1A | SIP | 7 Weeks | 2.54mm | 15 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | 2.54mm | 1 | 1A | 15 (1 x 15) | UL94 V-0 | 50.0μin 1.27μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 50.0μin 1.27μm | |||||||||||||||||||||||||||||||||||||||||
| 510-87-156-16-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 156 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 156 (16 x 16) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||||||||
| 515-93-022-05-001002 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | no | 22 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e0 | IC SOCKET | Tin/Lead (Sn/Pb) | PGA22 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 117-83-652-41-105101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 117 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-1178342841105101-datasheets-3693.pdf | 1A | 10 Weeks | 52 | 52 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10000000000Ohm | 10mOhm | Open Frame | 1.839 inch | 0.694 inch | 0.22 inch | RND PIN-SKT | 0.07 inch | 1400VAC V | 52 (2 x 26) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.070 1.78mm | 0.125 3.18mm | 0.070 1.78mm | Tin | ||||||||||||||||||||||||||||||||||||||||
| 317-91-112-41-005000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 116-87-652-41-011101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 52 | yes | 52 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 52 (2 x 26) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 346-43-137-41-013000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 346 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Press-Fit | ROHS3 Compliant | 2011 | 94mm | 2.79mm | 2.54mm | Lead Free | 37 | yes | 37 | Gold | EAR99 | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 8536.90.40.00 | e3 | 3A | 37 (1 x 37) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.175 4.45mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||||
| APA-314-G-D | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 3 Weeks | yes | Male | 14 | Straight | EAR99 | STANDARD: UL 94V-0 | BRASS | POLYESTER | not_compliant | 8536.69.40.40 | e4 | 2.54mm | 2 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 510-87-155-16-003101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 155 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 155 (16 x 16) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||||||||
| 18-0511-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 511 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/aries-18051110-datasheets-9497.pdf | 1A | SIP | 7 Weeks | 2.54mm | 18 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | 2.54mm | 1 | 1A | 18 (1 x 18) | UL94 V-0 | 50.0μin 1.27μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 50.0μin 1.27μm | |||||||||||||||||||||||||||||||||||||||||
| 18-3513-11H | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2015 | /files/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 18 | yes | 18 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Closed Frame | 2.54mm | 1.8 inch | 0.4 inch | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 18 (2 x 9) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| XR2T2421N | Omron Electronics Inc-EMC Div |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | XR2 | Threaded | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | RoHS Compliant | https://pdf.utmel.com/r/datasheets/omronelectronicsincemcdiv-xr2c0311n-datasheets-2427.pdf | 57 Weeks | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 20mOhm | Open Frame | 1A | 24 (2 x 12) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.138 3.50mm | 0.100 2.54mm | Gold | Flash | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 714-43-224-31-018000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.1 (2.54mm) Row Spacing | 714 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2017 | 3A | 24 | yes | 24 | Gold | EAR99 | DIP SOCKET | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.318mm | 8536.90.40.00 | e3 | Carrier, Closed Frame | 24 (2 x 12) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.170 4.32mm | 0.100 2.54mm | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||||||||||||||||||
| 117-43-656-41-005000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 117 | Through Hole | Through Hole | -55°C~125°C | Tube | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | 150V | 3A | 50.1mm | 1.75mm | 100V | Contains Lead | 17.53mm | 3 Weeks | No SVHC | 56 | yes | DIP, Socket | 56 | Gold | Straight | EAR99 | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 8536.90.40.00 | 10GOhm | 10mOhm | e3 | Open Frame | Polychlorinated | 2 | 15.24 mm | 56 (2 x 28) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.070 1.78mm | 0.125 3.18mm | 0.070 1.78mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 714-43-125-31-018000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 714 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 3A | 25 | yes | 25 | Gold | EAR99 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.318mm | 8536.90.40.00 | e3 | Carrier | 25 (1 x 25) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.170 4.32mm | 0.100 2.54mm | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||||||||||||||||||||
| 08-0508-31 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 8 | 2.54mm | 8 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | 1 | RECTANGULAR | RND PIN-SKT | 8 (1 x 8) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 10.0μin 0.25μm |
