Products
Manufacturer
RFQ
NEWS
ContactTransistor Sockets(21155)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Factory Lead Time | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Radiation Hardening | Lead Length | HTS Code | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Pitch | Body Length or Diameter | Body Breadth | Number of Rows | Device Socket Type | Current Rating (Amps) | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10-6621-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 6621 | Through Hole | Through Hole, Bottom Entry; Through Board | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-16662130-datasheets-9056.pdf | 1.5A | 5 Weeks | 10 | 2.54mm | 10 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | e3 | Closed Frame | 0.55 inch | 0.9 inch | RECTANGULAR | 0.375 inch | SQ PIN-SKT | 0.1 inch | 0.9 mm | 10 (2 x 5) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||
| 510-83-148-15-062101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 148 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 148 (15 x 15) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||
| 16-8600-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 22-0503-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 22 | 22 | Gold | UL94 HB | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA), Nylon, Glass Filled | 12.7mm | e0 | 1 | 22 (1 x 22) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||
| 510-87-273-21-121101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 273 | 273 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Open Frame | 273 (21 x 21) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||
| 16-81100-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 20-4508-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf | 3A | 4 Weeks | 2.54mm | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Open Frame | 0.5 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.4 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||
| 14-1508-31 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.2 (5.08mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 14 | 2.54mm | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e4 | Closed Frame | 0.7 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 14 (2 x 7) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||
| APA-648-T-B | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 3 Weeks | yes | Male | 48 | TIN OVER NICKEL (50) | Straight | EAR99 | BRASS | No | 8536.69.40.40 | e3 | 2.54mm | 2 | IC SOCKET | Tin (Sn) - with Nickel (Ni) barrier | |||||||||||||||||||||||||||||||||||||||||||
| 714-43-242-31-018000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.1 (2.54mm) Row Spacing | 714 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 3A | 42 | yes | 42 | Gold | EAR99 | DIP SOCKET | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.318mm | 8536.90.40.00 | e3 | Carrier, Closed Frame | 42 (2 x 21) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.170 4.32mm | 0.100 2.54mm | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||||
| 714-43-142-31-018000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 714 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 3A | 42 | yes | 42 | Gold | EAR99 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.318mm | 8536.90.40.00 | e3 | Carrier | 42 (1 x 42) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.170 4.32mm | 0.100 2.54mm | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||||||
| 14-0508-31 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 14 | 2.54mm | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e4 | 1 | RECTANGULAR | RND PIN-SKT | 14 (1 x 14) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 22-4518-01 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-08351800-datasheets-2355.pdf | 3A | 5 Weeks | 2.54mm | 22 | 22 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 2 | 22 (2 x 11) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 27-0508-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 27 | 2.54mm | 27 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 9.144mm | e3 | 2.7 inch | 1 | RECTANGULAR | RND PIN-SKT | 27 (1 x 27) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 16-0501-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 501 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf | 1A | SIP | 7 Weeks | 2.54mm | 16 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.668mm | 2.54mm | 1 | 1A | 16 (1 x 16) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.420 10.67mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 16-8530-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 21-0503-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 21 | 21 | Gold | UL94 HB | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA), Nylon, Glass Filled | 9.144mm | e0 | 1 | 21 (1 x 21) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||
| 14-0508-21 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 14 | 2.54mm | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 9.144mm | e4 | 1 | RECTANGULAR | RND PIN-SKT | 14 (1 x 14) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 16-8439-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 16-8270-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 510-83-156-16-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 156 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 156 (16 x 16) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||
| 16-8608-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 16-8720-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 16-8633-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 16-8810-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 16-8240-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||
| 16-822-90WR | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-0882390-datasheets-3547.pdf | 1.5A | 7 Weeks | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 3.683mm | e4 | Closed Frame | 2.54mm | 0.85 inch | 0.4 inch | RECTANGULAR | 0.46 inch | SQ PIN-SKT | 0.1 inch | 0.2 mm | 16 (2 x 8) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.145 3.68mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||
| 16-8500-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||
| 20-3508-201 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-143508301-datasheets-6498.pdf | 3A | 5 Weeks | 2.54mm | 20 | 20 | Gold | UL94 V-0 | EAR99 | STACKABLE | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Open Frame | 1 inch | 0.4 inch | 2 | RECTANGULAR | 0.19 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||
| 16-8480-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm |
