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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Voltage - Rated DC | Current Rating | Package / Case | Length | Width | Voltage - Rated AC | Lead Free | Depth | Factory Lead Time | REACH SVHC | Number of Pins | Lead Pitch | Pbfree Code | Connector Type | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Radiation Hardening | Lead Length | Reach Compliance Code | HTS Code | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Insulation Material | Body Length or Diameter | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 08-823-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 8 | 8 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 8 (2 x 4) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||
| 32-6511-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 511 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-14651110-datasheets-3818.pdf | 1A | 7 Weeks | 32 | 32 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Closed Frame | 2.54mm | 1.65 inch | 0.69 inch | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 32 (2 x 16) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||
| 02-7920-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 2 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 1 | 1.5A | 2 (1 x 2) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 116-83-428-41-004101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 28 | yes | 28 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 28 (2 x 14) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||
| 116-83-628-41-004101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 28 | yes | 28 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 28 (2 x 14) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||
| 06-820-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 6 | 6 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 6 (2 x 3) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||
| 32-3513-10T | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 32 | 32 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 0.4 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 32 (2 x 16) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 212-1-40-006 | CNC Tech |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Surface Mount | -40°C~105°C | Tube | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | 18 Weeks | 40 | Gold | Polybutylene Terephthalate (PBT) | 4mOhm | Open Frame | 3A | 40 (2 x 20) | UL94 V-0 | Beryllium Copper | Brass | 0.100 2.54mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 16-3518-102 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/arieselectronics-143518101-datasheets-8392.pdf | 3A | 5 Weeks | 2.54mm | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 0.8 inch | 0.4 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 16 (2 x 8) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||
| APA-308-G-P | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 3 Weeks | yes | Male | 8 | Straight | EAR99 | STANDARD: UL 94V-0 | BRASS/PHOSPHOR BRONZE | POLYESTER | not_compliant | e4 | 2.54mm | 2 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 116-83-650-41-003101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 50 | yes | 50 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 50 (2 x 25) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||
| 215-1-28-006 | CNC Tech |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Through Hole | -55°C~105°C | Tube | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2012 | 18 Weeks | 28 | Gold | Polybutylene Terephthalate (PBT) | 4mOhm | Open Frame | 3A | 28 (2 x 14) | UL94 V-0 | Beryllium Copper | Brass | 0.100 2.54mm | 0.512 13.00mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 12-1508-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.2 (5.08mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 12 | 2.54mm | 12 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e3 | Closed Frame | 0.6 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 12 (2 x 6) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||
| 116-87-652-41-002101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 52 | yes | 52 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 52 (2 x 26) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||
| APA-648-T-J | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 3 Weeks | yes | Male | 48 | TIN OVER NICKEL (50) | Straight | EAR99 | STANDARD: UL 94V-0 | BRASS | POLYESTER | No | 8536.69.40.40 | e3 | 2.54mm | 2 | IC SOCKET | Tin (Sn) - with Nickel (Ni) barrier | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 28-6518-11 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-08351810t-datasheets-2464.pdf | 3A | Lead Free | 4 Weeks | 28 | yes | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 2.54mm | 125°C | 2.8 inch | 0.7 inch | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 28 (2 x 14) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 116-83-642-41-007101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 42 | yes | 42 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 42 (2 x 21) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||
| 117-43-640-41-005000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 117 | Through Hole | Through Hole | -55°C~125°C | Tube | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | 150V | 3A | 35.86mm | 1.75mm | 100V | Lead Free | 17.53mm | 3 Weeks | Unknown | 40 | yes | DIP, Socket | 40 | Gold | Straight | EAR99 | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10GOhm | 10mOhm | e3 | Open Frame | Polychlorinated | 2 | 15.24 mm | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.070 1.78mm | 0.125 3.18mm | 0.070 1.78mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 23-0518-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 518 | Surface Mount | Surface Mount | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20051800-datasheets-7194.pdf | 3A | 6 Weeks | 23 | 2.54mm | 23 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 1.1684mm | e3 | Open Frame | 2.3 inch | 1 | RECTANGULAR | RND PIN-SKT | 23 (1 x 23) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.046 1.17mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 117-93-640-41-005000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 117 | Through Hole | Through Hole | -55°C~125°C | Tube | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | 150V | 3A | 35.86mm | 100V | Contains Lead | 17.53mm | 3 Weeks | 40 | 180μm | no | 40 | Gold | Straight | EAR99 | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10GOhm | 10mOhm | e0 | Open Frame | Polychlorinated | 2 | 15.24 mm | 40 (2 x 20) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.070 1.78mm | 0.125 3.18mm | 0.070 1.78mm | Tin-Lead | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 28-3518-11 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-08351810t-datasheets-2464.pdf | 3A | 4 Weeks | 28 | 2.54mm | yes | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 0.4 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 28 (2 x 14) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||
| 614-83-950-31-012101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.9 (22.86mm) Row Spacing | 614 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-6148762831012101-datasheets-3791.pdf | 1A | 10 Weeks | 50 | yes | 50 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.4544mm | 8536.69.40.40 | 10mOhm | e3 | Carrier, Open Frame | 50 (2 x 25) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.136 3.45mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||
| 02-7250-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 2 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 1 | 1.5A | 2 (1 x 2) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 299-83-320-10-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 299 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-2998731010001101-datasheets-3401.pdf | 150V | 1A | 25.3mm | 100V | 13.22mm | 10 Weeks | yes | 20 | Gold | Right Angle | UL94 V-0 | EAR99 | 94V-0 | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | No | 3.2512mm | 8536.69.40.40 | 10GOhm | 10mOhm | e3 | Closed Frame | Polychlorinated | 2 | 7.62 mm | 20 (2 x 10) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.128 3.24mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||
| 116-87-650-41-008101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 50 | yes | 50 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 50 (2 x 25) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||
| 18-3518-101H | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-143518101-datasheets-8392.pdf | 3A | 5 Weeks | 18 | yes | 18 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 2.54mm | 125°C | 0.9 inch | 0.4 inch | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 18 (2 x 9) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 12-0508-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | /files/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 12 | 2.54mm | 12 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e3 | 1 | RECTANGULAR | RND PIN-SKT | 12 (1 x 12) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||
| 08-820-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 8 | 8 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 8 (2 x 4) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||
| 510-83-066-11-002101 | Preci-Dip | $6.78 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 66 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 66 (11 x 11) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||||||||||
| APA-320-T-B | Samtec |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | /files/samtec-apa320tb-datasheets-9596.pdf | 3 Weeks | yes | Male | 20 | TIN OVER NICKEL (50) | Straight | EAR99 | BRASS | not_compliant | 8536.69.40.40 | e3 | 2.54mm | 2 | IC SOCKET | Tin (Sn) - with Nickel (Ni) barrier |
