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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Voltage - Rated DC | Current Rating | Package / Case | Length | Width | Voltage - Rated AC | Lead Free | Depth | Factory Lead Time | REACH SVHC | Outside Diameter | Number of Pins | Lead Pitch | Pbfree Code | Connector Type | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Radiation Hardening | Lead Length | Reach Compliance Code | HTS Code | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Pitch | Body Material | Insulation Material | Body Length or Diameter | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 04-0501-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 501 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf | 1A | SIP | 7 Weeks | 2.54mm | 4 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | 2.54mm | 1 | 1A | 4 (1 x 4) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||
| 116-87-628-41-004101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 28 | yes | 28 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 28 (2 x 14) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 614-83-648-41-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 614 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-6148762831012101-datasheets-3791.pdf | 1A | 10 Weeks | 48 | yes | 48 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.4544mm | 8536.69.40.40 | 10mOhm | e3 | Carrier, Open Frame | 48 (2 x 24) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.136 3.45mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 20-3513-10T | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 20 | yes | 20 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 2.54mm | 2 inch | 0.4 inch | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 20 (2 x 10) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||
| ICO-316-NGT | Samtec Inc. | $5.41 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | ICO | Through Hole | Through Hole | -55°C~105°C | Tube | 1 (Unlimited) | Solder | ROHS3 Compliant | 1A | 20.32mm | 10.03mm | 3 Weeks | yes | Female | 16 | Gold | Straight | EAR99 | LOW PROFILE | Copper | Polyester, Glass Filled | No | 8536.69.40.40 | 5GOhm | 10mOhm | e3 | Open Frame | Polyester | 0.395 inch | 2 | 7.62 mm | RECTANGULAR | MACHINE SCREW | 0.1 inch | 1000VAC V | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.095 2.41mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||
| D95A24-42 | Harwin Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | D95 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/harwininc-d9503242-datasheets-3714.pdf | 150V | 1A | 30.4mm | 100V | 10.02mm | 20 Weeks | yes | 24 | Gold | Straight | UL94 V-0 | EAR99 | ROHS COMPLIANT | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 3.2004mm | 8536.69.40.40 | 10GOhm | 10mOhm | e3 | Elevated, Open Frame | Polychlorinated | 0.394 inch | 2 | 7.62 mm | RND PIN-SKT | 0.1 inch | 1000VAC V | 24 (2 x 12) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.126 3.20mm | 0.100 2.54mm | Tin | 196.9μin 5.00μm | ||||||||||||||||||||||||||||
| 36-0518-10T | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | SIP | 5 Weeks | 36 | 2.54mm | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | Open Frame | 2.54mm | 1 | 3A | 36 (1 x 36) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 4620 | Keystone Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Transistor, TO-3 | Chassis Mount | Chassis Mount | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/keystoneelectronics-4620-datasheets-4306.pdf | Molded | 27.686mm | 6 Weeks | 3.4544 mm | 3 | Tin | UL94 V-0 | EAR99 | Polyester, Glass Filled | Closed Frame | Nylon | 3 (Rectangular) | UL94 V-0 | Brass | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 110-83-064-01-505101 | Preci-Dip | $5.72 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 110 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1108721001742101-datasheets-9113.pdf | 1A | 10 Weeks | 64 | Gold | Straight | UL94 V-0 | EAR99 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | No | 8536.69.40.40 | 10000000000Ohm | 10mOhm | Open Frame | 2.54mm | 1.65 inch | 1.05 inch | 0.165 inch | RND PIN-SKT | 0.1 inch | 1400VAC V | 64 (2 x 32) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||
| 116-87-432-41-011101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 32 | yes | 32 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 32 (2 x 16) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| APA-308-G-D | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 3 Weeks | yes | Male | 8 | Straight | EAR99 | STANDARD: UL 94V-0 | BRASS | POLYESTER | not_compliant | e4 | 2.54mm | 2 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 116-87-632-41-011101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 32 | yes | 32 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 32 (2 x 16) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 116-87-428-41-004101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 28 | yes | 28 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 28 (2 x 14) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 116-87-328-41-004101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 116 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1168732041008101-datasheets-3619.pdf | 1A | 10 Weeks | 28 | yes | 28 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Elevated, Open Frame | 28 (2 x 14) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 16-C195-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | EJECT-A-DIP™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-32c18210-datasheets-3591.pdf | 3A | Lead Free | 5 Weeks | 16 | 2.54mm | yes | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | 1000000000Ohm | e3 | Closed Frame | 1.05 inch | 0.4 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 1000VAC V | 16 (2 x 8) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 08-2501-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.2 (5.08mm) Row Spacing | 501 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-08350130-datasheets-3825.pdf | 1.5A | 7 Weeks | 2.54mm | 8 | 8 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | e3 | Closed Frame | 0.45 inch | 2 | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 8 (2 x 4) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 146-87-642-41-035101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 146 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Press-Fit | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-1468730441035101-datasheets-8704.pdf | 1A | 10 Weeks | 42 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.81mm | 10mOhm | Open Frame | 42 (2 x 21) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||||||||
| 122-83-636-41-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 122 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2012 | /files/precidip-1238731641001101-datasheets-2756.pdf | 1A | 10 Weeks | 36 | 36 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 9.398mm | 10000000000Ohm | 10mOhm | Open Frame | 2.54mm | 1.797 inch | 0.697 inch | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.2 mm | 1400VAC V | 36 (2 x 18) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.370 9.40mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||
| 08-0503-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 8 | 8 | Gold | UL94 HB | EAR99 | Polyamide (PA), Nylon, Glass Filled | 12.7mm | e4 | 1 | RECTANGULAR | RND PIN-SKT | 8 (1 x 8) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 16-3513-10H | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 16 | yes | 16 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 2.54mm | 1.6 inch | 0.4 inch | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 16 (2 x 8) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||
| 28-6513-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 28 | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 0.7 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 28 (2 x 14) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||
| 34-3513-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 34 | 34 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 3.4 inch | 0.4 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 34 (2 x 17) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||
| 299-87-320-11-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 299 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-2998731010001101-datasheets-3401.pdf | 1A | 10 Weeks | 20 | yes | 20 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.2512mm | 8536.69.40.40 | 10mOhm | e3 | Closed Frame | 20 (2 x 10) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.128 3.24mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 111-43-640-41-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 111 | Through Hole | Through Hole | -55°C~125°C | Tube | 1 (Unlimited) | Solder | ROHS3 Compliant | 2011 | 150V | 3A | DIP | 50.8mm | 17.78mm | 100V | Lead Free | 17.78mm | 3 Weeks | No SVHC | yes | DIP, Socket | 40 | 40 | Gold | Straight | UL94 V-0 | EAR99 | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.3mm | 10GOhm | 10mOhm | e3 | Open Frame | Polychlorinated | 2 | 15.24 mm | 40 (2 x 20) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 612-87-964-41-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.9 (22.86mm) Row Spacing | 612 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-6128730441001101-datasheets-8480.pdf | 1A | 10 Weeks | 64 | yes | 64 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 7.3914mm | 8536.69.40.40 | 10mOhm | e3 | Carrier, Open Frame | 64 (2 x 32) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.291 7.39mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||||||||
| 33-0518-10H | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 33 | 2.54mm | 33 | Gold | UL94 V-0 | EAR99 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | Open Frame | 3.3 inch | 1 | RECTANGULAR | RND PIN-SKT | 33 (1 x 33) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||||||
| 08-0503-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 8 | 8 | Gold | UL94 HB | EAR99 | Polyamide (PA), Nylon, Glass Filled | 9.144mm | e4 | 1 | RECTANGULAR | RND PIN-SKT | 8 (1 x 8) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||||||||
| 08-3501-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 501 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-08350130-datasheets-3825.pdf | 1.5A | 7 Weeks | 8 | 8 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.414mm | e3 | Closed Frame | 2.54mm | 0.45 inch | 0.39 inch | RECTANGULAR | 0.3 inch | SQ PIN-SKT | 0.1 inch | 0.3 mm | 8 (2 x 4) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.410 10.41mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||||
| 27-0518-11 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-10051810-datasheets-2521.pdf | 3A | 5 Weeks | 27 | yes | 27 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 2.54mm | 2.7 inch | 1 | RECTANGULAR | RND PIN-SKT | 27 (1 x 27) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||||
| 12-6513-10H | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 12 | 12 | Gold | UL94 V-0 | EAR99 | LOW PROFILE; UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Closed Frame | 0.7 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.6 mm | 12 (2 x 6) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm |
