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ContactInfineon Technologies AG is expanding its 650V CoolSiC MOSFET portfolio with two new product families, now available in Q-DPAK and TOLL packages. These new offerings are designed to meet the demands of more compact, high-performance systems in a range of industries, providing enhanced power density and improved system efficiency.
Based on the advanced CoolSiC Generation 2 (G2) technology, these product families deliver significant improvements in performance, reliability, and ease of integration. The portfolio targets a wide array of applications, including high- and medium-power SMPS (Switched-Mode Power Supplies), AI server systems, renewable energy solutions, electric vehicle (EV) chargers, e-mobility, humanoid robots, televisions, drive systems, and solid-state circuit breakers.
The TOLL package is particularly notable for its outstanding Thermal Cycling on Board (TCoB) capability, which allows for more compact system designs by minimizing the PCB footprint. This capability is especially beneficial in SMPS applications, where it helps reduce system-level manufacturing costs. The TOLL package now supports an extended range of applications, enabling PCB designers to lower costs while better meeting the evolving demands of the market for smaller, more efficient systems.
The introduction of the Q-DPAK package further strengthens Infineon’s comprehensive offering of Topside Cooled (TSC) products, including CoolMOS 8, CoolSiC, CoolGaN, and OptiMOS. The TSC family is engineered to provide exceptional robustness with maximum power density, system efficiency, and cost-effectiveness. It supports direct heat dissipation of up to 95%, allowing designers to leverage both sides of the PCB for better space utilization. This results in improved overall system performance and a reduction in parasitic effects, enabling designers to optimize both form factor and cost.
Based on the advanced CoolSiC Generation 2 (G2) technology, these product families deliver significant improvements in performance, reliability, and ease of integration. The portfolio targets a wide array of applications, including high- and medium-power SMPS (Switched-Mode Power Supplies), AI server systems, renewable energy solutions, electric vehicle (EV) chargers, e-mobility, humanoid robots, televisions, drive systems, and solid-state circuit breakers.
The TOLL package is particularly notable for its outstanding Thermal Cycling on Board (TCoB) capability, which allows for more compact system designs by minimizing the PCB footprint. This capability is especially beneficial in SMPS applications, where it helps reduce system-level manufacturing costs. The TOLL package now supports an extended range of applications, enabling PCB designers to lower costs while better meeting the evolving demands of the market for smaller, more efficient systems.
The introduction of the Q-DPAK package further strengthens Infineon’s comprehensive offering of Topside Cooled (TSC) products, including CoolMOS 8, CoolSiC, CoolGaN, and OptiMOS. The TSC family is engineered to provide exceptional robustness with maximum power density, system efficiency, and cost-effectiveness. It supports direct heat dissipation of up to 95%, allowing designers to leverage both sides of the PCB for better space utilization. This results in improved overall system performance and a reduction in parasitic effects, enabling designers to optimize both form factor and cost.
These new packaging solutions provide additional flexibility, enabling customers to achieve higher power density, reduce space requirements, and lower costs, all while enhancing the reliability and performance of their systems. With this expansion of its CoolSiC portfolio, Infineon continues to push the boundaries of semiconductor technology for the next generation of power-efficient, high-performance applications.
