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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Memory Type | Output Characteristics | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Access Time (Max) | I/O Type | Memory IC Type | Programmable Type |
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| XC1765ELSOG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.7272mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9276mm | 3.937mm | 8 | 8 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC1765EL | 8 | 3.6V | 3V | 20 | 3.3V | 0.005mA | Not Qualified | 65kb | 3-STATE | 2.5MHz | 64KX1 | 1 | 65536 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||
| XC1701LPCG20I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 20 | 20 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 8542.32.00.61 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | QUAD | J BEND | 245 | 3.3V | 1.27mm | XC1701L | 20 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | 1048576 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||
| XC17S20XLVOG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | 8 | yes | EAR99 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC17S20XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 200kb | 3-STATE | 10MHz | 179160X1 | 1 | 179160 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||
| XC17S10XLVOG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | 8 | yes | EAR99 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC17S10XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 100kb | 3-STATE | 10MHz | 95752X1 | 1 | 95752 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | ||||||||||||||||||||||||||
| XC17S200AVOG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 3.3V | 8 | 8 | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||
| XC17128EPCG20C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 20 | 20 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 8542.32.00.61 | 1 | e3 | Matte Tin (Sn) | YES | 4.75V~5.25V | QUAD | J BEND | 245 | 5V | 1.27mm | XC17128E | 20 | 5.25V | 4.75V | 30 | 5V | 0.01mA | Not Qualified | 128kb | 3-STATE | 15MHz | 128KX1 | 1 | 131072 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||
| XC17S30XLPDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | Through Hole | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | No SVHC | 8 | Serial | EAR99 | unknown | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S30XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 300kb | PROM | 3-STATE | 10MHz | 1 | 0.00005A | COMMON | OTP | ||||||||||||||||||||||||||
| EPC1064PC8 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EPC | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | MOS | SYNCHRONOUS | 4.318mm | Non-RoHS Compliant | /files/intel-epc1064pc8-datasheets-4453.pdf | 8-DIP (0.300, 7.62mm) | 9.398mm | 7.62mm | 8 | EAR99 | 4 WIRE INTERFACE TO FLEX 8000 DEVICES | 8542.32.00.61 | 1 | e0 | TIN LEAD | NO | 4.75V~5.25V | DUAL | NOT SPECIFIED | 5V | 2.54mm | EPC1064 | 5.25V | 4.75V | NOT SPECIFIED | 5V | Not Qualified | R-PDIP-T8 | 65kb | 3-STATE | 4MHz | 64KX1 | 1 | 65536 bit | SERIAL | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||
| EPC2LC20 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EPC | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | 2016 | /files/intel-epc1064pc8-datasheets-4453.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 20 | EAR99 | IT CAN ALSO OPERATE AT 5V SUPPLY | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | 3V~3.6V 4.75V~5.25V | QUAD | J BEND | 220 | 3.3V | 1.27mm | EPC2 | 3.6V | 3V | 30 | Flash Memories | 3.3/5V | 0.05mA | Not Qualified | S-PQCC-J20 | 1.6Mb | 12.5MHz | 1695680X1 | 1 | 1695680 bit | SERIAL | 0.0001A | CONFIGURATION MEMORY | In System Programmable | |||||||||||||||||||||||||
| EPC1LI20 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EPC | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | MOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | /files/intel-epc1064pc8-datasheets-4453.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 20 | 3A991.B.2.A | IT CAN ALSO OPERATE AT 5V SUPPLY | 8542.32.00.61 | 1 | TIN/LEAD (SN/PB) | YES | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 220 | 3.3V | 1.27mm | EPC1 | 3.6V | 3V | 30 | 5V | 0.05mA | Not Qualified | S-PQCC-J20 | 1Mb | 3-STATE | 10MHz | 1046496X1 | 1 | 1046496 bit | SERIAL | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||
| EPC1LC20 | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EPC | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | MOS | SYNCHRONOUS | 4.572mm | Non-RoHS Compliant | /files/intel-epc1064pc8-datasheets-4453.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 20 | 3A991.B.2.A | IT CAN ALSO OPERATE AT 5V SUPPLY | 8542.32.00.61 | 1 | e0 | TIN LEAD | YES | 3V~3.6V 4.75V~5.25V | QUAD | J BEND | 220 | 3.3V | 1.27mm | EPC1 | 3.6V | 3V | 30 | 5V | 0.05mA | Not Qualified | S-PQCC-J20 | 1Mb | 3-STATE | 10MHz | 1046496X1 | 1 | 1046496 bit | SERIAL | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||
| XC1736EVOG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9276mm | 3.937mm | 8 | 8 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 1 | e3 | Matte Tin (Sn) | YES | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | 1.27mm | XC1736E | 8 | 5.25V | 4.75V | 30 | 5V | 0.01mA | Not Qualified | 36kb | 3-STATE | 10MHz | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||
| XC17128EVOG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9276mm | 3.937mm | 8 | 8 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 1 | e3 | Matte Tin (Sn) | YES | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | 1.27mm | XC17128E | 8 | 5.25V | 4.75V | 30 | 5V | 0.01mA | Not Qualified | 128kb | 3-STATE | 15MHz | 1 | 131072 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||
| XC17S100AVOG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 3.3V | 8 | 1 Mb | yes | 3A991.B.1 | No | 3V~3.6V | XC17S100A | 8 | OTP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S10XLVOG8I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | 8 | EAR99 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC17S10XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 100kb | 3-STATE | 10MHz | 95752X1 | 1 | 95752 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||||||||||||||||||
| XC17S200AVOG8I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 1.2mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 3.3V | 8 | 8 | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 1.27mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||||
| XC17S50APDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | 8 | 8 | 1 Mb | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S50A | 8 | 3.6V | 3V | 30 | 0.015mA | 500kb | 3-STATE | 559200X1 | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||
| XC1765EPDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | Through Hole | CMOS | 4.5974mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | No SVHC | 8 | Serial | 64 kb | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | No | 1 | e3 | Matte Tin (Sn) | NO | 4.75V~5.25V | DUAL | 250 | 5V | 2.54mm | XC1765E | 8 | 5.25V | 4.75V | 30 | 5V | 0.01mA | 65kb | PROM | 3-STATE | 10MHz | 64KX1 | 1 | 0.00005A | COMMON | OTP | ||||||||||||||||||||||||
| XC18V02PC44C0936 | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | CMOS | 4.572mm | Non-RoHS Compliant | 1999 | /files/xilinxinc-xc18v02pc44c0936-datasheets-4382.pdf | 44-LCC (J-Lead) | 16.5862mm | 16.5862mm | 3.3V | 44 | 44 | 2 Mb | no | 3A991.B.1 | No | 8542.32.00.61 | 1 | e0 | TIN LEAD | YES | 3V~3.6V | QUAD | J BEND | 225 | 3.3V | 1.27mm | XC18V02 | 44 | 3.6V | 3V | 30 | 256KX8 | 8 | PARALLEL/SERIAL | 20 ns | CONFIGURATION MEMORY | In System Programmable | ||||||||||||||||||||||||||||||
| XC17S200APDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | 8 | 8 | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||
| AT17N256-10SI | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | Non-RoHS Compliant | 1997 | /files/microchiptechnology-at17n25610pi-datasheets-4303.pdf | 20-SOIC (0.295, 7.50mm Width) | 3V~3.6V | AT17N256 | 20-SOIC | 256Kb | Serial EEPROM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17256EPDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 2004 | /files/xilinxinc-xcmechff1738-datasheets-4887.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 1 | e3 | Matte Tin (Sn) | NO | 4.75V~5.25V | DUAL | 250 | 5V | 2.54mm | XC17256E | 8 | 5.25V | 4.75V | 30 | 5V | 0.01mA | Not Qualified | 256Kb | 3-STATE | 15MHz | 256KX1 | 1 | 262144 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||
| AT18F040-30XU | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | 85°C | -40°C | 33MHz | ROHS3 Compliant | 1997 | /files/microchiptechnology-at18f04030xu-datasheets-4390.pdf | 20-TSSOP (0.173, 4.40mm Width) | 3.3V | 3.6V | 3V | 20 | 1mA | 3V~3.6V | AT18F040 | 20-TSSOP | 4Mb | FLASH | FLASH | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC17128EPDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 1 | e3 | Matte Tin (Sn) | NO | 4.75V~5.25V | DUAL | 250 | 5V | 2.54mm | XC17128E | 8 | 5.25V | 4.75V | 30 | 5V | 0.01mA | Not Qualified | 128kb | 3-STATE | 15MHz | 1 | 131072 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||
| AT18F080-30XU | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | ROHS3 Compliant | 1997 | /files/microchiptechnology-at18f04030xu-datasheets-4390.pdf | 20-TSSOP (0.173, 4.40mm Width) | 3V~3.6V | AT18F080 | 20-TSSOP | 7Mb | FLASH | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17256EPCG20C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 4.572mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 20-LCC (J-Lead) | 8.9662mm | 8.9662mm | 20 | 20 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 8542.32.00.61 | 1 | e3 | Matte Tin (Sn) | YES | 4.75V~5.25V | QUAD | J BEND | 245 | 5V | 1.27mm | XC17256E | 20 | 5.25V | 4.75V | 30 | 5V | 0.01mA | Not Qualified | 256Kb | 3-STATE | 15MHz | 256KX1 | 1 | 262144 bit | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||
| XC17S200APDG8I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | 8 | 8 | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||||||||||||||||||
| XC1701LPDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | yes | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC1701L | 8 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||||||||||||||||||
| AT17LV002A-10CU | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | ROHS3 Compliant | 1997 | /files/microchiptechnology-at17lv002a10cu-datasheets-4359.pdf | 8-TDFN | 3V~3.6V 4.5V~5.5V | AT17LV002A | 8-LAP (6x6) | 2Mb | Serial EEPROM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC17S10XLPDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | EAR99 | unknown | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S10XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 100kb | 3-STATE | 10MHz | 95752X1 | 1 | 95752 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP |
