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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Capacitance | Length | Input Current | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | Number of Ports | ECCN Code | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Supply Current-Max | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code | Supplier Device Package | Consumer IC Type | Data Rate | Number of I/O | Memory Type | Core Architecture | Data Bus Width | Logic Function | Quiescent Current | Threshold Voltage | uPs/uCs/Peripheral ICs Type | ESD Protection | Boundary Scan | Low Power Mode | Number of Transceivers | Time-Min | Address Bus Width | Time Format | Interrupt Capability | Volatile | Controller Type | Number of Banks |
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| MXD1210CWE | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 230μA | 1.75mm | Non-RoHS Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 16-SOIC (0.295, 7.50mm Width) | 9.9mm | 3.9mm | Contains Lead | 16 | 200.686274mg | 16 | no | EAR99 | No | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | 4.75V~5.5V | DUAL | GULL WING | 245 | 5V | 1.27mm | MXD1210 | 16 | 0.5mA | RAM | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1216D | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 5mA | Non-RoHS Compliant | 1997 | /files/maximintegrated-ds1216e-datasheets-5924.pdf | 32-DIP (0.600, 15.24mm) Socket | 7pF | 40.13mm | 10.16mm | 17.53mm | 5V | Contains Lead | 32 | No SVHC | 32 | Serial | no | EAR99 | No | 8473.30.11.40 | 5mA | e0 | Tin/Lead (Sn/Pb) | 4.5V~5.5V | DUAL | 245 | 5V | 2.54mm | DS1216 | 32 | Timer or RTC | RAM | Clock | 1/100SECOND | HH:MM:SS:hh | N | NO | Smartwatch RAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CSA | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 1.75mm | Non-RoHS Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Contains Lead | 8 | no | EAR99 | not_compliant | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | 4.75V~5.5V | DUAL | GULL WING | 245 | 5V | 1.27mm | MXD1210 | 8 | NOT SPECIFIED | 0.5mA | Not Qualified | R-PDSO-G8 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BQ2201SN | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Integrated Circuit (IC) | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 3mA | ROHS3 Compliant | /files/texasinstruments-bq2201sn-datasheets-5938.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 1.58mm | 3.91mm | 5V | Lead Free | 8 | 75.891673mg | No SVHC | 8 | EAR99 | Gold | No | 1 | e4 | YES | 4.5V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | BQ2201 | 8 | 1 | YES | Power Management Circuits | 5V | 5mA | SRAM | Nonvolatile SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CWE | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | 1.75mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-mxd1210cd-datasheets-5701.pdf | 16-SOIC (0.295, 7.50mm Width) | 9.9mm | 3.9mm | 16 | no | unknown | e0 | TIN LEAD | YES | 4.75V~5.5V | DUAL | GULL WING | 245 | 5V | 1.27mm | 16 | NOT SPECIFIED | COMMERCIAL | R-PDSO-G16 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BQ2205LYPWG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -20°C~70°C | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 500μA | 1.2mm | 4.4mm | Lead Free | 16 | 6 Weeks | 61.887009mg | 16 | ACTIVE (Last Updated: 4 days ago) | yes | 1mm | EAR99 | Gold | No | 8542.39.00.01 | 1 | e4 | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | BQ2205 | 16 | 3.6V | 3V | 1 | POWER SUPPLY SUPPORT CIRCUIT | NO | Power Management Circuits | 3.3V | 0.5mA | 210μA | 2.9V | Nonvolatile SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210ESA+T | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 230μA | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Lead Free | 8 | 6 Weeks | 506.605978mg | 8 | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 8 | NOT SPECIFIED | 0.5mA | Not Qualified | RAM | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BQ2205LYPWRG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -20°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | ROHS3 Compliant | /files/texasinstruments-bq2205lypwrg4-datasheets-1157.pdf | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 500μA | 1.2mm | 4.4mm | Lead Free | 16 | 6 Weeks | 61.887009mg | 16 | ACTIVE (Last Updated: 6 days ago) | yes | 1mm | EAR99 | Gold | No | 8542.39.00.01 | 1 | 500μA | e4 | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | BQ2205 | 16 | 3.6V | 3V | 1 | POWER SUPPLY SUPPORT CIRCUIT | NO | Power Management Circuits | 3.3V | 0.5mA | 210μA | 2.9V | Nonvolatile SRAM | ||||||||||||||||||||||||||||||||||||||||||||||
| DS1314E+T&R | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1314s2tr-datasheets-5549.pdf | 20-TSSOP (0.173, 4.40mm Width) | Lead Free | 6 Weeks | 3V~3.6V | DS1314 | 20-TSSOP | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP8421ATVX-25 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 5.08mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-dp8422av25-datasheets-5674.pdf | 68-LCC (J-Lead) | 24.2316mm | 24.2316mm | 68 | no | unknown | e0 | TIN LEAD | YES | 4.5V~5.5V | QUAD | J BEND | NOT SPECIFIED | 5V | 1.27mm | 68 | NOT SPECIFIED | S-PQCC-J68 | MEMORY CONTROLLER, DRAM | NO | NO | 20 | Dynamic RAM (DRAM) | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1321E+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1321-datasheets-5559.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 4.4mm | Lead Free | 20 | 6 Weeks | yes | EAR99 | 8542.31.00.01 | 1 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 0.65mm | DS1321 | 20 | 5.5V | 4.5V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 30 | NO | Power Management Circuits | 5V | 1.5mA | Not Qualified | R-PDSO-G20 | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C68034-56LTXI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB NX2LP-Flex™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 43mA | ROHS3 Compliant | 2004 | /files/cypresssemiconductorcorp-cy7c6803356ltxc-datasheets-5690.pdf | 56-VFQFN Exposed Pad | 3.3V | Lead Free | 56 | 10 Weeks | 56 | I2C | 8 | 3A991.A.3 | e4 | NICKEL PALLADIUM GOLD | YES | 3V~3.6V | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | CY7C68034 | 20 | Bus Controllers | Not Qualified | 480 Mbps | 12 | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | NAND Flash - USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210EWE+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 230μA | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 16-SOIC (0.295, 7.50mm Width) | 9.9mm | 3.9mm | Lead Free | 16 | 6 Weeks | 200.686274mg | 16 | yes | EAR99 | No | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 16 | RAM | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1314E+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 30μA | 1.1mm | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1314s2tr-datasheets-5549.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 4.4mm | Lead Free | 20 | 6 Weeks | 190.990737mg | 20 | yes | EAR99 | No | 8542.31.00.01 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 0.65mm | DS1314 | 20 | 3.6V | 3V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 30 | NO | Power Management Circuits | 3.3V | 140mA | SRAM | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||
| 4DB0226KA3AVG8 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/renesaselectronicsamericainc-4db0226ka3avg8-datasheets-5848.pdf | 53-TFBGA, FCCSPBGA | 12 Weeks | Dynamic RAM (DRAM) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM223GX060000-AC | Silicon Motion, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | 4 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CSA+T | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Lead Free | 8 | 6 Weeks | yes | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 8 | NOT SPECIFIED | 0.5mA | Not Qualified | R-PDSO-G8 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CWE+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 16-SOIC (0.295, 7.50mm Width) | 9.9mm | 3.9mm | Lead Free | 16 | 6 Weeks | yes | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 16 | NOT SPECIFIED | Not Qualified | R-PDSO-G16 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1312+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 4.572mm | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1312s2-datasheets-5592.pdf | 8-DIP (0.300, 7.62mm) | 9.375mm | 7.62mm | 8 | 6 Weeks | EAR99 | 8542.31.00.01 | 1 | NO | 4.75V~5.5V | DUAL | NOT SPECIFIED | 5V | 2.54mm | DS1312 | 5.5V | 4.5V | 1 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | NO | R-PDIP-T8 | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C68034-56LTXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB NX2LP-Flex™ | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 70°C | 0°C | ROHS3 Compliant | 2004 | /files/cypresssemiconductorcorp-cy7c6803456ltxc-datasheets-5782.pdf | 56-VFQFN Exposed Pad | 8.1mm | 950μm | 8.1mm | 3.3V | Lead Free | 11 Weeks | 3.6V | 3V | 56 | Gold, Tin | No | 3V~3.6V | CY7C68034 | 56-QFN-EP (8x8) | 480 Mbps | 12 | 8051 | 8b | Yes | 1 | NAND Flash - USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CSA | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | 1.75mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-mxd1210cd-datasheets-5701.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | no | unknown | e0 | TIN LEAD | YES | 4.75V~5.5V | DUAL | GULL WING | 245 | 5V | 1.27mm | 8 | NOT SPECIFIED | COMMERCIAL | R-PDSO-G8 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BQ2204ASN-N | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Integrated Circuit (IC) | Surface Mount | -40°C~85°C | Tube | 2 (1 Year) | CMOS | ROHS3 Compliant | /files/texasinstruments-bq2204asnn-datasheets-1127.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 1.75mm | 3.91mm | Lead Free | 16 | 6 Weeks | 16 | ACTIVE (Last Updated: 5 days ago) | yes | 1.58mm | EAR99 | Gold | No | 8542.39.00.01 | 1 | e4 | YES | 4.5V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | BQ2204 | 16 | 5.5V | 4.5V | 1 | NO | Power Management Circuits | 5V | 6mA | 5 | Nonvolatile SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| DS1211S+ | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tube | 1 (Unlimited) | 2.65mm | ROHS3 Compliant | /files/rochesterelectronicsllc-ds1211-datasheets-5726.pdf | 12.8mm | 7.5mm | 20 | yes | e3 | MATTE TIN | YES | DUAL | GULL WING | 260 | 5V | 1.27mm | 20 | COMMERCIAL | 70°C | NOT SPECIFIED | COMMERCIAL | R-PDSO-G20 | MICROPROCESSOR CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210ESA+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 230μA | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Lead Free | 8 | 6 Weeks | 506.605978mg | 8 | yes | EAR99 | No | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 8 | 0.5mA | RAM | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BU9348K | ROHM Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -25°C~75°C | Tray | 1 (Unlimited) | ROHS3 Compliant | 2003 | /files/rohmsemiconductor-bu9348k-datasheets-5740.pdf | 44-QFP | Lead Free | 44 | 10 Weeks | yes | EAR99 | 8542.39.00.01 | 2.7V~3.6V | QUAD | GULL WING | 0.8mm | BU9348 | 44 | Other Consumer ICs | 3V | 20mA | Not Qualified | S-PQFP-G44 | CONSUMER CIRCUIT | Dynamic RAM (DRAM) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1312 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 4.572mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds1312s2-datasheets-5670.pdf | 8-DIP (0.300, 7.62mm) | 9.375mm | 7.62mm | 8 | no | 1 | e0 | TIN LEAD | NO | 4.75V~5.5V | DUAL | 245 | 5V | 2.54mm | 8 | 5.5V | 4.5V | 1 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | NO | COMMERCIAL | R-PDIP-T8 | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1312S-2+T&R | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1312s2-datasheets-5592.pdf | 8-SOIC (0.154, 3.90mm Width) | Lead Free | 6 Weeks | 4.75V~5.5V | DS1312 | 8-SOIC | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP8422AVX-25 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 5.08mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-dp8422av25-datasheets-5674.pdf | 84-LCC (J-Lead) | 29.3116mm | 29.3116mm | 84 | no | unknown | e0 | TIN LEAD | YES | 4.5V~5.5V | QUAD | J BEND | NOT SPECIFIED | 5V | 1.27mm | 84 | NOT SPECIFIED | S-PQCC-J84 | MEMORY CONTROLLER, DRAM | NO | NO | 22 | Dynamic RAM (DRAM) | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM223TX020000-AD | Silicon Motion, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 4 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1212 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 5.08mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds1212-datasheets-5729.pdf | 28-DIP (0.600, 15.24mm) | 36.83mm | 15.24mm | 28 | no | 1 | e0 | TIN LEAD | NO | 4.75V~5.5V | DUAL | 245 | 5V | 2.54mm | 28 | 5.5V | 4.5V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | NOT SPECIFIED | NO | COMMERCIAL | R-PDIP-T28 | Nonvolatile RAM |
