Products
Manufacturer
RFQ
NEWS
ContactMemory Controllers(182)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Input Current | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | Thickness | Number of Ports | ECCN Code | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Supply Current-Max | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Number of I/O | Memory Type | Core Architecture | RAM Size | Data Bus Width | Quiescent Current | Threshold Voltage | uPs/uCs/Peripheral ICs Type | ESD Protection | Boundary Scan | Low Power Mode | Number of Transceivers | Address Bus Width | Memory IC Type | Host Interface Standard | Controller Type | Number of Banks |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MXD1210CPA | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | 4.572mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-mxd1210cd-datasheets-5701.pdf | 8-DIP (0.300, 7.62mm) | 9.375mm | 7.62mm | 8 | no | unknown | e0 | TIN LEAD | NO | 4.75V~5.5V | DUAL | 245 | 5V | 2.54mm | 8 | NOT SPECIFIED | COMMERCIAL | R-PDIP-T8 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CPA | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 4.572mm | Non-RoHS Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 8-DIP (0.300, 7.62mm) | 9.375mm | 7.62mm | Contains Lead | 8 | no | EAR99 | not_compliant | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | NO | 4.75V~5.5V | DUAL | 245 | 5V | 2.54mm | MXD1210 | 8 | NOT SPECIFIED | 0.5mA | Not Qualified | R-PDIP-T8 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| DS1213B | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 11.94mm | Non-RoHS Compliant | 2001 | /files/maximintegrated-ds1213b-datasheets-5897.pdf | 28-DIP (0.600, 15.24mm) | 35.56mm | 15.24mm | Contains Lead | 28 | EAR99 | not_compliant | 8473.30.11.80 | 1 | e0 | Tin/Lead (Sn/Pb) | NO | 4.75V~5.5V | DUAL | 240 | 2.54mm | DS1213 | 28 | NOT SPECIFIED | Not Qualified | R-PDIP-T28 | MEMORY CIRCUIT | Smartsocket SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||
| DP8422AVX-25 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 5.08mm | Non-RoHS Compliant | /files/texasinstruments-dp8421avx25-datasheets-5889.pdf | 84-LCC (J-Lead) | 29.3116mm | 29.3116mm | Contains Lead | 84 | unknown | e0 | Tin/Lead (Sn/Pb) | YES | 4.5V~5.5V | QUAD | J BEND | NOT SPECIFIED | 5V | 1.27mm | DP8422 | NOT SPECIFIED | Memory Controllers | 5V | 95mA | Not Qualified | S-PQCC-J84 | MEMORY CONTROLLER, DRAM | NO | NO | 22 | Dynamic RAM (DRAM) | 4 | |||||||||||||||||||||||||||||||||||||||||||||||
| DS1314E+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 30μA | 1.1mm | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1314s2tr-datasheets-5549.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 4.4mm | Lead Free | 20 | 6 Weeks | 190.990737mg | 20 | yes | EAR99 | No | 8542.31.00.01 | 1 | e3 | Matte Tin (Sn) | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | 0.65mm | DS1314 | 20 | 3.6V | 3V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 30 | NO | Power Management Circuits | 3.3V | 140mA | SRAM | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||
| 4DB0226KA3AVG8 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | /files/renesaselectronicsamericainc-4db0226ka3avg8-datasheets-5848.pdf | 53-TFBGA, FCCSPBGA | 12 Weeks | Dynamic RAM (DRAM) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SM223GX060000-AC | Silicon Motion, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | 4 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CSA+T | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Lead Free | 8 | 6 Weeks | yes | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 8 | NOT SPECIFIED | 0.5mA | Not Qualified | R-PDSO-G8 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CWE+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 16-SOIC (0.295, 7.50mm Width) | 9.9mm | 3.9mm | Lead Free | 16 | 6 Weeks | yes | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 16 | NOT SPECIFIED | Not Qualified | R-PDSO-G16 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||
| DS1312+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | 4.572mm | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1312s2-datasheets-5592.pdf | 8-DIP (0.300, 7.62mm) | 9.375mm | 7.62mm | 8 | 6 Weeks | EAR99 | 8542.31.00.01 | 1 | NO | 4.75V~5.5V | DUAL | NOT SPECIFIED | 5V | 2.54mm | DS1312 | 5.5V | 4.5V | 1 | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | NO | R-PDIP-T8 | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C68034-56LTXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB NX2LP-Flex™ | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 70°C | 0°C | ROHS3 Compliant | 2004 | /files/cypresssemiconductorcorp-cy7c6803456ltxc-datasheets-5782.pdf | 56-VFQFN Exposed Pad | 8.1mm | 950μm | 8.1mm | 3.3V | Lead Free | 11 Weeks | 3.6V | 3V | 56 | Gold, Tin | No | 3V~3.6V | CY7C68034 | 56-QFN-EP (8x8) | 480 Mbps | 12 | 8051 | 8b | Yes | 1 | NAND Flash - USB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CSA | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | 1.75mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-mxd1210cd-datasheets-5701.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | no | unknown | e0 | TIN LEAD | YES | 4.75V~5.5V | DUAL | GULL WING | 245 | 5V | 1.27mm | 8 | NOT SPECIFIED | COMMERCIAL | R-PDSO-G8 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210CWE | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | 1.75mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-mxd1210cd-datasheets-5701.pdf | 16-SOIC (0.295, 7.50mm Width) | 9.9mm | 3.9mm | 16 | no | unknown | e0 | TIN LEAD | YES | 4.75V~5.5V | DUAL | GULL WING | 245 | 5V | 1.27mm | 16 | NOT SPECIFIED | COMMERCIAL | R-PDSO-G16 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BQ2205LYPWG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -20°C~70°C | Tube | 1 (Unlimited) | CMOS | ROHS3 Compliant | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 500μA | 1.2mm | 4.4mm | Lead Free | 16 | 6 Weeks | 61.887009mg | 16 | ACTIVE (Last Updated: 4 days ago) | yes | 1mm | EAR99 | Gold | No | 8542.39.00.01 | 1 | e4 | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | BQ2205 | 16 | 3.6V | 3V | 1 | POWER SUPPLY SUPPORT CIRCUIT | NO | Power Management Circuits | 3.3V | 0.5mA | 210μA | 2.9V | Nonvolatile SRAM | |||||||||||||||||||||||||||||||||||||||
| MXD1210ESA+T | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | 230μA | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | Lead Free | 8 | 6 Weeks | 506.605978mg | 8 | yes | EAR99 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 8 | NOT SPECIFIED | 0.5mA | Not Qualified | RAM | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||
| BQ2205LYPWRG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -20°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | CMOS | ROHS3 Compliant | /files/texasinstruments-bq2205lypwrg4-datasheets-1157.pdf | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 500μA | 1.2mm | 4.4mm | Lead Free | 16 | 6 Weeks | 61.887009mg | 16 | ACTIVE (Last Updated: 6 days ago) | yes | 1mm | EAR99 | Gold | No | 8542.39.00.01 | 1 | 500μA | e4 | YES | 3V~3.6V | DUAL | GULL WING | 260 | 3.3V | BQ2205 | 16 | 3.6V | 3V | 1 | POWER SUPPLY SUPPORT CIRCUIT | NO | Power Management Circuits | 3.3V | 0.5mA | 210μA | 2.9V | Nonvolatile SRAM | |||||||||||||||||||||||||||||||||||||
| DS1314E+T&R | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1314s2tr-datasheets-5549.pdf | 20-TSSOP (0.173, 4.40mm Width) | Lead Free | 6 Weeks | 3V~3.6V | DS1314 | 20-TSSOP | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DP8421ATVX-25 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 5.08mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-dp8422av25-datasheets-5674.pdf | 68-LCC (J-Lead) | 24.2316mm | 24.2316mm | 68 | no | unknown | e0 | TIN LEAD | YES | 4.5V~5.5V | QUAD | J BEND | NOT SPECIFIED | 5V | 1.27mm | 68 | NOT SPECIFIED | S-PQCC-J68 | MEMORY CONTROLLER, DRAM | NO | NO | 20 | Dynamic RAM (DRAM) | 4 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1321E+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1321-datasheets-5559.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 4.4mm | Lead Free | 20 | 6 Weeks | yes | EAR99 | 8542.31.00.01 | 1 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 0.65mm | DS1321 | 20 | 5.5V | 4.5V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 30 | NO | Power Management Circuits | 5V | 1.5mA | Not Qualified | R-PDSO-G20 | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||
| CY7C68034-56LTXI | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB NX2LP-Flex™ | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | CMOS | 43mA | ROHS3 Compliant | 2004 | /files/cypresssemiconductorcorp-cy7c6803356ltxc-datasheets-5690.pdf | 56-VFQFN Exposed Pad | 3.3V | Lead Free | 56 | 10 Weeks | 56 | I2C | 8 | 3A991.A.3 | e4 | NICKEL PALLADIUM GOLD | YES | 3V~3.6V | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | CY7C68034 | 20 | Bus Controllers | Not Qualified | 480 Mbps | 12 | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | NAND Flash - USB | |||||||||||||||||||||||||||||||||||||||||||||||
| MXD1210EWE+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 230μA | 1.75mm | ROHS3 Compliant | 2006 | /files/maximintegrated-mxd1210cpa-datasheets-5514.pdf | 16-SOIC (0.295, 7.50mm Width) | 9.9mm | 3.9mm | Lead Free | 16 | 6 Weeks | 200.686274mg | 16 | yes | EAR99 | No | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | 4.75V~5.5V | DUAL | GULL WING | 260 | 5V | 1.27mm | MXD1210 | 16 | RAM | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||
| DS1321S+T&R | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2012 | /files/maximintegrated-ds1321-datasheets-5559.pdf | 16-SOIC (0.154, 3.90mm Width) | Lead Free | 6 Weeks | 4.75V~5.5V | DS1321 | 16-SOIC | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BQ2202SN | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 3 (168 Hours) | Non-RoHS Compliant | /files/rochesterelectronicsllc-bq2202sn-datasheets-5721.pdf | 16-SOIC (0.154, 3.90mm Width) | 16 | no | 1 | e0 | TIN LEAD | YES | 4.5V~5.5V | DUAL | GULL WING | NOT SPECIFIED | 5V | 5.5V | 4.5V | POWER SUPPLY SUPPORT CIRCUIT | NOT SPECIFIED | COMMERCIAL | R-PDSO-G16 | Nonvolatile SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1211+ | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | 4.572mm | ROHS3 Compliant | /files/rochesterelectronicsllc-ds1211-datasheets-5726.pdf | 20-DIP (0.300, 7.62mm) | 26.16mm | 7.62mm | 20 | yes | e3 | MATTE TIN | NO | 4.75V~5.5V | DUAL | 260 | 5V | 2.54mm | 20 | NOT SPECIFIED | COMMERCIAL | R-PDIP-T20 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C68034-56LFXC | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB NX2LP-Flex™ | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | 1mm | ROHS3 Compliant | /files/rochesterelectronicsllc-cy7c6803356lfxc-datasheets-5702.pdf | 56-VFQFN Exposed Pad | 8mm | 8mm | 56 | yes | unknown | e3 | TIN | YES | 3V~3.6V | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 56 | 20 | COMMERCIAL | S-XQCC-N56 | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | USB | NAND Flash - USB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1211S | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | 2.65mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds1211-datasheets-5726.pdf | 20-SOIC (0.295, 7.50mm Width) | 12.8mm | 7.5mm | 20 | no | e0 | TIN LEAD | YES | 4.75V~5.5V | DUAL | GULL WING | 245 | 5V | 1.27mm | 20 | NOT SPECIFIED | COMMERCIAL | R-PDSO-G20 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1211 | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | 4.572mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds1211-datasheets-5726.pdf | 20-DIP (0.300, 7.62mm) | 26.16mm | 7.62mm | 20 | no | e0 | TIN LEAD | NO | 4.75V~5.5V | DUAL | 240 | 5V | 2.54mm | 20 | 20 | COMMERCIAL | R-PDIP-T20 | MICROPROCESSOR CIRCUIT | Nonvolatile RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C68023-56LTXC | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | EZ-USB NX2LP™ | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2004 | /files/cypresssemiconductorcorp-cy7c6802356ltxc-datasheets-5765.pdf | 56-VFQFN Exposed Pad | 8.1mm | 950μm | 8.1mm | 3.3V | Lead Free | 56 | 10 Weeks | 56 | yes | Gold, Tin | No | e3 | Matte Tin (Sn) | YES | 3V~3.6V | QUAD | 260 | 3.3V | 0.5mm | CY7C68023 | 56 | 1 | 30 | Bus Controllers | 12 Mbps | 8 | 16kB | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | Yes | USB | NAND Flash - USB | ||||||||||||||||||||||||||||||||||||||||||
| BQ2201PN | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 3 (168 Hours) | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | 4.5V~5.5V | 8-PDIP | Nonvolatile SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1314E | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | Non-RoHS Compliant | /files/rochesterelectronicsllc-ds1314s2-datasheets-5685.pdf | 20-TSSOP (0.173, 4.40mm Width) | 6.5mm | 4.4mm | 20 | no | 1 | e0 | TIN LEAD | YES | 3V~3.6V | DUAL | GULL WING | 240 | 3.3V | 0.65mm | 20 | 3.6V | 3V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 20 | NO | COMMERCIAL | R-PDSO-G20 | Nonvolatile RAM |
