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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Page Size | I/O Type | Standby Voltage-Min |
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| 71V416S15YGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s15ygi8-datasheets-1148.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 2.9mm | 1 | No | 1 | 170mA | e3 | MATTE TIN | DUAL | J BEND | 260 | 3.3V | 44 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||
| 70V24L35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24l35j-datasheets-1127.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX16 | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||
| IDT71P72604S200BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 200MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72604s200bqg8-datasheets-1091.pdf | 165 | Parallel | QDR, RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7007L15J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007l15j8-datasheets-1087.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | SEMAPHORE; AUTOMATIC POWER DOWN | No | 1 | 285mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 15b | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 7028L15PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7028l15pfg-datasheets-1055.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 1 Mb | yes | 1.4mm | 2 | No | 1 | 340mA | e3 | MATTE TIN | QUAD | GULL WING | 260 | 5V | 0.5mm | 100 | COMMERCIAL | 30 | 128kB | RAM, SDR, SRAM | 15 ns | 32b | 64KX16 | 16b | Asynchronous | ||||||||||||||||||||||||||||||
| 71V432S6PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 83MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v432s6pfgi-datasheets-1024.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 1 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 83MHz | 3-STATE | 6 ns | 15b | 32KX32 | 32b | Synchronous | COMMON | ||||||||||||||||||||||||||
| IDT70T631S12DDI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 4 (72 Hours) | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70t631s12ddi-datasheets-1014.pdf | TQFP | 20mm | 20mm | 144 | Parallel | 2 | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 144 | INDUSTRIAL | 2.6V | 2.4V | 30 | SRAMs | 2.52.5/3.3V | 0.395mA | Not Qualified | S-PQFP-G144 | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.02A | 12 ns | COMMON | 2.4V | ||||||||||||||||||||||||||||||
| IDT71V432S7PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 66MHz | Non-RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v432s7pfi-datasheets-1007.pdf | TQFP | 20mm | 3.3V | 100 | 3.63V | 3.135V | 100 | Parallel | 1 Mb | 1 | not_compliant | 1 | 160mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 7 ns | 15b | 32KX32 | 32 | 32b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||||
| W25M512JVFIQ | Winbond Electronics Corporation | $11.86 |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 85°C | -40°C | CMOS | 104MHz | SYNCHRONOUS | 2.64mm | RoHS Compliant | SOIC | 10.31mm | 7.49mm | 3V | 16 | 3.6V | 2.7V | 16 | SPI, Serial | 512 Mb | yes | 1 | DUAL | GULL WING | NOT SPECIFIED | 1.27mm | INDUSTRIAL | NOT SPECIFIED | FLASH, NOR | 3V | 64MX8 | 8 | 1 | 256B | |||||||||||||||||||||||||||||||||||||||||||
| 7164S20YGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s20ygi-datasheets-0953.pdf | 17.9mm | 7.6mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 64 kb | yes | 2.67mm | 1 | EAR99 | No | 1 | 110mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | INDUSTRIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 13b | 8KX8 | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 71V416S15BEGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s15begi8-datasheets-0941.pdf | TFBGA | 9mm | 9mm | 3.3V | Lead Free | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | yes | 1.2mm | 1 | No | 1 | 170mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||
| 70V7339S133BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7339s133bf-datasheets-0940.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 645mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 25 ns | 19b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| IDT70T631S12DD | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 4 (72 Hours) | 70°C | 0°C | CMOS | ASYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70t631s12dd-datasheets-0907.pdf | TQFP | 20mm | 20mm | 144 | Parallel | 2 | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 144 | COMMERCIAL | 2.6V | 2.4V | 30 | SRAMs | 2.52.5/3.3V | 0.355mA | Not Qualified | S-PQFP-G144 | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.01A | 12 ns | COMMON | 2.4V | ||||||||||||||||||||||||||||||
| 70V659S12BFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v659s12bfgi8-datasheets-0898.pdf | 15mm | 15mm | 3.3V | Lead Free | 208 | 7 Weeks | 208 | Parallel | 4.5 Mb | yes | 1.4mm | 2 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 208 | INDUSTRIAL | 3.45V | 3.15V | 30 | SRAMs | 0.515mA | RAM, SRAM | 3-STATE | 34b | 0.015A | COMMON | 3.15V | ||||||||||||||||||||||||||||||||
| IDT71V65703S75PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65703s75pf8-datasheets-0889.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.275mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 256KX36 | 36 | 9437184 bit | 0.04A | 7.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| 7164S55DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s55db-datasheets-0878.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 28 | 10 Weeks | 5.5V | 4.5V | 28 | Parallel | 64 kb | no | 1.65mm | 1 | No | 1 | e0 | Tin/Lead (Sn63Pb37) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | 8kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 55 ns | 13b | 8KX8 | 0.02A | COMMON | |||||||||||||||||||||||||||||
| 71V416S15BEGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s15begi-datasheets-0854.pdf | TFBGA | 9mm | 9mm | 3.3V | Lead Free | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | yes | 1.2mm | 1 | No | 1 | 170mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| 7025L25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025l25j-datasheets-0822.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 26b | 8KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||
| 71V416L15YGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | /files/integrateddevicetechnology-71v416l15ygi8-datasheets-0810.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 2.9mm | 1 | No | 1 | 160mA | e3 | MATTE TIN | DUAL | J BEND | 260 | 3.3V | 44 | INDUSTRIAL | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||||
| IDT71V65603S100PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65603s100pf8-datasheets-0809.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.25mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.04A | 5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| 7133LA90GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133la90gb-datasheets-0799.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 10 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.68mm | 2 | No | 1 | 280mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | MILITARY | 20 | SRAMs | 5V | MIL-PRF-38535 | RAM, SRAM | 3-STATE | 90 ns | 22b | 0.004A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||
| 7027S35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7027s35pf8-datasheets-0794.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 295mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 30b | 0.005A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 7027L35G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7027l35g-datasheets-0757.pdf | 30.48mm | 30.48mm | 5V | Contains Lead | 108 | 7 Weeks | 5.5V | 4.5V | 108 | Parallel | 512 kb | no | 3.68mm | 2 | EAR99 | No | 1 | 255mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 108 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 15b | 0.015A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 70T3519S166BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3519s166bf8-datasheets-0751.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.6 ns | 36b | 0.015A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 71V3579S65PFG | Integrated Device Technology (IDT) | $9.08 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 3 (168 Hours) | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3579s65pfg-datasheets-0740.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | e3 | Matte Tin (Sn) | 260 | 100 | 512kB | RAM, SDR, SRAM | 133MHz | 6.5 ns | 18b | ||||||||||||||||||||||||||||||||||||||||||
| 7133SA25PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133sa25pf-datasheets-0729.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 32 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||
| IDT71V25761S200PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761s200pf-datasheets-0707.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.36mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.03A | 3.1 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
| 71V25761S166PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v25761s166pfg-datasheets-0703.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 7134SA70CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa70cb-datasheets-0686.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 32 kb | no | 3.3mm | 2 | AUTOMATIC POWER-DOWN | No | 1 | 270mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 48 | MILITARY | SRAMs | 5V | 38535Q/M;38534H;883B | RAM, SRAM | 3-STATE | 70 ns | 24b | 4KX8 | 0.03A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 7142SA55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142sa55j-datasheets-0655.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 155mA | 2kB | RAM, SDR, SRAM | 55 ns | 22b | 8b | Asynchronous |
