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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V416L12BEI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416l12bei-datasheets-9604.pdf | TFBGA | 9mm | 9mm | 3.3V | Contains Lead | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | no | 1.2mm | 1 | No | 1 | 170mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 48 | INDUSTRIAL | 512kB | RAM, SDR, SRAM - Asynchronous | 12 ns | 18b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||
| IDT71124S20Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71124s20y-datasheets-9767.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 1 | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.14mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 20 ns | COMMON | 4.5V | YES | |||||||||||||||||||||||||||||||
| 71321LA35TF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la35tf-datasheets-9429.pdf | LQFP | 10mm | 10mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| 70V9089S12PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9089s12pf8-datasheets-9401.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 25 ns | 32b | 64KX8 | 0.005A | 8b | Synchronous | COMMON | 3V | |||||||||||||||||||||||
| 71T75802S150BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s150bgi8-datasheets-9250.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 235mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 3.8 ns | 20b | 0.045A | 18b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||||||
| 70T3799MS166BBG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3799ms166bbg-datasheets-9170.pdf | BGA | 19mm | 19mm | 2.5V | Lead Free | 324 | 14 Weeks | 324 | Parallel | 9 Mb | yes | 1.76mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | 324 | COMMERCIAL | 30 | SRAMs | 0.9mA | RAM, SRAM | 3-STATE | 34b | COMMON | |||||||||||||||||||||||||||||||||
| 7164S20DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s20db-datasheets-9121.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 28 | 28 | Parallel | 64 kb | no | 1.65mm | 1 | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | RAM, SRAM - Asynchronous | 3-STATE | 13b | 8KX8 | 0.02A | COMMON | |||||||||||||||||||||||||||||||||
| 70T3799MS133BBGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3799ms133bbgi-datasheets-8942.pdf | BGA | 19mm | 19mm | 2.5V | Lead Free | 324 | 14 Weeks | 2.6V | 2.4V | 324 | Parallel | 9 Mb | yes | 1.76mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 900mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 1mm | 324 | INDUSTRIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 17b | 72b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 7025L55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025l55pf-datasheets-8940.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 26b | 8KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 71342LA55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71342la55pf8-datasheets-8883.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 32 kb | no | 1.4mm | 2 | EAR99 | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 70T3719MS166BBG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3719ms166bbg-datasheets-8640.pdf | BGA | 19mm | 19mm | 2.5V | Lead Free | 324 | 14 Weeks | 2.6V | 2.4V | 324 | Parallel | 18 Mb | yes | 1.76mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 900mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 1mm | 324 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.6 ns | 36b | 72b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71V124SA20Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 70°C | 0°C | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa20y8-datasheets-9416.pdf | 3.3V | 3.6V | 3V | 32 | Parallel | 1 Mb | 1 | 95mA | RAM, SRAM - Asynchronous | 20 ns | 17b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71342SA35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71342sa35j-datasheets-8572.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 7134SA55JG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa55jg-datasheets-8557.pdf | PLCC | 19mm | 19mm | 5V | Lead Free | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | yes | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 240mA | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 70T3719MS133BBG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3719ms133bbg-datasheets-8426.pdf | BGA | 19mm | 19mm | 2.5V | Lead Free | 324 | 14 Weeks | 2.6V | 2.4V | 324 | Parallel | 18 Mb | yes | 1.76mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 740mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 1mm | 324 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 36b | 72b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71V67603ZS133PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 133MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67603zs133pf8-datasheets-9331.pdf | LQFP | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S71VS064RB0AHT4L0 | Cypress Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -25°C | CMOS | 108MHz | RoHS Compliant | 52 | 52 | Parallel | 8542.32.00.71 | YES | 1.8V | OTHER | Other Memory ICs | 1.8V | Not Qualified | FLASH, NOR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7026L55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7026l55j-datasheets-8326.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | No | 230mA | 84 | 32kB | RAM, SDR, SRAM | 55 ns | 14b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||
| X28HC256JIZ-15 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/intersil-x28hc256jiz15-datasheets-8313.pdf | PLCC | 5V | 32 | Parallel | 256 kb | No | 150 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V35761S183PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 183MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v35761s183pfi8-datasheets-9290.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.35mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.035A | 3.3 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 709079S12PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709079s12pf-datasheets-8263.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 345mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | FLAT | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 30b | 0.015A | 8b | Synchronous | COMMON | ||||||||||||||||||||||
| 7132SA35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132sa35j8-datasheets-8242.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 165mA | 2kB | RAM, SDR, SRAM | 35 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 70T3539MS133BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3539ms133bci-datasheets-8232.pdf | 17mm | 17mm | 2.5V | Contains Lead | 900mA | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 18 Mb | 1.4mm | 2 | No | 900mA | 2.3MB | RAM, SDR, SRAM | 133MHz | 4.2 ns | 38b | 36b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3579S85PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579s85pf8-datasheets-9186.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 87MHz | 256KX18 | 18 | 4718592 bit | 0.03A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
| 7016L25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7016l25j-datasheets-8000.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 144 kb | no | 3.63mm | 2 | EAR99 | SEMAPHORE; INTERRUPT FLAG; AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 18kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 14b | 16KX9 | 0.005A | 9b | Asynchronous | COMMON | |||||||||||||||||||||||||
| IDT709199L9PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt709199l9pfi8-datasheets-9181.pdf | LQFP | 14mm | 14mm | 100 | Parallel | 2 | 3A991.B.2.A | FLOW-THROUGH OR PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | INDUSTRIAL | 5.5V | 4.5V | 20 | SRAMs | 5V | 0.43mA | Not Qualified | S-PQFP-G100 | RAM, SRAM | 3-STATE | 66MHz | 128KX9 | 9 | 1179648 bit | 0.003A | 20 ns | COMMON | 4.5V | ||||||||||||||||||||||||||
| 71V432S5PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v432s5pfgi-datasheets-7989.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 1 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.2mA | 128kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 5 ns | 15b | 32KX32 | COMMON | |||||||||||||||||||||||||||||
| IDT71V67603ZS133PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | 133MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67603zs133pf-datasheets-9174.pdf | LQFP | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V65703S75BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65703s75bgg8-datasheets-7846.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | yes | 2.15mm | 1 | FLOW-THROUGH | No | 1 | 275mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | 1.1MB | RAM, SDR, SRAM | 7.5 ns | 18b | 256KX36 | 36b | Synchronous | |||||||||||||||||||||||||||||
| 70V3399S166PRF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3399s166prf8-datasheets-7766.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 16 Weeks | 3.45V | 3.15V | 128 | Parallel | 2.3 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 500mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 17b | 0.03A | 18b | Synchronous | COMMON |
