Products
Manufacturer
RFQ
NEWS
ContactMemory(55331)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 70V35L20PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v35l20pfi-datasheets-2388.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 195mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX18 | 0.005A | 18b | Asynchronous | COMMON | 3V | |||||||||||||||||||||
| IDT71V256SA10YGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v256sa10ygi8-datasheets-2326.pdf | 17.9324mm | 7.5184mm | 28 | 28 | Parallel | EAR99 | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 3.3V | 1.27mm | 28 | INDUSTRIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.1mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 32KX8 | 8 | 262144 bit | 0.002A | 10 ns | COMMON | 3V | ||||||||||||||||||||||||||||
| 70T3319S133BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3319s133bf8-datasheets-2319.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 18b | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 709369L9PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | 66.6MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709369l9pf8-datasheets-2313.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 288 kb | 1.4mm | 2 | No | 400mA | RAM, SRAM | 20 ns | 28b | 18b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||
| 7006L25FB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006l25fb-datasheets-2307.pdf | 24mm | 24mm | 5V | Contains Lead | 5.5V | 4.5V | 68 | Parallel | 128 kb | 2mm | 2 | No | 280mA | 16kB | RAM, SDR, SRAM | 25 ns | 14b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT71V256SA10YGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v256sa10ygi-datasheets-2223.pdf | 3.3V | 28 | 3.6V | 3V | 28 | Parallel | 256 kb | 1 | EAR99 | unknown | 1 | 100mA | e0 | TIN LEAD | DUAL | J BEND | NOT SPECIFIED | 3.3V | 28 | INDUSTRIAL | NOT SPECIFIED | Not Qualified | RAM, SRAM - Asynchronous | 10 ns | 15b | 32KX8 | 8 | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||
| 70261S55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70261s55pf8-datasheets-2209.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 270mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 28b | 16KX16 | 0.015A | 16b | Asynchronous | COMMON | ||||||||||||||||||||
| 709369L9PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 40MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709369l9pf-datasheets-2206.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 288 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 400mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | RAM, SRAM | 3-STATE | 20 ns | 28b | 16KX18 | 0.003A | 18b | Synchronous | COMMON | ||||||||||||||||||||||
| 70V659S10BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v659s10bcg-datasheets-2174.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4.5 Mb | yes | 1.4mm | 2 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | COMMERCIAL | 30 | SRAMs | 0.5mA | 512kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 34b | 0.015A | COMMON | ||||||||||||||||||||||||||
| 70V05S55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v05s55j-datasheets-2162.pdf | PLCC | 24mm | 24mm | 3.3V | Contains Lead | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 180mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 26b | 8KX8 | 0.005A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||
| IDT71256SA25Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | CMOS | 3.556mm | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71256sa25y8-datasheets-2141.pdf | 17.9324mm | 7.5184mm | 28 | 28 | Parallel | 1 | EAR99 | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 28 | COMMERCIAL | 5.5V | 4.5V | 30 | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 32KX8 | 8 | 262144 bit | 25 ns | YES | ||||||||||||||||||||||||||||||||||
| 709159L7PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 45.45MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709159l7pf-datasheets-2139.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 5.5V | 4.5V | 100 | Parallel | 72 kb | 1.4mm | 2 | No | 400mA | 9kB | RAM, SDR, SRAM | 7 ns | 26b | 9b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 70T653MS15BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t653ms15bc-datasheets-2128.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 18 Mb | no | 1.4mm | 2 | No | 1 | 600mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 38b | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 709369L7PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | 45.45MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709369l7pf8-datasheets-2125.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 288 kb | 1.4mm | 2 | No | 465mA | RAM, SRAM | 18 ns | 14b | 18b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||
| 71V65903S80BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65903s80bgi8-datasheets-2065.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 3.465V | SRAMs | 0.06mA | RAM, SRAM | 3-STATE | 95MHz | 19b | 0.06A | 8 ns | COMMON | |||||||||||||||||||||||||||
| 71V416S10BEG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s10beg8-datasheets-2064.pdf | TFBGA | 9mm | 9mm | 3.3V | Lead Free | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | yes | 1.2mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | INDUSTRIAL | SRAMs | 0.2mA | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 18b | 0.02A | COMMON | 3V | |||||||||||||||||||||||||||
| IDT71V2546S150PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2546s150pf8-datasheets-2053.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.325mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.04A | 3.8 ns | COMMON | 3.14V | ||||||||||||||||||||||||
| IDT71V65603S150PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65603s150pfi-datasheets-2048.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.345mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.06A | 3.8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 709369L7PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 45.45MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709369l7pf-datasheets-2040.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 288 kb | 1.4mm | 2 | No | 465mA | RAM, SRAM | 18 ns | 28b | 18b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 70V9269L9PRF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 40MHz | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9269l9prf8-datasheets-2009.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 225mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | 32kB | RAM, SDR, SRAM | 3-STATE | 9 ns | 14b | 16KX16 | 0.003A | 16b | Synchronous | COMMON | 3V | ||||||||||||||||||||
| 71V416YS10PHG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416ys10phg-datasheets-2012.pdf | TSOP | 3.3V | 44 | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 1 | No | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | COMMERCIAL | 30 | SRAMs | RAM, SRAM - Asynchronous | 3-STATE | 10 ns | 18b | 16 | 0.02A | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||
| IDT71V256SA10PZGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | CMOS | 1.2mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v256sa10pzgi-datasheets-2008.pdf | TSSOP | 11.8mm | 8mm | 28 | Parallel | EAR99 | unknown | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.55mm | 28 | INDUSTRIAL | 3.6V | 3V | NOT SPECIFIED | Not Qualified | R-PDSO-G28 | RAM, SRAM - Asynchronous | 32KX8 | 8 | 262144 bit | 10 ns | ||||||||||||||||||||||||||||||||||||
| 71V65903S80BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 95MHz | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65903s80bg-datasheets-1979.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 250mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 8 ns | 19b | 0.04A | 18b | Synchronous | COMMON | |||||||||||||||||||||||
| 70V3379S5BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s5bf8-datasheets-1975.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | 72kB | RAM, SDR, SRAM | 3-STATE | 5 ns | 30b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| IDT71V124SA12Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa12y8-datasheets-1968.pdf | 20.955mm | 10.16mm | 32 | 32 | Parallel | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.13mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 3V | |||||||||||||||||||||||||||||
| 7140SA55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140sa55j8-datasheets-1958.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 10b | 1KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 70V657S12DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v657s12dr-datasheets-1943.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 1.1 Mb | no | 3.5mm | 2 | No | 1 | 465mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | COMMERCIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 30b | 0.015A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||
| IDT71V3556S150BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 150MHz | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s150bq8-datasheets-1929.pdf | 165 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7007L25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007l25j8-datasheets-1924.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 265mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 15b | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 70V06L15JG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06l15jg-datasheets-1876.pdf | PLCC | 24mm | 24mm | 3.3V | Lead Free | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 128 kb | yes | 3.63mm | 2 | EAR99 | No | 1 | 185mA | e3 | MATTE TIN | QUAD | J BEND | 260 | 3.3V | 68 | COMMERCIAL | RAM, SRAM | 15 ns | 28b | 16KX8 | 8b | Asynchronous |
