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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Number of Pins | Pbfree Code | ECCN Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Memory Type | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Standby Current-Max | Access Time (Max) | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IS62WV1288DALL-55BLI | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | SRAM - Asynchronous | 1.2mm | ROHS3 Compliant | 36-TFBGA | 8mm | 6mm | 36 | yes | EAR99 | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | YES | 1.65V~2.2V | BOTTOM | 260 | 1.8V | 0.75mm | 36 | 2.2V | 1.65V | 40 | 1.8/2V | 0.007mA | Not Qualified | R-PBGA-B36 | 1Mb 128K x 8 | Volatile | 3-STATE | SRAM | Parallel | 128KX8 | 8 | 55ns | 1048576 bit | 0.000004A | 55 ns | COMMON | 1.2V | ||||||||||||||||||
| R1RP0416DSB-2PI#D1 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | 18.41mm | 10.16mm | 44 | 8 Weeks | yes | 1 | YES | 4.5V~5.5V | DUAL | 5V | 0.8mm | 44 | 5.5V | 4.5V | R-PDSO-G44 | 4Mb 256K x 16 | Volatile | SRAM | Parallel | 256KX16 | 16 | 12ns | 4194304 bit | 12 ns | |||||||||||||||||||||||||||||
| W25Q32FVTCJF | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvzejqtr-datasheets-8915.pdf | 24-TBGA | 2.7V~3.6V | 32Mb 4M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||
| GD25VE20CEIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/gigadevicesemiconductorhklimited-gd25ve20csigr-datasheets-3924.pdf | 8-XFDFN Exposed Pad | 2.1V~3.6V | 2Mb 256K x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVTCJQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvzejqtr-datasheets-8915.pdf | 24-TBGA | 2.7V~3.6V | 32Mb 4M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||
| R1RP0416DSB-2PR#B0 | Renesas Electronics America |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/renesaselectronicsamerica-r1rp0416dsb2prb0-datasheets-9266.pdf | 44-TSOP (0.400, 10.16mm Width) | 4.5V~5.5V | 4Mb 256K x 16 | Volatile | SRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||
| P770040BFWC070 XF | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| QMP29GL512R10TFIR10H | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVSSJF | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvzejqtr-datasheets-8915.pdf | 8-SOIC (0.209, 5.30mm Width) | 2.7V~3.6V | 32Mb 4M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||
| AK6512CL | AKM Semiconductor Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | EEPROM | https://pdf.utmel.com/r/datasheets/akmsemiconductorinc-ak6512cl-datasheets-9171.pdf | 8-SMD, Flat Lead | 1.8V~5.5V | 8-WSON | 64Kb 8K x 8 | Non-Volatile | 5MHz | EEPROM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64CVSSJG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.16mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64cvssjgtr-datasheets-8932.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | 5.23mm | 8 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | S-PDSO-G8 | AEC-Q100 | 64Mb 8M x 8 | Non-Volatile | 2.7V | 80MHz | FLASH | SPI - Quad I/O | 8MX8 | 8 | 50μs, 3ms | 67108864 bit | SERIAL | |||||||||||||||||||||||||||
| W25Q64FVSFJQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64fvssig-datasheets-5384.pdf | 16-SOIC (0.295, 7.50mm Width) | 2.7V~3.6V | 64Mb 8M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64FVTCJQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64fvssig-datasheets-5384.pdf | 24-TBGA | 2.7V~3.6V | 64Mb 8M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||
| MX25L3273EPI-10G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MXSMIO™ | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | FLASH - NOR | 8-DIP (0.300, 7.62mm) | 2.7V~3.6V | 8-PDIP | 32Mb 8M x 4 | Non-Volatile | 104MHz | FLASH | SPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64CVZPJG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64cvssjgtr-datasheets-8932.pdf | 8-WDFN Exposed Pad | 6mm | 5mm | 8 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | R-PDSO-N8 | AEC-Q100 | 64Mb 8M x 8 | Non-Volatile | 2.7V | 80MHz | FLASH | SPI - Quad I/O | 8MX8 | 8 | 50μs, 3ms | 67108864 bit | SERIAL | |||||||||||||||||||||||||||
| DS28CN01U-W0D+1T-C | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Bulk | 1 (Unlimited) | EEPROM | ROHS3 Compliant | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 1.62V~5.5V | 8-uMAX | 1Kb 128 x 8 | Non-Volatile | 400kHz | EEPROM | I2C | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||
| DS2502R+00B | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Bulk | 1 (Unlimited) | 85°C | -40°C | EPROM - OTP | ROHS3 Compliant | 2015 | TO-236-3, SC-59, SOT-23-3 | 3 | 2.8V~6V | DS2502 | SOT-23-3 | 1Kb 128 x 8 | Non-Volatile | EPROM | 1-Wire® | ||||||||||||||||||||||||||||||||||||||||||||
| FT24C04A-KTG-B | Fremont Micro Devices Ltd |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 1.8V~5.5V | 4Kb 512 x 8 | Non-Volatile | 550ns | 1MHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64FVXGJQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64fvssig-datasheets-5384.pdf | 8-XDFN Exposed Pad | 2.7V~3.6V | 64Mb 8M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||
| IS65WV1288FBLL-45TLA3-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | 32-TFSOP (0.724, 18.40mm Width) | 2.2V~3.6V | 1Mb 128K x 8 | Volatile | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||
| AK6417CH | AKM Semiconductor Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 1 (Unlimited) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2502R-00C+T&R | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | 85°C | -40°C | EPROM - OTP | ROHS3 Compliant | 2015 | TO-236-3, SC-59, SOT-23-3 | 3 | 2.8V~6V | DS2502 | SOT-23-3 | 1Kb 128 x 8 | Non-Volatile | EPROM | 1-Wire® | ||||||||||||||||||||||||||||||||||||||||||||
| IS65WV1288FBLL-45TLA3 | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | SRAM - Asynchronous | ROHS3 Compliant | 32-TFSOP (0.724, 18.40mm Width) | 2.2V~3.6V | 1Mb 128K x 8 | Volatile | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16CVSSJP | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.16mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16cvssig-datasheets-5341.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | 5.23mm | 8 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | S-PDSO-G8 | AEC-Q100 | 16Mb 2M x 8 | Non-Volatile | 2.7V | 104MHz | FLASH | SPI - Quad I/O | 2MX8 | 8 | 50μs, 3ms | 16777216 bit | SERIAL | |||||||||||||||||||||||||||
| W25Q64FVTBJQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64fvssig-datasheets-5384.pdf | 24-TBGA | 2.7V~3.6V | 64Mb 8M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||
| FT24C04A-KSG-B | Fremont Micro Devices Ltd |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 1.8V~5.5V | 4Kb 512 x 8 | Non-Volatile | 550ns | 1MHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||
| FT24C04A-KMR-T | Fremont Micro Devices Ltd |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 1.8V~5.5V | 4Kb 512 x 8 | Non-Volatile | 550ns | 1MHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||
| AK6508CU | AKM Semiconductor Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | EEPROM | 8-UFDFN Exposed Pad | 1.6V~5.5V | 8-USON | 16Kb 2K x 8 | Non-Volatile | 10MHz | EEPROM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||
| FT24C04A-KTR-B | Fremont Micro Devices Ltd |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 1.8V~5.5V | 4Kb 512 x 8 | Non-Volatile | 550ns | 1MHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64FVZPJQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64fvssig-datasheets-5384.pdf | 8-WDFN Exposed Pad | 2.7V~3.6V | 64Mb 8M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms |
