Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Access Mode | Output Enable |
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71V67803S166BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67803s166bg8-datasheets-7603.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 340mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 3.5 ns | 19b | 0.05A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
IDT71V416S12YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s12yi-datasheets-7601.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | INDUSTRIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.18mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | |||||||||||||||||||||||||||||||
IDT71V2556S133BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2556s133bg-datasheets-7586.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||
6116LA20TPG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116la20tpg-datasheets-7547.pdf | PDIP | 31.75mm | 7.62mm | 5V | Lead Free | 24 | 7 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | yes | 3.3mm | 1 | EAR99 | No | 1 | 95mA | e3 | MATTE TIN | DUAL | 260 | 5V | 2.54mm | 24 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 11b | 2KX8 | 0.00003A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||
IDT71V416S12PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s12ph-datasheets-7544.pdf | TSOP | 3.3V | 44 | 3.6V | 3V | 44 | Parallel | 4 Mb | no | 1 | 1 | 180mA | e0 | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 20 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 12 ns | 18b | 16 | 0.02A | 16b | Asynchronous | COMMON | 3V | YES | |||||||||||||||||||||||||||||||||
IDT71V2556S100PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2556s100pfi8-datasheets-7499.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.25mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
71321SA55JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa55ji-datasheets-7488.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 190mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.03A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||
W97AH2KBQX2I | Winbond Electronics Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | CMOS | 400MHz | SYNCHRONOUS | 0.8mm | RoHS Compliant | 12mm | 12mm | 168 | 168 | Parallel | 1 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 1 | YES | BOTTOM | BALL | 1.2V | 0.5mm | INDUSTRIAL | 1.3V | 1.14V | RAM, SDRAM | 32MX32 | 32 | 1073741824 bit | MULTI BANK PAGE BURST | |||||||||||||||||||||||||||||||||||||||||||||||
7130LA100P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la100p-datasheets-7465.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 8 kb | no | 3.8mm | 2 | EAR99 | No | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | DUAL | 245 | 5V | 48 | COMMERCIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 100 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||
70V7319S200BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7319s200bc-datasheets-7455.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 950mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 18b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
71V65803S133BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65803s133bqg8-datasheets-7453.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | yes | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 30 | SRAMs | 0.3mA | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 7.5 ns | 19b | 0.04A | COMMON | |||||||||||||||||||||||||||||
IDT70V7339S166DD | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 4 (72 Hours) | 70°C | 0°C | CMOS | 166MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70v7339s166dd-datasheets-7436.pdf | TQFP | 20mm | 20mm | 144 | Parallel | 2 | 3A991.B.2.A | FLOW-THROUGH OR PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 144 | COMMERCIAL | 3.45V | 3.15V | 30 | SRAMs | 2.5/3.33.3V | 0.79mA | Not Qualified | S-PQFP-G144 | RAM, SRAM | 3-STATE | 512KX18 | 18 | 9437184 bit | 0.03A | 12 ns | COMMON | 3.15V | |||||||||||||||||||||||||||
IDT71T75602S133PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | Non-RoHS Compliant | 2012 | /files/integrateddevicetechnology-idt71t75602s133pfi-datasheets-7417.pdf | TQFP | 20mm | 2.5V | 100 | 2.625V | 2.375V | 100 | Parallel | 18 Mb | 1 | PIPELINED ARCHITECTURE | not_compliant | 1 | 215mA | e0 | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 4.2 ns | 19b | 36 | 0.06A | 36b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||||
7008L35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l35pf8-datasheets-7409.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 255mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
70V7319S166BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7319s166bf-datasheets-7408.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 4 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 790mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 18b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||||
IDT71V2559S80PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2559s80pf-datasheets-7406.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 2.5/3.3V | 0.25mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 95MHz | 256KX18 | 18 | 4718592 bit | 0.04A | 8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
7006L20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006l20j8-datasheets-7405.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 128 kb | 3.63mm | 2 | No | 240mA | 16kB | RAM, SDR, SRAM | 20 ns | 28b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||
70V9279L7PRFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9279l7prfg-datasheets-7339.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 512 kb | yes | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 128 | COMMERCIAL | 30 | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 7 ns | 83MHz | 30b | 0.003A | COMMON | 3V | ||||||||||||||||||||||||||
IDT71V2556S100PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2556s100pfi-datasheets-7328.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.26mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
7140LA25JI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140la25ji8-datasheets-7312.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 8 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 20b | 1KX8 | 0.004A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||
70V27L15PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v27l15pf8-datasheets-7300.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 225mA | 64kB | RAM, SDR, SRAM | 15 ns | 30b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
IDT71P72604S167BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | 167MHz | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72604s167bqi8-datasheets-7294.pdf | 165 | Parallel | QDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
71V416S12PHG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s12phg-datasheets-7284.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 180mA | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 4 Mb | yes | 1mm | 1 | No | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||
71V65603S133BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65603s133bgi-datasheets-7247.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 18b | 256KX36 | 0.06A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
IDT71P74804S200BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 200MHz | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p74804s200bq8-datasheets-7237.pdf | 165 | Parallel | QDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
71256SA20TPGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 1 (Unlimited) | 85°C | -40°C | CMOS | 4.572mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256sa20tpgi-datasheets-7236.pdf | PDIP | 34.3mm | 7.62mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | yes | 3.3mm | 1 | EAR99 | No | 1 | 145mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 2.54mm | 28 | INDUSTRIAL | 32kB | RAM, SDR, SRAM - Asynchronous | 20 ns | 15b | 32KX8 | 8b | Asynchronous | |||||||||||||||||||||||||||||||
IDT71V65603S133PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65603s133pfi8-datasheets-7215.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.32mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.06A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
IDT71V016SA20PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 70°C | 0°C | CMOS | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa20ph-datasheets-7214.pdf | TSOP | 3.3V | 44 | 3.6V | 3V | 44 | Parallel | 1 Mb | yes | 1 | 1 | 120mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 20 ns | 16b | 16 | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||||
7142LA100L48B | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 125°C | -55°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la100l48b-datasheets-7213.pdf | LCC | 14.2mm | 14.22mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 1.78mm | 2 | No | 140mA | RAM, SRAM | 100 ns | 11b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||
IDT71V416S10Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s10y-datasheets-7195.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 1 | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.2mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 10 ns | COMMON | 3V | YES |
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