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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Number of Pins | Interface | Density | Pbfree Code | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Max Frequency | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | Ambient Temperature Range High | JESD-30 Code | Memory Size | Memory Type | Data Bus Width | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Common Flash Interface | Page Size | I/O Type | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| W9816G6IB-6 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SDRAM | SYNCHRONOUS | 1.1mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9816g6ib6-datasheets-8269.pdf | 60-TFBGA | 10.1mm | 3.3V | 60 | 60 | 16 Mb | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 1 | 110mA | 3V~3.6V | BOTTOM | NOT SPECIFIED | 3.3V | 0.65mm | 60 | 3.6V | 3V | NOT SPECIFIED | Not Qualified | 16Mb 1M x 16 | Volatile | 3-STATE | 5ns | 166MHz | 12b | DRAM | Parallel | 1MX16 | 16 | 0.002A | COMMON | 4096 | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||
| W972GG8JB-25 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w972gg8jb25itr-datasheets-3765.pdf | 60-TFBGA | 11.5mm | 1.8V | Lead Free | 60 | 60 | 2 Gb | 1 | EAR99 | AUTO/SELF REFRESH | 800MHz | 8542.32.00.36 | 1 | 135mA | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 0.8mm | 60 | 1.9V | 1.7V | NOT SPECIFIED | Not Qualified | 2Gb 256M x 8 | Volatile | 8b | 3-STATE | 400ps | 200MHz | 18b | DRAM | Parallel | 256MX8 | 8 | 15ns | 0.012A | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||
| JR28F064M29EWHA | Micron Technology Inc. | $1.14 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-pc28f064m29ewtytr-datasheets-0238.pdf | 48-TFSOP (0.173, 4.40mm Width) | 18.4mm | 1mm | 12mm | 48 | No SVHC | 48 | 64 Mb | yes | 3A991.B.1.A | No | 8542.32.00.51 | 1 | 25mA | e3 | Matte Tin (Sn) | 2.7V | YES | 2.7V~3.6V | DUAL | 260 | 3V | 0.5mm | JR28F064 | 30 | 3/3.3V | 64Mb 8M x 8 4M x 16 | Non-Volatile | FLASH | Parallel | 4MX16 | 70ns | 0.00012A | 75 ns | Asynchronous | YES | YES | YES | 128 | 64K | YES | YES | 8/16words | |||||||||||||||||||||||||||||||||||||||
| W972GG8JB-3 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w972gg8jb25itr-datasheets-3765.pdf | 60-TFBGA | 11.5mm | 1.8V | 60 | 60 | 2 Gb | 1 | EAR99 | AUTO/SELF REFRESH | 667MHz | 8542.32.00.36 | 1 | 120mA | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 0.8mm | 60 | 1.9V | 1.7V | NOT SPECIFIED | Not Qualified | 2Gb 256M x 8 | Volatile | 3-STATE | 450ps | 333MHz | 18b | DRAM | Parallel | 256MX8 | 8 | 15ns | 0.012A | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||
| JR28F064M29EWTA | Micron Technology Inc. | $41.48 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-pc28f064m29ewtytr-datasheets-0238.pdf | 48-TFSOP (0.173, 4.40mm Width) | 18.4mm | 1mm | 12mm | 48 | No SVHC | 48 | 64 Mb | yes | 3A991.B.1.A | No | 8542.32.00.51 | 1 | 25mA | e3 | Matte Tin (Sn) | 2.7V | YES | 2.7V~3.6V | DUAL | 260 | 3V | 0.5mm | JR28F064 | 30 | 3/3.3V | 64Mb 8M x 8 4M x 16 | Non-Volatile | FLASH | Parallel | 4MX16 | 70ns | 0.00012A | 75 ns | Asynchronous | YES | YES | YES | 8127 | 8K64K | YES | TOP | YES | 8/16words | ||||||||||||||||||||||||||||||||||||||
| W25Q16DVZPIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dvzpiq-datasheets-3576.pdf | 8-WDFN Exposed Pad | 2.7V~3.6V | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W972GG6JB-18 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w972gg6jb3i-datasheets-5367.pdf | 84-TFBGA | 13mm | 11mm | 84 | 1 | AUTO/SELF REFRESH | 1 | YES | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 0.8mm | 1.9V | 1.7V | NOT SPECIFIED | 1.8V | 0.31mA | Not Qualified | R-PBGA-B84 | 2Gb 128M x 16 | Volatile | 3-STATE | 350ps | 533MHz | DRAM | Parallel | 128MX16 | 16 | 15ns | 2147483648 bit | 0.012A | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 0.8mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dvzpiq-datasheets-3576.pdf | 8-WDFN Exposed Pad | 6mm | 8 | 14 Weeks | SPI, Serial | 16 Mb | 3A991.B.1.A | 8542.32.00.51 | 1 | 18mA | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | 3/3.3V | Not Qualified | R-PDSO-N8 | 16Mb 2M x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI - Quad I/O | 2MX8 | 8 | 50μs, 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | |||||||||||||||||||||||||||||||||||||||||||
| W25Q80BWSSIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q80bwsnig-datasheets-5509.pdf | 8-SOIC (0.209, 5.30mm Width) | 1.65V~1.95V | 8Mb 1M x 8 | Non-Volatile | 80MHz | FLASH | SPI | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVSSIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvsfig-datasheets-5409.pdf | 8-SOIC (0.209, 5.30mm Width) | 2.16mm | 8 | SPI | 32 Mb | yes | 3A991.B.1.A | No | 20mA | 2.7V~3.6V | 8 | 85°C | 32Mb 4M x 8 | Non-Volatile | 7 ns | 104MHz | 24b | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | 8b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT41K1G8THE-15E:D TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~95°C TC | Tape & Reel (TR) | 3 (168 Hours) | SDRAM - DDR3L | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-mt41k1g8trf125e-datasheets-1246.pdf | 78-TFBGA | 1.283V~1.45V | MT41K1G8 | 8Gb 1G x 8 | Volatile | 13.5ns | 667MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FVPIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 8-WDFN Exposed Pad | 2.7V~3.6V | 128Mb 16M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2502X1#U | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Bulk | 1 (Unlimited) | EPROM - OTP | 0.639mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds2502s-datasheets-2743.pdf | 4-UFBGA, WLBGA | 1.6mm | 0.91mm | 2 | 4 | Serial | 1 kb | no | EAR99 | No | 1 | YES | 2.8V~6V | BOTTOM | 5V | 0.933mm | DS2502 | 2 | 6V | 2.8V | R-PBGA-B2 | 1Kb 128 x 8 | Non-Volatile | EPROM | 1-Wire® | 128X8 | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DVSSIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dvzpiq-datasheets-3576.pdf | 8-SOIC (0.209, 5.30mm Width) | 2.7V~3.6V | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W972GG6JB-25 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR2 | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w972gg6jb3i-datasheets-5367.pdf | 84-TFBGA | 13mm | 1.8V | Lead Free | 84 | 84 | 2 Gb | 1 | AUTO/SELF REFRESH | No | 800MHz | 1 | 170mA | 1.7V~1.9V | BOTTOM | 1.8V | 0.8mm | 1.9V | 1.7V | 2Gb 128M x 16 | Volatile | 16b | 3-STATE | 400ps | 200MHz | 17b | DRAM | Parallel | 128MX16 | 16 | 15ns | 0.012A | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FVPIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 8-WDFN Exposed Pad | 6mm | Lead Free | 8 | 8 | SPI, Serial | 128 Mb | 3A991.B.1.A | No | 1 | 20mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 3/3.3V | 128Mb 16M x 8 | Non-Volatile | 7 ns | 3V | 104MHz | 24b | FLASH | SPI - Quad I/O, QPI | 1 | 50μs, 3ms | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||
| W972GG8JB-18 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w972gg8jb25itr-datasheets-3765.pdf | 60-TFBGA | 11.5mm | 1.8V | 60 | 60 | 2 Gb | 1 | EAR99 | AUTO/SELF REFRESH | 1.066GHz | 8542.32.00.36 | 1 | 165mA | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 0.8mm | 60 | 1.9V | 1.7V | NOT SPECIFIED | Not Qualified | 2Gb 256M x 8 | Volatile | 3-STATE | 350ps | 533MHz | 18b | DRAM | Parallel | 256MX8 | 8 | 15ns | 0.012A | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||
| W25Q128FVEIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 8-WDFN Exposed Pad | 2.7V~3.6V | 128Mb 16M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FVFIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 16-SOIC (0.295, 7.50mm Width) | 2.7V~3.6V | 128Mb 16M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL032CL7B | Winbond Electronics | $2.97 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.4mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl032cb7a-datasheets-5403.pdf | 64-LBGA | 13mm | 11mm | 64 | 14 Weeks | 64 | yes | 3A991.B.1.A | 8542.32.00.51 | 1 | e1 | TIN SILVER COPPER | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 1mm | 64 | 3.6V | 2.7V | NOT SPECIFIED | 3/3.3V | 0.055mA | Not Qualified | 32Mb 4M x 8 2M x 16 | Non-Volatile | 3V | FLASH | Parallel | 32MX1 | 1 | 70ns | 33554432 bit | 8 | 0.000005A | 70 ns | YES | YES | YES | 64 | 64K | YES | YES | 8/16words | |||||||||||||||||||||||||||||||||||
| W25Q40BWSSIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q40bwsnig-datasheets-5420.pdf | 8-SOIC (0.209, 5.30mm Width) | 1.65V~1.95V | 4Mb 512K x 8 | Non-Volatile | 80MHz | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29FEN64GDKCAAXDQ-10:A | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2013 | Lead Free | MT29FEN64 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W9864G6JB-6 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SDRAM | SYNCHRONOUS | 1.1mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9864g6jb6-datasheets-8159.pdf | 60-TFBGA | 10.1mm | 3.3V | 60 | 60 | 64 Mb | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 1 | 75mA | 3V~3.6V | BOTTOM | 3.3V | 0.65mm | 60 | 3.6V | 3V | 64Mb 4M x 16 | Volatile | 5ns | 166MHz | 14b | DRAM | Parallel | 4MX16 | 16 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVSFIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvsfig-datasheets-5409.pdf | 16-SOIC (0.295, 7.50mm Width) | 2.7V~3.6V | 32Mb 4M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL032CH7T | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl032cb7a-datasheets-5403.pdf | 56-TFSOP (0.724, 18.40mm Width) | 18.4mm | 14mm | 56 | 14 Weeks | yes | 3A991.B.1.A | 8542.32.00.51 | 1 | e3 | MATTE TIN | YES | 2.7V~3.6V | DUAL | NOT SPECIFIED | 3V | 0.5mm | 56 | 3.6V | 2.7V | NOT SPECIFIED | 3/3.3V | 0.055mA | Not Qualified | R-PDSO-G56 | 32Mb 4M x 8 2M x 16 | Non-Volatile | 3V | FLASH | Parallel | 32MX1 | 1 | 70ns | 33554432 bit | 8 | 0.000005A | 70 ns | YES | YES | YES | 64 | 64K | YES | YES | 8/16words | ||||||||||||||||||||||||||||||||||||
| W9412G6JH-4 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | SDRAM - DDR | 1.2mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9412g6jh5i-datasheets-5608.pdf | 66-TSSOP (0.400, 10.16mm Width) | 22.22mm | 2.5V | 66 | 66 | 128 Mb | 1 | EAR99 | AUTO/SELF REFRESH | No | 8542.32.00.02 | 1 | 170mA | 2.4V~2.7V | DUAL | 2.5V | 0.65mm | 66 | 2.7V | 2.4V | 128Mb 8M x 16 | Volatile | 16b | 3-STATE | 48ns | 250MHz | 14b | DRAM | Parallel | 8MX16 | 16 | 12ns | 0.005A | COMMON | 4096 | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DWSSIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dwssig-datasheets-5478.pdf | 8-SOIC (0.209, 5.30mm Width) | 1.65V~1.95V | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 40μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DWZPIG TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dwssig-datasheets-5478.pdf | 8-WDFN Exposed Pad | 1.65V~1.95V | 16Mb 2M x 8 | Non-Volatile | 104MHz | FLASH | SPI - Quad I/O, QPI | 40μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W9464G6JH-5I | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | SDRAM - DDR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w9464g6jh4-datasheets-7939.pdf | 66-TSSOP (0.400, 10.16mm Width) | 22.22mm | 2.5V | 66 | 66 | 64 Mb | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 1 | 100mA | 2.3V~2.7V | DUAL | NOT SPECIFIED | 2.5V | 0.65mm | 66 | 2.7V | 2.3V | NOT SPECIFIED | 2.6V | Not Qualified | 64Mb 4M x 16 | Volatile | 3-STATE | 55ns | 200MHz | 14b | DRAM | Parallel | 4MX16 | 16 | 15ns | 0.025A | COMMON | 4096 | 248 | 248 | |||||||||||||||||||||||||||||||||||||||||
| W29GL128CH9B TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl128ch9t-datasheets-5439.pdf | 64-LBGA | 14 Weeks | 2.7V~3.6V | 128Mb 16M x 8 8M x 16 | Non-Volatile | FLASH | Parallel | 90ns |
