| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Density | Pbfree Code | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Memory Type | Data Bus Width | Load Capacitance | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Common Flash Interface | Page Size | I/O Type | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| W25Q256FVEIQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvcif-datasheets-3435.pdf | 8-WDFN Exposed Pad | 8mm | 6mm | 8 | SPI, Serial | unknown | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | R-PDSO-N8 | 256Mb 32M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 268435456 bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVSSIF | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.16mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvsfig-datasheets-5409.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | 5.23mm | 8 | SPI, Serial | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | 3/3.3V | 0.02mA | Not Qualified | S-PDSO-G8 | 32Mb 4M x 8 | Non-Volatile | 2.7V | 104MHz | FLASH | SPI - Quad I/O, QPI | 32MX1 | 1 | 50μs, 3ms | 33554432 bit | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FWSTIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1mm | ROHS3 Compliant | 2016 | /files/winbondelectronics-w25q32fwzpigtr-datasheets-9969.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.28mm | 5.28mm | 8 | 14 Weeks | SPI, Serial | 1 | YES | 1.65V~1.95V | DUAL | NOT SPECIFIED | 1.8V | 1.27mm | 1.95V | 1.65V | NOT SPECIFIED | 1.8V | 0.02mA | Not Qualified | S-PDSO-G8 | 32Mb 4M x 8 | Non-Volatile | 1.8V | 104MHz | FLASH | SPI - Quad I/O, QPI | 4MX8 | 8 | 60μs, 5ms | 33554432 bit | 1 | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FVEIF | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 8-WDFN Exposed Pad | 8mm | 6mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | R-PDSO-N8 | 128Mb 16M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 16MX8 | 8 | 50μs, 3ms | 134217728 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16CLSSIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.16mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16clssig-datasheets-3517.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | 5.23mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 2.3V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.3V | 3/3.3V | 0.018mA | Not Qualified | S-PDSO-G8 | 16Mb 2M x 8 | Non-Volatile | 3V | 50MHz | FLASH | SPI - Quad I/O | 16MX1 | 1 | 50μs, 3ms | 16777216 bit | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVEIF | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvcif-datasheets-3435.pdf | 8-WDFN Exposed Pad | 8mm | 6mm | 8 | SPI, Serial | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | R-PDSO-N8 | 256Mb 32M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 268435456 bit | 0.000025A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||
| AS4C32M32MD1-5BINTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TJ | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | SDRAM - Mobile LPDDR | 200MHz | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/alliancememoryinc-as4c32m32md15bcntr-datasheets-3365.pdf | 90-VFBGA | 8 Weeks | 90 | Parallel | 1.7V~1.9V | 90-FBGA (8x13) | 1Gb 32M x 32 | Volatile | 5ns | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FVSIF | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.16mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | 5.23mm | 8 | SPI, Serial | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | S-PDSO-G8 | 128Mb 16M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 16MX8 | 8 | 50μs, 3ms | 134217728 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT46V32M16TG-5B IT:J | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | SDRAM - DDR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-mt46v32m16p5bjtr-datasheets-3466.pdf | 66-TSSOP (0.400, 10.16mm Width) | 22.22mm | 10.16mm | 66 | no | 1 | EAR99 | AUTO/SELF REFRESH | not_compliant | 8542.32.00.28 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | 2.5V~2.7V | DUAL | 235 | 2.6V | 0.65mm | 66 | 2.7V | 2.5V | 30 | 2.6V | 0.23mA | Not Qualified | R-PDSO-G66 | 512Mb 32M x 16 | Volatile | 3-STATE | 700ps | 200MHz | DRAM | Parallel | 32MX16 | 16 | 15ns | 536870912 bit | 0.005A | COMMON | 8192 | 248 | 248 | ||||||||||||||||||||||||||||||||||||||
| MT29F64G08CBAABWP-12Z:A TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 2016 | 48-TFSOP (0.724, 18.40mm Width) | 2.7V~3.6V | 64Gb 8G x 8 | Non-Volatile | 83MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVFIF | Winbond Electronics | $1.19 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.64mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvcif-datasheets-3435.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 7.49mm | 16 | SPI, Serial | 1 | YES | 2.7V~3.6V | DUAL | 3V | 1.27mm | 16 | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | R-PDSO-G16 | 256Mb 32M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 2MX1 | 1 | 50μs, 3ms | 2097152 bit | 0.000025A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||
| W29GL256PH9T | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl256ph9t-datasheets-3540.pdf | 56-TFSOP (0.724, 18.40mm Width) | 18.4mm | 14mm | 56 | 14 Weeks | 1 | YES | 2.7V~3.6V | DUAL | NOT SPECIFIED | 3V | 0.5mm | 3.6V | 2.7V | NOT SPECIFIED | R-PDSO-G56 | 256Mb 32M x 8 16M x 16 | Non-Volatile | 3V | FLASH | Parallel | 16MX16 | 16 | 90ns | 268435456 bit | 8 | 90 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVDAIQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 5.33mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvsfig-datasheets-5409.pdf | 8-DIP (0.300, 7.62mm) | 9.27mm | 7.62mm | 8 | SPI, Serial | 1 | NO | 2.7V~3.6V | DUAL | 3V | 2.54mm | 3.6V | 2.7V | 3/3.3V | 0.02mA | Not Qualified | R-PDIP-T8 | 32Mb 4M x 8 | Non-Volatile | 2.7V | 104MHz | FLASH | SPI - Quad I/O, QPI | 32MX1 | 1 | 50μs, 3ms | 33554432 bit | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL256SH9T | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl256sh9t-datasheets-3542.pdf | 56-TFSOP (0.724, 18.40mm Width) | 18.4mm | 14mm | 56 | 14 Weeks | 1 | YES | 2.7V~3.6V | DUAL | 3V | 0.5mm | 3.6V | 2.7V | 3/3.3V | 0.1mA | Not Qualified | R-PDSO-G56 | 256Mb 16M x 16 | Non-Volatile | 3V | FLASH | Parallel | 16MX16 | 16 | 90ns | 268435456 bit | 0.0001A | 90 ns | YES | YES | YES | 256 | 64K | YES | YES | 16words | |||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVSSIQ | Winbond Electronics | $0.30 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.16mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvsfig-datasheets-5409.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | 3V | 8 | 8 | SPI, Serial | 32 Mb | No | 1 | 20mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | 32Mb 4M x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 24b | FLASH | SPI - Quad I/O, QPI | 32MX1 | 1 | 50μs, 3ms | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | ||||||||||||||||||||||||||||||||||||||||||||
| W29GL256SL9T | Winbond Electronics | $1.32 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl256sh9t-datasheets-3542.pdf | 56-TFSOP (0.724, 18.40mm Width) | 18.4mm | 14mm | 56 | 14 Weeks | 1 | YES | 2.7V~3.6V | DUAL | 3V | 0.5mm | 3.6V | 2.7V | 3/3.3V | 0.1mA | Not Qualified | R-PDSO-G56 | 256Mb 16M x 16 | Non-Volatile | 3V | FLASH | Parallel | 16MX16 | 16 | 90ns | 268435456 bit | 0.0001A | 90 ns | YES | YES | YES | 256 | 64K | YES | YES | 16words | ||||||||||||||||||||||||||||||||||||||||||||
| AS4C32M16MD1-5BINTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TJ | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | SDRAM - Mobile LPDDR | 200MHz | RoHS Compliant | 60-TFBGA | 8 Weeks | Parallel | 1.7V~1.9V | 60-FBGA (8x9) | 512Mb 32M x 16 | Volatile | 700ps | 200MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q40BWSVIG | Winbond Electronics | $1.81 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q40bwsnig-datasheets-5420.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | SPI, Serial | 1 | YES | 1.65V~1.95V | DUAL | 1.8V | 1.27mm | 1.95V | 1.65V | 1.8V | 0.025mA | Not Qualified | R-PDSO-G8 | 4Mb 512K x 8 | Non-Volatile | 1.8V | 80MHz | FLASH | SPI | 4MX1 | 1 | 800μs | 4194304 bit | 0.00001A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FVAIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | FLASH - NOR | SYNCHRONOUS | 5.33mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 8-DIP (0.300, 7.62mm) | 9.27mm | 7.62mm | 8 | SPI, Serial | 3A991.B.1.A | 8542.32.00.51 | 1 | NO | 2.7V~3.6V | DUAL | 3V | 2.54mm | 8 | 3.6V | 2.7V | 3/3.3V | 0.02mA | Not Qualified | R-PDIP-T8 | 128Mb 16M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 128MX1 | 1 | 50μs, 3ms | 134217728 bit | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||
| W25Q16CLZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16clssig-datasheets-3517.pdf | 8-WDFN Exposed Pad | 6mm | 5mm | 8 | 14 Weeks | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 2.3V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.3V | 3/3.3V | 0.018mA | Not Qualified | R-PDSO-N8 | 16Mb 2M x 8 | Non-Volatile | 3V | 50MHz | FLASH | SPI - Quad I/O | 16MX1 | 1 | 50μs, 3ms | 16777216 bit | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||
| AS4C32M32MD1-5BCN | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TJ | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/alliancememoryinc-as4c32m32md15bcntr-datasheets-3365.pdf | 90-VFBGA | 13mm | 8mm | 90 | 8 Weeks | 90 | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.32 | 1 | YES | 1.7V~1.9V | BOTTOM | 0.8mm | 1.95V | 1.7V | 1Gb 32M x 32 | Volatile | 5ns | 200MHz | DRAM | Parallel | 32MX32 | 32 | 15ns | 1073741824 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1220Y-150+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C TA | Tube | 1 (Unlimited) | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds1220y150-datasheets-3431.pdf | 24-DIP Module (0.600, 15.24mm) | 24 | yes | EAR99 | 10 YEAR DATA RETENTION | 8542.32.00.41 | 1 | e3 | MATTE TIN | NO | 4.5V~5.5V | DUAL | NOT SPECIFIED | 5V | 2.54mm | 24 | 5.5V | 4.5V | NOT SPECIFIED | SRAMs | 5V | 0.075mA | Not Qualified | R-XDMA-P24 | 16Kb 2K x 8 | Non-Volatile | NVSRAM | Parallel | 2KX8 | 8 | 150ns | 16384 bit | 0.004A | 150 ns | ||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q256FVCIF | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q256fvcif-datasheets-3435.pdf | 24-TBGA | 8mm | 6mm | 24 | 24 | SPI, Serial | 1 | YES | 2.7V~3.6V | BOTTOM | 3V | 1mm | 24 | 3.6V | 2.7V | 3/3.3V | 0.025mA | Not Qualified | 256Mb 32M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O, QPI | 256MX1 | 1 | 50μs, 3ms | 268435456 bit | 0.000025A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||
| RM25C128A-BSNC-B | Adesto Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tube | 1 (Unlimited) | CBRAM | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/adestotechnologies-rm25c128abtact-datasheets-3229.pdf | 8-SOIC (0.154, 3.90mm Width) | 8 Weeks | SPI, Serial | 2.7V~3.6V | 128kb 64B Page Size | Non-Volatile | 5MHz | CBRAM® | SPI | 100μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| N25Q032A13ESEA0F TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 1 (Unlimited) | FLASH - NOR | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-n25q032a13esfa0ftr-datasheets-0143.pdf | 8-SOIC (0.154, 3.90mm Width) | 2.7V~3.6V | 8-SOP2 | 32Mb 8M x 4 | Non-Volatile | 108MHz | FLASH | SPI | 8ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST26VF064BA-104I/SO | Microchip Technology | $2.46 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SST26 SQI® | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | 2.65mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/microchiptechnology-sst26vf064b104vso-datasheets-2682.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.3mm | 7.5mm | 3V | 16 | 16 | SPI, Serial | 64 Mb | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | 2.7V~3.6V | DUAL | 260 | 3V | 1.27mm | SST26VF064 | 3.6V | 2.7V | 40 | 64Mb 8M x 8 | Non-Volatile | 3V | 104MHz | FLASH | SPI - Quad I/O | 64MX1 | 1 | 1.5ms | 256B | ||||||||||||||||||||||||||||||||||||||||||||||||
| DS1225Y-150IND+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 10.668mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds1225y150-datasheets-7360.pdf | 28-DIP Module (0.600, 15.24mm) | 38.227mm | 15.24mm | 28 | 11 Weeks | yes | EAR99 | 10 YEAR DATA RETENTION | not_compliant | 8473.30.11.40 | 1 | NO | 4.5V~5.5V | DUAL | NOT SPECIFIED | 5V | 2.54mm | 28 | 5.5V | 4.5V | NOT SPECIFIED | Not Qualified | R-XDMA-P28 | 64Kb 8K x 8 | Non-Volatile | NVSRAM | Parallel | 8KX8 | 8 | 150ns | 65536 bit | 150 ns | |||||||||||||||||||||||||||||||||||||||||||||||||
| DS1220Y-100+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C TA | Tube | 1 (Unlimited) | NVSRAM (Non-Volatile SRAM) | 10.54mm | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds1220y100ind-datasheets-2632.pdf | 24-DIP Module (0.600, 15.24mm) | 33.785mm | 5V | 24 | 24 | 16 kb | yes | EAR99 | 10 YEAR DATA RETENTION | No | 8542.32.00.41 | 1 | 85mA | e3 | MATTE TIN | NO | 4.5V~5.5V | DUAL | 5V | 2.54mm | 24 | 16Kb 2K x 8 | Non-Volatile | 8b | 5pF | NVSRAM | Parallel | 2KX8 | 8 | 100ns | 100 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AT45DQ321-MHFHJ-T | Adesto Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TC | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/adestotechnologies-at45dq321shfb-datasheets-1999.pdf | 8-UDFN Exposed Pad | 12 Weeks | 2.3V~3.6V | 32Mb 512Bytes x 8192 pages | Non-Volatile | 104MHz | FLASH | SPI | 8μs, 4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AS4C32M32MD1-5BCNTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TJ | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -25°C | SDRAM - Mobile LPDDR | 200MHz | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/alliancememoryinc-as4c32m32md15bcntr-datasheets-3365.pdf | 90-VFBGA | 8 Weeks | 90 | Parallel | 1.7V~1.9V | 90-FBGA (8x13) | 1Gb 32M x 32 | Volatile | 5ns | 200MHz | DRAM | Parallel | 15ns |
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