| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | Ambient Temperature Range High | JESD-30 Code | Supplier Device Package | Memory Size | Memory Type | Data Bus Width | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Common Flash Interface | Page Size | I/O Type | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| W25Q64FVSFIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.64mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64fvssig-datasheets-5384.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 16 | 16 | SPI, Serial | 64 Mb | yes | 3A991.B.1.A | No | 8542.32.00.51 | 1 | 40mA | 2.7V~3.6V | DUAL | 1.27mm | 16 | 3.6V | 3V | 64Mb 8M x 8 | Non-Volatile | 3-STATE | 8.5 ns | 104MHz | 1b | FLASH | SPI - Quad I/O, QPI | 8MX8 | 8 | 50μs, 3ms | 1 | 0.00005A | 8b | SPI | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64DWZPIG | Winbond Electronics | $0.45 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64dwzeig-datasheets-5492.pdf | 8-WDFN Exposed Pad | 6mm | 1.8V | 8 | 8 | SPI, Serial | 64 Mb | EAR99 | TOP/BOTTOM BOOT BLOCK | 1 | 40mA | 1.7V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.7V | Not Qualified | 64Mb 8M x 8 | Non-Volatile | 7 ns | 104MHz | 1b | FLASH | SPI | 256KX32 | 32 | 3ms | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64DWZEIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64dwzeig-datasheets-5492.pdf | 8-WDFN Exposed Pad | 8mm | 6mm | 8 | EAR99 | TOP/BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | YES | 1.7V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.7V | 1.8V | 0.04mA | Not Qualified | R-PDSO-N8 | 64Mb 8M x 8 | Non-Volatile | 1.8V | 104MHz | FLASH | SPI | 256KX32 | 32 | 3ms | 8388608 bit | SERIAL | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 7.5 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q40BWZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q40bwsnig-datasheets-5420.pdf | 8-WDFN Exposed Pad | 6mm | 5mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 1.65V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.65V | 1.8V | 0.025mA | Not Qualified | R-PDSO-N8 | 4Mb 512K x 8 | Non-Volatile | 1.8V | 80MHz | FLASH | SPI | 4MX1 | 1 | 800μs | 4194304 bit | 0.00001A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT45DB321D-SU-2.5 | Microchip Technology | $11.14 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TC | Tube | 1 (Unlimited) | FLASH | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microchiptechnology-at45db321dmwu-datasheets-0857.pdf | 8-SOIC (0.209, 5.30mm Width) | 2.5V~3.6V | AT45DB321 | 8-SOIC | 32Mb 528Bytes x 8192 pages | Non-Volatile | 50MHz | FLASH | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| RC28F128P33BF60A | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | StrataFlash™ | Surface Mount | -40°C~85°C TC | Tray | 3 (168 Hours) | FLASH - NOR | 1.2mm | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-rc28f128p33bf60a-datasheets-5580.pdf | 64-TBGA | 10mm | 64 | 64 | Parallel, Serial | 128 Mb | no | No | 1 | 28mA | e0 | 2.3V | YES | 2.3V~3.6V | BOTTOM | 3V | 1mm | 28F128P33 | 2.5/3.3V | 128Mb 8M x 16 | Non-Volatile | 52MHz | 23b | FLASH | Parallel | 8MX16 | 16 | 60ns | 0.002A | 16b | 17 ns | Asynchronous | NO | NO | 4127 | BOTTOM | 8words | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2431GA+U | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | 0.8mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/maximintegrated-ds2431ptr-datasheets-0434.pdf | 2-WDFN | 6.5mm | 3.5mm | 2 | 4 Weeks | Unknown | 5.25V | 2.8V | 2 | Serial | 1 kb | yes | EAR99 | No | 1 | BOTTOM | DS2431 | 2 | 3/5V | 1Kb 256 x 4 | Non-Volatile | 2μs | EEPROM | 1-Wire® | 1KX1 | 1 | 50000 Write/Erase Cycles | 40 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64DWSSIG | Winbond Electronics | $1.78 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.16mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64dwzeig-datasheets-5492.pdf | 8-SOIC (0.209, 5.30mm Width) | 1.8V | 8 | 8 | SPI, Serial | 64 Mb | 3A991.B.1.A | TOP/BOTTOM BOOT BLOCK | No | 1 | 40mA | 1.7V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.7V | 64Mb 8M x 8 | Non-Volatile | 7 ns | 104MHz | 1b | FLASH | SPI | 256KX32 | 32 | 3ms | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80BWSNIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q80bwsnig-datasheets-5509.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 1.65V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.65V | 1.8V | 0.025mA | Not Qualified | R-PDSO-G8 | 8Mb 1M x 8 | Non-Volatile | 1.8V | 80MHz | FLASH | SPI | 8MX1 | 1 | 800μs | 8388608 bit | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| W631GG6KB-12 | Winbond Electronics | $3.22 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR3 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w631gg6kb12tr-datasheets-9274.pdf | 96-TFBGA | 13mm | 1.5V | 96 | 14 Weeks | 96 | 1 Gb | 1 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.32 | 1 | 280mA | 1.425V~1.575V | BOTTOM | NOT SPECIFIED | 1.5V | 0.8mm | 96 | 1.575V | 1.425V | NOT SPECIFIED | Not Qualified | 1Gb 64M x 16 | Volatile | 16b | 3-STATE | 20ns | 800MHz | 13b | DRAM | Parallel | 64MX16 | 16 | 0.014A | COMMON | 8192 | 8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64FVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q64fvssig-datasheets-5384.pdf | 8-WDFN Exposed Pad | 6mm | 800μm | 3V | 8 | 8 | SPI | 64 Mb | No | 1 | 40mA | 2.7V~3.6V | DUAL | 1.27mm | 3.6V | 3V | 85°C | 64Mb 8M x 8 | Non-Volatile | 3-STATE | 7 ns | 104MHz | 1b | FLASH | SPI - Quad I/O, QPI | 8 | 50μs, 3ms | SERIAL | 1 | 0.00005A | 8b | SPI | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FVFIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q128fvsig-datasheets-5561.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 2.64mm | Lead Free | 16 | 16 | SPI | 128 Mb | 3A991.B.1.A | No | 8542.32.00.51 | 1 | 20mA | e3 | Matte Tin (Sn) | 2.7V~3.6V | DUAL | 260 | 3V | 1.27mm | 16 | 3.6V | 2.7V | 3/3.3V | 85°C | 128Mb 16M x 8 | Non-Volatile | 7 ns | 3V | 104MHz | 24b | FLASH | SPI - Quad I/O, QPI | 128MX1 | 1 | 50μs, 3ms | SERIAL | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||
| M29F200FT5AN6F2 TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-m29f400fb5am6t2-datasheets-4493.pdf | 48-TFSOP (0.724, 18.40mm Width) | 4.5V~5.5V | M29F200 | 2Mb 256K x 8 128K x 16 | Non-Volatile | FLASH | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL032CB7S | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl032cb7a-datasheets-5403.pdf | 48-TFSOP (0.724, 18.40mm Width) | 18.4mm | 12mm | 48 | 14 Weeks | yes | 3A991.B.1.A | BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | e3 | MATTE TIN | YES | 2.7V~3.6V | DUAL | NOT SPECIFIED | 3V | 0.5mm | 48 | 3.6V | 2.7V | NOT SPECIFIED | 3/3.3V | 0.055mA | Not Qualified | R-PDSO-G48 | 32Mb 4M x 8 2M x 16 | Non-Volatile | 3V | FLASH | Parallel | 32MX1 | 1 | 70ns | 33554432 bit | 8 | 0.000005A | 70 ns | YES | YES | YES | 863 | 8K64K | YES | BOTTOM | YES | 8/16words | ||||||||||||||||||||||||||||||||||||||||||
| W25Q40CLZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q40clsnig-datasheets-9412.pdf | 8-WDFN Exposed Pad | 2.3V~3.6V | 8-WSON (6x5) | 4Mb 512K x 8 | Non-Volatile | 104MHz | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL032CT7S | Winbond Electronics | $1.31 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | 85°C | -40°C | FLASH - NOR | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl032cb7a-datasheets-5403.pdf | 48-TFSOP (0.724, 18.40mm Width) | 14 Weeks | Parallel | 2.7V~3.6V | 48-TSOP | 32Mb 4M x 8 2M x 16 | Non-Volatile | 70ns | FLASH | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32DWZPIG | Winbond Electronics | $0.34 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32dwsfig-datasheets-5426.pdf | 8-WDFN Exposed Pad | 6mm | 5mm | 8 | SPI, Serial | EAR99 | TOP/BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | YES | 1.7V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.7V | 1.8V | 0.04mA | Not Qualified | R-PDSO-N8 | 32Mb 4M x 8 | Non-Volatile | 1.8V | 104MHz | FLASH | SPI | 256KX16 | 16 | 3ms | 4194304 bit | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 7.5 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL032CT7A | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl032cb7a-datasheets-5403.pdf | 48-TFBGA | 8mm | 6mm | 48 | yes | 3A991.B.1.A | TOP BOOT BLOCK | 8542.32.00.51 | 1 | e1 | TIN SILVER COPPER | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 0.8mm | 48 | 3.6V | 2.7V | NOT SPECIFIED | 3/3.3V | 0.055mA | Not Qualified | R-PBGA-B48 | 32Mb 4M x 8 2M x 16 | Non-Volatile | 3V | FLASH | Parallel | 32MX1 | 1 | 70ns | 33554432 bit | 8 | 0.000005A | 70 ns | YES | YES | YES | 863 | 8K64K | YES | TOP | YES | 8/16words | |||||||||||||||||||||||||||||||||||||||||||
| FM22LD16-55-BGTR | Ramtron |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | F-RAM™ | Surface Mount | -40°C~85°C TA | Cut Tape (CT) | 3 (168 Hours) | FRAM (Ferroelectric RAM) | ASYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/cypresssemiconductorcorp-fm22ld1655bg-datasheets-7690.pdf | 48-TFBGA | 8mm | 6mm | 48 | 48 | unknown | 8542.32.00.71 | 1 | YES | 2.7V~3.6V | BOTTOM | 3.3V | 0.75mm | FM22LD16 | 48 | 3.6V | 2.7V | Not Qualified | 4Mb 256K x 16 | Non-Volatile | FRAM | Parallel | 256KX16 | 16 | 110ns | 4194304 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32FVSFIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.64mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32fvsfig-datasheets-5409.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 16 | 16 | SPI, Serial | 32 Mb | No | 1 | 20mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 3.6V | 2.7V | 3/3.3V | 32Mb 4M x 8 | Non-Volatile | 8.5 ns | 2.7V | 104MHz | 24b | FLASH | SPI - Quad I/O, QPI | 32MX1 | 1 | 50μs, 3ms | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DWSSIG | Winbond Electronics | $0.20 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 2.16mm | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16dwssig-datasheets-5478.pdf | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | 5.23mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 1.65V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.65V | 1.8V | 0.04mA | Not Qualified | S-PDSO-G8 | 16Mb 2M x 8 | Non-Volatile | 1.8V | 104MHz | FLASH | SPI - Quad I/O, QPI | 16MX1 | 1 | 40μs, 3ms | 16777216 bit | 0.000005A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16CVZPIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16cvssig-datasheets-5341.pdf | 8-WDFN Exposed Pad | 6mm | 8 | 8 | SPI, Serial | 16 Mb | EAR99 | Gold, Tin | No | 1 | 18mA | 2.7V~3.6V | DUAL | 3V | 1.27mm | 8 | 3.6V | 2.7V | 3/3.3V | 16Mb 2M x 8 | Non-Volatile | 7 ns | 2.7V | 104MHz | 21b | FLASH | SPI - Quad I/O | 16MX1 | 1 | 50μs, 3ms | 0.000005A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | 256B | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL064CB7S | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 1.2mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w29gl064cb7a-datasheets-5377.pdf | 48-TFSOP (0.724, 18.40mm Width) | 18.4mm | 48 | 14 Weeks | 48 | 64 Mb | 3A991.B.1.A | BOTTOM BOOT BLOCK | Tin | No | 8542.32.00.51 | 1 | 2.7V~3.6V | DUAL | 3V | 0.5mm | 48 | 3.6V | 2.7V | 3/3.3V | 0.055mA | 64Mb 8M x 8 4M x 16 | Non-Volatile | 3V | 22b | FLASH | Parallel | 64MX1 | 1 | 70ns | 8 | 0.000005A | 70 ns | YES | YES | YES | 8127 | 8K64K | YES | BOTTOM | YES | 8/16words | |||||||||||||||||||||||||||||||||||||||||||||||
| MT49H16M18SJ-25:B | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~95°C TC | Tray | 3 (168 Hours) | CMOS | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2015 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-mt49h8m36sj25btr-datasheets-5996.pdf | 144-TBGA | 18.5mm | 1.8V | 144 | 13 Weeks | 144 | 288 Mb | 1 | AUTO REFRESH | 400MHz | 1 | YES | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 1mm | MT49H16M18 | 1.9V | 1.7V | NOT SPECIFIED | 288Mb 16M x 18 | Volatile | 20ns | 20b | DRAM | Parallel | 16MX18 | 18 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT47H64M8JN-25E IT:G | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~95°C TC | Bulk | 3 (168 Hours) | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-mt47h32m16nf25eithtr-datasheets-3218.pdf | 60-TFBGA | 10mm | 8mm | 60 | no | 1 | EAR99 | AUTO/SELF REFRESH | not_compliant | 8542.32.00.28 | 1 | e0 | TIN LEAD SILVER | YES | 1.7V~1.9V | BOTTOM | 235 | 1.8V | 0.8mm | MT47H64M8 | 60 | 1.9V | 1.7V | 30 | 1.8V | 0.215mA | Not Qualified | R-PBGA-B60 | 512Mb 64M x 8 | Volatile | 3-STATE | 400ps | 400MHz | DRAM | Parallel | 64MX8 | 8 | 15ns | 536870912 bit | 0.007A | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||
| W25Q40BWSNIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q40bwsnig-datasheets-5420.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | SPI, Serial | EAR99 | 8542.32.00.51 | 1 | YES | 1.65V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.65V | 1.8V | 0.025mA | Not Qualified | R-PDSO-G8 | 4Mb 512K x 8 | Non-Volatile | 1.8V | 80MHz | FLASH | SPI | 4MX1 | 1 | 800μs | 4194304 bit | 0.00001A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32DWZEIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 0.8mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32dwsfig-datasheets-5426.pdf | 8-WDFN Exposed Pad | 8mm | 6mm | 8 | EAR99 | TOP/BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | YES | 1.7V~1.95V | DUAL | 1.8V | 1.27mm | 8 | 1.95V | 1.7V | 1.8V | 0.04mA | Not Qualified | R-PDSO-N8 | 32Mb 4M x 8 | Non-Volatile | 1.8V | 104MHz | FLASH | SPI | 256KX16 | 16 | 3ms | 4194304 bit | SERIAL | 0.00002A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 7.5 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q32DWSFIG | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | FLASH - NOR | 2.64mm | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q32dwsfig-datasheets-5426.pdf | 16-SOIC (0.295, 7.50mm Width) | 10.31mm | 1.8V | 16 | 16 | SPI, Serial | 32 Mb | EAR99 | TOP/BOTTOM BOOT BLOCK | 8542.32.00.51 | 1 | 40mA | 1.7V~1.95V | DUAL | 1.8V | 1.27mm | 16 | 1.95V | 1.7V | Not Qualified | 32Mb 4M x 8 | Non-Volatile | 7.5 ns | 104MHz | 24b | FLASH | SPI | 16 | 3ms | 0.00002A | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| W972GG6JB-3 | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2011 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w972gg6jb3i-datasheets-5367.pdf | 84-TFBGA | 13mm | 1.8V | Lead Free | 84 | 84 | 2 Gb | yes | 1 | EAR99 | AUTO/SELF REFRESH | 667MHz | 8542.32.00.36 | 1 | 155mA | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1.8V | 0.8mm | 84 | 1.9V | 1.7V | NOT SPECIFIED | Not Qualified | 2Gb 128M x 16 | Volatile | 3-STATE | 450ps | 333MHz | 17b | DRAM | Parallel | 128MX16 | 16 | 15ns | 0.012A | COMMON | 8192 | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||||
| MT49H16M36BM-25:B | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~95°C TC | Bulk | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-mt49h16m36fm18b-datasheets-5310.pdf | 144-TFBGA | 18.5mm | 1.8V | Lead Free | 144 | 144 | 576 Mb | 1 | EAR99 | AUTO REFRESH | No | 8542.32.00.32 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 1.7V~1.9V | BOTTOM | 260 | 1.8V | 1mm | MT49H16M36 | 144 | 1.9V | 1.7V | 30 | 1.5/1.81.82.5V | 0.7mA | 576Mb 16M x 36 | Volatile | 36b | 3-STATE | 20ns | 400MHz | 23b | DRAM | Parallel | 16MX36 | 36 | 0.055A | COMMON | 248 |
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