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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IDT71V632S6PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v632s6pfi-datasheets-5202.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.63V | 3.135V | 20 | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 83MHz | 64KX32 | 32 | 2097152 bit | 0.015A | 6 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| IDT71V2559S80BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2559s80bg-datasheets-5186.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.5/3.3V | 0.25mA | Not Qualified | RAM, SRAM | 3-STATE | 95MHz | 256KX18 | 18 | 4718592 bit | 0.04A | 8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| 70V38L20PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v38l20pfi-datasheets-5120.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1.1 Mb | no | 1.4mm | 2 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 32b | 64KX18 | 0.003A | 18b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||
| 70V3319S133PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3319s133prf-datasheets-5115.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 4.5 Mb | no | 1.4mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 400mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 36b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||
| 7143SA35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143sa35pf8-datasheets-5099.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 32 kb | 1.4mm | 2 | 295mA | RAM, SRAM | 35 ns | 22b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| IDT71016S15PHI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71016s15phi8-datasheets-5098.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 5V | 0.8mm | 44 | INDUSTRIAL | 5.5V | 4.5V | 20 | SRAMs | 5V | 0.18mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 15 ns | COMMON | 4.5V | |||||||||||||||||||||||||||
| IDT71V416VS12BEI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vs12bei8-datasheets-5093.pdf | TFBGA | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V2558S100BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2558s100bg-datasheets-5081.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.25mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.04A | 5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| 71V35761SA166BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa166bqgi-datasheets-5045.pdf | FBGA | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 330mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 17b | 0.035A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7140SA100L48B | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Bulk | 125°C | -55°C | RoHS Compliant | LCC | 14.2mm | 14.22mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 8 kb | 1.78mm | 2 | No | 190mA | RAM, SRAM | 100 ns | 20b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V416VS12BEI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vs12bei-datasheets-4987.pdf | TFBGA | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75602S150PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s150pfi8-datasheets-4983.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.235mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.06A | 3.8 ns | COMMON | 2.38V | ||||||||||||||||||||||||||
| 71256SA15YGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.556mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256sa15ygi8-datasheets-4976.pdf | 17.9mm | 7.6mm | 5V | Lead Free | 28 | 8 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | yes | 2.67mm | 1 | EAR99 | No | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | INDUSTRIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 15b | 32KX8 | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| 70T651S12BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s12bf-datasheets-4944.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 18b | 0.01A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| IDT71024S15TY8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.76mm | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71024s15ty8-datasheets-4921.pdf | 20.96mm | 7.62mm | 32 | 32 | Parallel | 1 | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.155mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 15 ns | COMMON | 4.5V | YES | ||||||||||||||||||||||||||||
| IDT71T75602S150PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s150pfi-datasheets-4918.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.235mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.06A | 3.8 ns | COMMON | 2.38V | ||||||||||||||||||||||||||
| IDT71V416VS12BE8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vs12be8-datasheets-4909.pdf | TFBGA | 9mm | 9mm | 48 | Parallel | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | COMMERCIAL | 3.6V | 3V | 30 | Not Qualified | S-PBGA-B48 | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 12 ns | |||||||||||||||||||||||||||||||||||||
| 7164S20TDB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 125°C | -55°C | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s20tdb-datasheets-4892.pdf | CDIP | 37.72mm | 7.62mm | 5V | Contains Lead | 28 | Parallel | 64 kb | 3.56mm | 1 | No | RAM, SRAM - Asynchronous | 13b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V632S5PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v632s5pfg8-datasheets-4838.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 2 Mb | yes | 1.4mm | 1 | ALSO REQUIRES 3.3V I/O SUPPLY | No | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 5 ns | 16b | 64KX32 | 32b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71V67602S150BQI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s150bqi-datasheets-4813.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.325mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.05A | 3.8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 7006S55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s55j8-datasheets-4814.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 28b | 16KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| 7133LA55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133la55j8-datasheets-4805.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| IDT71V416VS12BE | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vs12be-datasheets-4803.pdf | TFBGA | 9mm | 9mm | 48 | Parallel | yes | 3A991.B.2.A | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.18mA | Not Qualified | S-PBGA-B48 | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | |||||||||||||||||||||||||||||
| 70V06L15JG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06l15jg8-datasheets-4750.pdf | PLCC | 24mm | 24mm | 3.3V | Lead Free | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 128 kb | yes | 3.63mm | 2 | EAR99 | No | 1 | 185mA | e3 | MATTE TIN | QUAD | J BEND | 260 | 3.3V | 68 | COMMERCIAL | RAM, SRAM | 15 ns | 28b | 16KX8 | 8b | Asynchronous | |||||||||||||||||||||||||||||
| 70914S15PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | LQFP | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V416VS10Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vs10y8-datasheets-4735.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e3 | MATTE TIN | YES | DUAL | J BEND | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | Not Qualified | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 10 ns | |||||||||||||||||||||||||||||||||||||||
| 70V27L55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v27l55pf-datasheets-4707.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 180mA | 64kB | RAM, SDR, SRAM | 55 ns | 30b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT71V2556S166BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2556s166bg-datasheets-4701.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.35mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.04A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| 70T659S12BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t659s12bc-datasheets-4656.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 34b | 0.01A | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| IDT71V2556S133BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2556s133bg8-datasheets-4614.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V |
