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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IDT71T75602S100PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s100pfi8-datasheets-2910.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.195mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.06A | 5 ns | COMMON | 2.38V | |||||||||||||||||||||||
| IDT71V416YS15PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 85°C | -40°C | CMOS | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416ys15phi-datasheets-2891.pdf | TSOP | 3.3V | 44 | 3.6V | 3V | 44 | Parallel | 4 Mb | no | 1 | not_compliant | 1 | 170mA | e0 | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 16 | 0.02A | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| IDT71P71804S200BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p71804s200bq8-datasheets-2887.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 1.9V | 1.7V | 20 | SRAMs | 1.5/1.81.8V | 0.55mA | Not Qualified | DDR, RAM, SRAM | 3-STATE | 1MX18 | 18 | 18874368 bit | 0.3A | 0.45 ns | COMMON | 1.7V | |||||||||||||||||||||||||
| 70V9099L6PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9099l6pf8-datasheets-2879.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 280mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 34b | 8b | Synchronous | COMMON | 3V | |||||||||||||||||||||
| 71T75602S150BGGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 150MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s150bggi-datasheets-2833.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 235mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | INDUSTRIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 19b | 0.06A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||
| 7038L20PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 85°C | -40°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7038l20pfi8-datasheets-2816.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 1.1 Mb | 1.4mm | 2 | No | 360mA | RAM, SRAM | 20 ns | 16b | 18b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||
| IDT71T75602S100PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s100pfi-datasheets-2817.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.195mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.06A | 5 ns | COMMON | 2.38V | |||||||||||||||||||||||||
| 7140LA55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140la55pf8-datasheets-2819.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | RAM, SRAM | 3-STATE | 55 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||
| 70V24L35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24l35pf8-datasheets-2798.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX16 | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||
| 70T659S10DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t659s10dr-datasheets-2795.pdf | PQFP | 28mm | 28mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4.5 Mb | no | 3.5mm | 2 | No | 1 | 405mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 208 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 34b | 0.01A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||
| IDT71V416VL15BEGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vl15begi-datasheets-2783.pdf | TFBGA | 9mm | 3.3V | 48 | 3.6V | 3V | 48 | Parallel | 4 Mb | 1 | 1 | 160mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 16 | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||
| IDT71P71604S200BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 200MHz | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p71604s200bq8-datasheets-2782.pdf | 165 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 165 | DDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71T75602S150BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s150bgg8-datasheets-2746.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 215mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 19b | 0.04A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||
| TH58NVG3S0HTA00 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 70°C | 0°C | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/toshiba-th58nvg3s0hta00-datasheets-2743.pdf | TFSOP | Parallel, Serial | EEPROM, NAND | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V9089L12PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9089l12pfi-datasheets-2722.pdf | LQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 100 | RAM, SRAM | 32b | |||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V67602S150BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67602s150bg-datasheets-2713.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.325mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX36 | 36 | 9437184 bit | 0.05A | 3.8 ns | COMMON | 3.14V | |||||||||||||||||||||||||
| IDT71V416VL15BEG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vl15beg8-datasheets-2707.pdf | TFBGA | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75602S100PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s100pfgi8-datasheets-2694.pdf | LQFP | 100 | Parallel | unknown | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 2.5V | 0.635mm | INDUSTRIAL | SRAMs | 2.5V | 0.195mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.06A | 5 ns | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||
| 70V24L25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24l25j8-datasheets-2629.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 165mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 24b | 4KX16 | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||
| 71T75602S150BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | 2.36mm | RoHS Compliant | 2012 | /files/integrateddevicetechnology-71t75602s150bgg-datasheets-2621.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 215mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 150MHz | 3-STATE | 3.8 ns | 19b | 0.04A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||
| IDT71T75602S100PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s100pfgi-datasheets-2609.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 2.625V | 2.375V | 30 | SRAMs | 2.5V | 0.195mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.06A | 5 ns | COMMON | 2.38V | ||||||||||||||||||||||||
| IDT71V124SA10PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124sa10ph-datasheets-2606.pdf | SOIC | 20.95mm | 10.16mm | 32 | Parallel | no | 3A991.B.2.B | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 1.27mm | 32 | COMMERCIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.145mA | Not Qualified | R-PDSO-G32 | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 10 ns | COMMON | 3.15V | |||||||||||||||||||||||||||
| IDT71V416YS12PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416ys12ph-datasheets-2603.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | ||||||||||||||||||||||||||
| IDT71V416VL15BEG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vl15beg-datasheets-2604.pdf | TFBGA | 9mm | 9mm | 48 | Parallel | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.16mA | Not Qualified | S-PBGA-B48 | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.01A | 15 ns | COMMON | 3V | |||||||||||||||||||||||||||
| 7130LA55L48B | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 125°C | -55°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la55l48b-datasheets-2596.pdf | BQFN | 14.2mm | 14.22mm | 5V | Contains Lead | 10 Weeks | 48 | Parallel | 8 kb | 1.78mm | 2 | No | RAM, SRAM | 20b | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V30L25TFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v30l25tfg-datasheets-2577.pdf | TQFP | 10mm | 10mm | 3.3V | Lead Free | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 8 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 120mA | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 0.5mm | 64 | COMMERCIAL | 30 | SRAMs | 1kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 10b | 1KX8 | 0.003A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||
| 71V2546S133BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2546s133bgi-datasheets-2541.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | OTHER | 20 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||
| 71T75602S133PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s133pfgi8-datasheets-2540.pdf | TQFP | 20mm | 14mm | 2.5V | Lead Free | 100 | 8 Weeks | 2.625V | 2.375V | 100 | Parallel | 18 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 215mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 19b | 0.06A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||
| IDT71V416VL15BE8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vl15be8-datasheets-2530.pdf | TFBGA | 9mm | 9mm | 48 | Parallel | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | COMMERCIAL | 3.6V | 3V | 30 | Not Qualified | S-PBGA-B48 | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 15 ns | |||||||||||||||||||||||||||||||||||
| 7015S17J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7015s17j8-datasheets-2522.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 72 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 9kB | RAM, SDR, SRAM | 3-STATE | 17 ns | 26b | 8KX9 | 0.015A | 9b | Asynchronous | COMMON |
