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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Number of I/O | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | UV Erasable | Core Processor | Connectivity | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S150-1FC1152 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.9mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 12 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S150 | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 574 | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||
| M2S150TS-1FCV484 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 3.15mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BFBGA | 19mm | 19mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | no | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||
| XAZU2EG-1SFVA625I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 3.43mm | ROHS3 Compliant | /files/xilinxinc-xazu5ev1sfvc784q-datasheets-4797.pdf | 625-BFBGA, FCBGA | 21mm | 21mm | 625 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B625 | 128 | DMA, WDT | 1.2MB | MPU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, I2C, SPI, UART/USART, USB | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2FB484I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-BBGA, FCBGA | 484 | 11 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | no | No | 8542.39.00.01 | YES | BOTTOM | BALL | S-PBGA-B484 | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | 256000 | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-2SFVA625E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 180 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-1SFVA625I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 625-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 180 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150TS-FC1152I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | Non-RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||
| XCZU2CG-2SFVC784E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC CG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150TS-FCS536 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | no | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||
| M2S150T-1FCSG536 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||||||
| M2S150TS-1FCG1152 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||
| M2S150T-FCG1152 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.9mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 1.2V | 10 Weeks | 1.26V | 1.14V | 1152 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S150T | NOT SPECIFIED | Field Programmable Gate Arrays | Not Qualified | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||
| XC7Z030-L2FBG484I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 800MHz | 2.54mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-BBGA, FCBGA | 23mm | 23mm | 484 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | not_compliant | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 250 | 1V | 1mm | 1.05V | 0.95V | 30 | S-PBGA-B484 | 130 | DMA | ARM | 256KB | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | |||||||||||||||||||||||||||||
| XCZU2EG-1SBVA484I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 484-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 82 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150T-1FCSG536I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||
| M2S090TS-1FG676 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 425 | 166MHz | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | |||||||||||||||||||||||||||
| M2S150TS-1FC1152 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | |||||||||||||||||||||||||||||
| M2S050TS-1FGG484M | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -55°C~125°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | /files/microsemicorporation-m2s150ts1fc1152m-datasheets-6169.pdf | 484-BGA | 23mm | 23mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 3A001.A.2.C | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B484 | 267 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 267 | 166MHz | 267 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | ||||||||||||||||||||||||||||
| M2S150TS-1FCVG484I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 3.15mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BFBGA | 19mm | 19mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||
| M2S150-1FCG1152 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.9mm | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 12 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S150 | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 574 | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||
| M2S150TS-FCG1152 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2.9mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B1152 | 574 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 574 | 166MHz | 574 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||
| M2S150TS-FCV484I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 3.15mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BFBGA | 19mm | 19mm | 484 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | no | LG-MIN,WD-MIN | 8542.39.00.01 | YES | BOTTOM | BALL | 1.2V | 0.8mm | 1.26V | 1.14V | S-PBGA-B484 | 273 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||
| M2S150-1FCSG536 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 536-LFBGA, CSPBGA | 536 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B536 | 293 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 293 | 166MHz | 293 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | ||||||||||||||||||||||||||||||||
| M2S150-1FCG1152I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | 166MHz | RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 1152-BBGA, FCBGA | 12 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S150 | 1152-FCBGA (35x35) | 574 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 150K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||
| M2S060T-1FGG676I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2.44mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 387 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 387 | 166MHz | 387 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | ||||||||||||||||||||||||||||
| M2S090TS-1FGG676T2 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100, SmartFusion®2 | -40°C~125°C TJ | Tray | 3 (168 Hours) | RoHS Compliant | /files/microsemicorporation-m2s005s1vfg400t2-datasheets-2815.pdf | 676-BGA | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | yes | NOT SPECIFIED | NOT SPECIFIED | 425 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2SBG485E | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | Surface Mount | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 2.44mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 484-FBGA, FCBGA | 19mm | 485 | 10 Weeks | 485 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1.05V | 0.95V | NOT SPECIFIED | Other Microprocessor ICs | 11.8V | Not Qualified | 130 | DMA | ARM | 256KB | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | N | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||
| M2S090T-FG676 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 166MHz | 2.44mm | Non-RoHS Compliant | 2009 | /files/microsemicorporation-m2s005svfg256i-datasheets-1572.pdf | 676-BGA | 27mm | 27mm | 676 | 10 Weeks | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 3 weeks ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | M2S090T | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B676 | 425 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 425 | 425 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | ||||||||||||||||||||||||
| M2S150T-1FCV484I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | 100°C | -40°C | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 484-BFBGA | 1.2V | 10 Weeks | 484 | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-FBGA (19x19) | 273 | DDR, PCIe, SERDES | 64KB | 1 | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 150K Logic Modules | 512KB |
