Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Lifecycle Status | Pbfree Code | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Number of I/O | Memory Type | Peripherals | Core Architecture | RAM Size | Data Bus Width | Speed Grade | Architecture | Number of Outputs | Speed | uPs/uCs/Peripheral ICs Type | Number of Inputs | RAM (words) | Bus Compatibility | Boundary Scan | Core Processor | Connectivity | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Flash Size |
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XCZU9EG-1FFVC900E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 204 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||||||
M2S010-TQG144 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 144 | 11 Weeks | IN PRODUCTION (Last Updated: 2 days ago) | e3 | MATTE TIN | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PQFP-G144 | 84 | DDR, PCIe, SERDES | 64KB | MCU, FPGA | 84 | 166MHz | 84 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||
XC7Z030-1FFG676C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | 0°C~85°C TJ | Tray | 4 (72 Hours) | CMOS | 667MHz | 3.24mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 676-BBGA, FCBGA | 27mm | 1V | 676 | 10 Weeks | 676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z030 | 1.05V | 30 | 130 | DMA | ARM | 256KB | 32b | -1 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 125K Logic Cells | ||||||||||||||||||||||||
M2S005-1VFG256 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.56mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 256-LBGA | 14mm | 14mm | 256 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | LG-MIN, WD-MIN | 8542.39.00.01 | e3 | MATTE TIN | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B256 | 161 | DDR | 64KB | MCU, FPGA | 161 | 166MHz | 161 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | ||||||||||||||||||||||||
5CSEMA6F31C7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSEMA6 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 800MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | ||||||||||||||||||||||||||
XC7Z045-2FFG900E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | 0°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | 800MHz | 3.35mm | ROHS3 Compliant | 2009 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4557.pdf | 900-BBGA, FCBGA | 31mm | 1V | 900 | 10 Weeks | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3A991.D | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | YES | BOTTOM | BALL | 245 | 1V | 1mm | XC7Z045 | 1.05V | 30 | S-PBGA-B900 | 130 | ROMless | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Kintex™-7 FPGA, 350K Logic Cells | |||||||||||||||||||||||
XCZU4CG-1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 11 Weeks | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9EG-2FFVC900I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 900-BBGA, FCBGA | 11 Weeks | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | NOT SPECIFIED | NOT SPECIFIED | 204 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||
10AS032E3F29E2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/intel-10as016e3f27e2sg-datasheets-1713.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 360 | DMA, POR, WDT | 256KB | MCU, FPGA | 360 | 1.5GHz | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | ||||||||||||||||||||||||||||||
XCZU3CG-2SBVA484I | Xilinx Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 484-BFBGA, FCBGA | 484 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | NOT SPECIFIED | R-PBGA-B484 | 82 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||
XCZU2EG-2SFVC784I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | 0.825V | NOT SPECIFIED | R-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||
XCZU3CG-2SFVC784I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Bulk | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||
XCZU2CG-L1SFVC784I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 784-BFBGA, FCBGA | 784 | 11 Weeks | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 252 | DMA, WDT | 256KB | MCU, FPGA | 500MHz, 1.2GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||||||||||||||||
M2S005-VF400I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.51mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 400-LFBGA | 17mm | 17mm | 400 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B400 | 169 | DDR | 64KB | MCU, FPGA | 171 | 166MHz | 171 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | ||||||||||||||||||||||||
5CSEMA6F31C8N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSEMA6 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 600MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | ||||||||||||||||||||||||||
10AS066H3F34I2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.65mm | RoHS Compliant | /files/terasicinc-p0578-datasheets-5343.pdf | 1152-BBGA, FCBGA | 35mm | 35mm | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B1152 | 492 | DMA, POR, WDT | 256KB | MCU, FPGA | 492 | 1.5GHz | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | |||||||||||||||||||||||||||||||
XCZU9EG-2FFVB1156E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC EG | 0°C~100°C TJ | Tray | 4 (72 Hours) | ROHS3 Compliant | 2013 | /files/xilinxinc-xczu7ev1fbvb900e-datasheets-4573.pdf | 1156-BBGA, FCBGA | 11 Weeks | yes | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 328 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||||||||||||||||||||
M2S005S-1VF256 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | CMOS | 1.56mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 256-LFBGA | 14mm | 14mm | 256 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B256 | 161 | DDR | 64KB | MCU, FPGA | 161 | 166MHz | 161 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | |||||||||||||||||||||||
10AS022E3F27E2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.25mm | RoHS Compliant | /files/intel-10as016e3f27e2sg-datasheets-1713.pdf | 672-BBGA, FCBGA | 27mm | 27mm | 672 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B672 | 240 | DMA, POR, WDT | 256KB | MCU, FPGA | 240 | 1.5GHz | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 220K Logic Elements | 220000 | ||||||||||||||||||||||||||||||
M2S005S-TQG144I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 144 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PQFP-G144 | 84 | DDR | 64KB | MCU, FPGA | 84 | 166MHz | 84 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | |||||||||||||||||||||||||
10AS016E3F29I2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/terasicinc-p0578-datasheets-5343.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 288 | DMA, POR, WDT | 256KB | MCU, FPGA | 288 | 1.5GHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | ||||||||||||||||||||||||||||||
M2S005S-VF256I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.56mm | Non-RoHS Compliant | 2015 | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 256-LFBGA | 14mm | 14mm | 256 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | LG-MIN, WD-MIN | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PBGA-B256 | 161 | DDR | 64KB | MCU, FPGA | 161 | 166MHz | 161 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | |||||||||||||||||||||||
XC7Z010-2CLG400E | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq®-7000 | 0°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 766MHz | 1.6mm | ROHS3 Compliant | 2010 | /files/xilinxinc-xc7z007s1clg400c-datasheets-0651.pdf | 400-LFBGA, CSPBGA | 17mm | 1V | 400 | 10 Weeks | 400 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | EAR99 | Copper, Silver, Tin | No | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1V | 0.8mm | XC7Z010 | 1.05V | 130 | DMA | ARM | 256KB | 32b | -2 | MCU, FPGA | 256000 | CAN; ETHERNET; I2C; SPI; UART; USB | YES | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Artix™-7 FPGA, 28K Logic Cells | |||||||||||||||||||||||||
M2S005-1TQG144I | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 1.6mm | RoHS Compliant | /files/microsemicorporation-m2s025vfg256i-datasheets-0685.pdf | 144-LQFP | 20mm | 20mm | 144 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 8542.39.00.01 | e3 | MATTE TIN | YES | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | 1.26V | 1.14V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.2V | Not Qualified | S-PQFP-G144 | 84 | DDR | 64KB | MCU, FPGA | 84 | 166MHz | 84 | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | ||||||||||||||||||||||||||
M2S025T-FGG484 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SmartFusion®2 | 0°C~85°C TJ | Tray | 3 (168 Hours) | 85°C | 0°C | 166MHz | RoHS Compliant | 2009 | /files/microsemicorporation-m2s050tfgg484-datasheets-1246.pdf | 484-BGA | 1.2V | 10 Weeks | 484 | CAN, Ethernet, I2C, SPI, UART, USART, USB | IN PRODUCTION (Last Updated: 1 month ago) | M2S025T | 484-FPBGA (23x23) | 267 | DDR, PCIe, SERDES | ARM | 64KB | MCU, FPGA | 166MHz | ARM® Cortex®-M3 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||
10AS027E3F29I2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/terasicinc-p0578-datasheets-5343.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 360 | DMA, POR, WDT | 256KB | MCU, FPGA | 360 | 1.5GHz | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | ||||||||||||||||||||||||||||||
10AS048E3F29I2SG | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Arria 10 SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 3.35mm | RoHS Compliant | /files/terasicinc-p0578-datasheets-5343.pdf | 780-BBGA, FCBGA | 29mm | 29mm | 780 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | 0.93V | 0.87V | NOT SPECIFIED | Field Programmable Gate Arrays | 0.9V | Not Qualified | S-PBGA-B780 | 360 | DMA, POR, WDT | 256KB | MCU, FPGA | 360 | 1.5GHz | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | ||||||||||||||||||||||||||||||
5CSEMA6F31I7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SE | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/terasicinc-p0286-datasheets-0308.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSEMA6 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 800MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | ||||||||||||||||||||||||||
5CSXFC5D6F31I7N | Intel |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Cyclone® V SX | -40°C~100°C TJ | Tray | 3 (168 Hours) | CMOS | 2mm | RoHS Compliant | 2018 | /files/intel-5cseba5u19c8sn-datasheets-5654.pdf | 896-BGA | 31mm | 31mm | 896 | 8 Weeks | 8542.39.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | 5CSXFC5 | 1.13V | 1.07V | NOT SPECIFIED | Field Programmable Gate Arrays | 1.11.2/3.32.5V | Not Qualified | S-PBGA-B896 | MCU - 181, FPGA - 288 | DMA, POR, WDT | 64KB | MCU, FPGA | 288 | 800MHz | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | ||||||||||||||||||||||||||||
XCZU2CG-2SBVA484I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Zynq® UltraScale+™ MPSoC CG | -40°C~100°C TJ | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | /files/xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf | 484-BFBGA, FCBGA | 484 | 11 Weeks | 8542.31.00.01 | YES | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.876V | NOT SPECIFIED | R-PBGA-B484 | 82 | DMA, WDT | 256KB | MCU, FPGA | 533MHz, 1.3GHz | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
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