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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Technology | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Bandwidth | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Resistance | Number of Pins | Lifecycle Status | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | HTS Code | Packing Method | Number of Functions | Nominal Supply Current | JESD-609 Code | Feature | Terminal Finish | Applications | Polarity | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Power Dissipation | Subcategory | Output Polarity | Power Supplies | Supply Current-Max | Supply Current-Max (Isup) | Qualification Status | Ambient Temperature Range High | JESD-30 Code | Family | Logic IC Type | Supplier Device Package | -3db Bandwidth | Data Rate | Power Consumption | Throw Configuration | Turn On Delay Time | Turn-Off Delay Time | Max Dual Supply Voltage | Dual Supply Voltage | Logic Function | Propagation Delay | Supply Type | Min Dual Supply Voltage | Neg Supply Voltage-Nom (Vsup) | Number of Outputs | On-State Resistance | High Level Output Current | uPs/uCs/Peripheral ICs Type | Input Voltage (Max) | Number of Input Lines | Number of Inputs | Output | Bus Compatibility | On-State Resistance (Max) | Drain to Source Resistance | Off-state Isolation-Nom | On-state Resistance Match-Nom | Switching | Switch-off Time-Max | Switch-on Time-Max | Normal Position | Voltage - Supply, Single/Dual (±) | USB | Signal Current-Max | Multiplexer/Demultiplexer Circuit | Voltage - Supply, Single (V+) | Switch Circuit |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MAX4899AEETE+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | BICMOS | 3μA | 0.8mm | ROHS3 Compliant | 2008 | /files/maximintegrated-max4899eete-datasheets-6180.pdf | 16-WFQFN Exposed Pad | 3mm | 425MHz | 16 | 16 Weeks | Unknown | 3.6V | 2.7V | 12Ohm | 16 | yes | EAR99 | Tin | No | 2 | e3 | Fault Protection, USB 2.0 | USB | 1.667W | QUAD | 260 | 3.3V | 0.5mm | MAX4899 | 16 | 2 | 3/3.3V | 0.6mA | 2.8 μs | 3 ns | Multiplexer | 200 ps | Single | 120mA | 12Ohm | 45 dB | 0.5Ohm | MAKE-BEFORE-BREAK | 4:1 | 2.7V~3.6V | SP4T | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC3312YYP-01 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | ROHS3 Compliant | 2014 | 196-BGA | 8 Weeks | Advanced Signal Equalization | Backplane, Cable Interconnect | 12 | 196-BGA | 8.5 Gbps | 12:12 | 2.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MAX4888BETI+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | 1mA | 0.8mm | ROHS3 Compliant | 2011 | /files/maximintegrated-max4888bgti-datasheets-5879.pdf | 28-WFQFN Exposed Pad | 5.5mm | 28 | 6 Weeks | 8Ohm | 28 | yes | EAR99 | 2 | e3 | Matte Tin (Sn) | PCI Express® | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | MAX4888 | 28 | 3.6V | 2 | NOT SPECIFIED | Multiplexer or Switches | 3.3V | Not Qualified | 8GHz | Single | SEPARATE OUTPUT | 8.4Ohm | 15 dB | 0.2Ohm | BREAK-BEFORE-MAKE | 3V~3.6V | DPDT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEX8714-AB80BI G | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ExpressLane™ | Surface Mount | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | /files/broadcomlimited-pex8714ab80big-datasheets-9652.pdf | 324-BBGA | 324 | 22 Weeks | 8542.31.00.01 | e1 | Configurable | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | S-PBGA-B324 | BUS CONTROLLER, PCI | PCI; I2C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TS3USB221RSER | Texas Instruments | $2.15 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | 30μA | ROHS3 Compliant | /storage/upload/TS3USB221RSER.pdf | 10-UFQFN | 1.5mm | 600μm | 2mm | 3V | 1.1 GHz | Lead Free | 10 | 6 Weeks | 7.002332mg | No SVHC | 3.6V | 2.3V | 6Ohm | 10 | ACTIVE (Last Updated: 5 days ago) | yes | 550μm | 2 | EAR99 | Gold | No | 1 | 30μA | e4 | Bi-Directional, USB 2.0 | USB | YES | QUAD | 260 | 2.5V | 0.5mm | TS3USB221 | 10 | 2 | DIFFERENTIAL MULTIPLEXER | 0.03mA | 480 Mbps | 30 ns | 12 ns | Single | 64mA | 5.5V | 4 | 6Ohm | 40 dB | 0.2Ohm | BREAK-BEFORE-MAKE | 50ns | NO | USB 2.0 | 2:1 | 2.3V~3.6V | SPDT | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| TC7W53FK,LF | Toshiba Semiconductor and Storage |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | RoHS Compliant | 2011 | 8-VFSOP (0.091, 2.30mm Width) | 12 Weeks | 6V | 2V | 8 | yes | No | 7W53 | 2 | SINGLE-ENDED MULTIPLEXER | 6V | 1V | 100Ohm | 2V~6V ±2V~6V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PI3DBS16412ZLCEX | Diodes Incorporated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | RoHS Compliant | /files/diodesincorporated-pi3dbs16412zlcex55-datasheets-7327.pdf | 40-WFQFN Exposed Pad | 20 Weeks | Bi-Directional, USB 3.0, USB 3.1 | PCIe 4.0, USB | 4 | 13GHz | 2:1 | 3.3V | SPDT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TC4W53FU,LF | Toshiba Semiconductor and Storage |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | RoHS Compliant | 2014 | 8-TSSOP, 8-MSOP (0.110, 2.80mm Width) | 12 Weeks | 2 | 160Ohm | 3V~18V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8809AP1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | /files/microchiptechnology-mt8809apr1-datasheets-7684.pdf | 28-LCC (J-Lead) | 11.58mm | 4.57mm | 11.58mm | Lead Free | 28 | 7 Weeks | 1.182714g | 13.2V | 4.5V | 65Ohm | 28 | yes | No | 1 | e3 | MATTE TIN | Telecommunications | QUAD | J BEND | 260 | 5V | 28 | 1 | CROSS POINT SWITCH | 30 | 45MHz | Single | 65Ohm | 95 dB | 5Ohm | 8:8 | 4.5V~13.2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| FSA641UMX | ON Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2016 | /files/onsemiconductor-fsa641umx-datasheets-9726.pdf | 20-UFQFN Exposed Pad | 3mm | 500μm | 3mm | 3V | 20 | 4 Weeks | 122mg | 4.3V | 2.65V | 10Ohm | 20 | ACTIVE (Last Updated: 3 days ago) | yes | EAR99 | 1 | 1A | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | MIPI | QUAD | NO LEAD | NOT SPECIFIED | 2.775V | 0.4mm | FSA641 | 1 | NOT SPECIFIED | 1GHz | Single | 1 | 2 | 14Ohm | 50 dB | 0.75Ohm | 37ns | 2:1 | 2.65V~4.3V | SPDT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HV2701FG-G-M931 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C TA | Cut Tape (CT) | 3 (168 Hours) | CMOS | 7mA | 1.6mm | ROHS3 Compliant | 2011 | /files/microchiptechnology-hv2701bdm936-datasheets-8476.pdf | 48-LQFP | 7mm | 10μA | 48 | 7 Weeks | 181.692094mg | 5.5V | 3V | 38Ohm | 48 | yes | Tin | 16 | Ultrasound | 1W | QUAD | GULL WING | 3.3V | 0.5mm | HV2701 | 1 | 1W | 50MHz | 5 μs | 5 μs | 200V | 100V | Dual | 40V | 16 | 38Ohm | 33 dB | 1.9Ohm | 5000ns | 5000ns | 40V~200V ±40V~160V | 1:1 | SPST | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEX8724-CA80BC G | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ExpressLane™ | Surface Mount | Tray | 4 (72 Hours) | ROHS3 Compliant | 2016 | 22 Weeks | 8542.31.00.01 | Configurable | PCI Express® | 324-FCBGA (19x19) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| FSA2268L10X | ON Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2013 | /files/onsemiconductor-fsa2268tumx-datasheets-6445.pdf | 10-UFQFN Exposed Pad | 2.1mm | 500μm | 1.6mm | 100nA | 10 | 6 Weeks | 26mg | 4.3V | 1.65V | 300mOhm | 10 | ACTIVE (Last Updated: 1 week ago) | yes | EAR99 | No | 2 | e4 | Break-Before-Make | Nickel/Palladium/Gold (Ni/Pd/Au) | Audio | QUAD | 3V | 0.5mm | FSA2268 | 2 | Multiplexer or Switches | 1.8/4V | 50MHz | 65 ns | 40 ns | Single | SEPARATE OUTPUT | 300mOhm Typ | 70 dB | 1Ohm | 2:1 | 1.65V~4.3V | SPDT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| FSUSB30MUX | ON Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | SMD/SMT | ROHS3 Compliant | 2011 | /files/onsemiconductor-fsusb30umx-datasheets-9455.pdf | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | 3mm | 1.1mm | 3mm | 720MHz | Lead Free | 10 | 6 Weeks | 112.5mg | No SVHC | 4.3V | 3V | 10Ohm | 10 | ACTIVE (Last Updated: 3 days ago) | yes | EAR99 | No | 1 | e4 | Break-Before-Make, USB 2.0 | Nickel/Palladium/Gold (Ni/Pd/Au) | USB | DUAL | GULL WING | 3.3V | 0.5mm | FSUSB30 | 1 | Multiplexer or Switches | 480 Mbps | DPST | 7 ns | 4 ns | 250 ps | Single | 4 | 2 | 10Ohm | 4.5Ohm | 30 dB | 0.35Ohm | 30ns | USB 2.0 | 3V~4.3V | DPDT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HV20220FG-G | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 7mA | ROHS3 Compliant | 2013 | /files/microchiptechnology-hv20220pjg-datasheets-6300.pdf | 48-LQFP | 7mm | 1.4mm | 7mm | 12V | 10μA | 48 | 7 Weeks | 181.692094mg | 13.2V | 4.5V | 38Ohm | 48 | ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY | No | 1 | e3 | Matte Tin (Sn) - annealed | Ultrasound | 1W | QUAD | GULL WING | 260 | 5V | 0.5mm | HV20220 | 8 | SINGLE-ENDED MULTIPLEXER | 40 | 1W | Multiplexer or Switches | 50MHz | 5 μs | 5 μs | 200V | 100V | Dual | 40V | 8 | 38Ohm | 33 dB | 1.35Ohm | 5000ns | 5000ns | NO | 40V~200V ±40V~160V | 1:1 | SPST | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEX8606-BA50BI G | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ExpressLane™ | Surface Mount | Tray | 3 (168 Hours) | CMOS | 1.9mm | ROHS3 Compliant | 15mm | 15mm | 196 | 22 Weeks | 8542.31.00.01 | e1 | Configurable | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | INDUSTRIAL | 85°C | -40°C | 1.05V | 0.95V | 6 | NOT SPECIFIED | 2030mA | 196-PBGA (15x15) | BUS CONTROLLER, PCI | I2C, SMBUS, SPI, USB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HV2802GA-G | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | 1mm | ROHS3 Compliant | 2014 | /files/microchiptechnology-hv2802gag-datasheets-9456.pdf | 78-VFBGA | 9mm | 9mm | 78 | 7 Weeks | 78 | 8542.39.00.01 | 1 | Ultrasound | YES | BOTTOM | BALL | 5V | 0.65mm | HV2802 | 32 | 8mA | 100V | 38Ohm | -60 dB | 5000ns | 5000ns | NO | 40V~200V ±40V~160V | 3A | 1:1 | SPST | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS100MB203SQE/NOPB | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 2 (1 Year) | 160mA | ROHS3 Compliant | 54-WFQFN Exposed Pad | 10mm | 800μm | 5.5mm | Lead Free | 54 | 6 Weeks | 54 | ACTIVE (Last Updated: 1 week ago) | yes | 800μm | 5A991.B | Tin | TR | 2 | e3 | Equalization, RXAUI, SATA, XAUI | Networking, Telecommunications | QUAD | NO LEAD | 260 | 2.5V | 0.5mm | DS100MB203 | 54 | 2.625V | 4 | NOT SPECIFIED | COMPLEMENTARY | 100 | LOGIC CIRCUIT | 390mW | Single | 2:1, 1:2 | 2.38V~2.63V 3V~3.6V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEX8747-CA80BC G | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ExpressLane™ | Surface Mount | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | 676 | 22 Weeks | e1 | Configurable | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | NOT SPECIFIED | NOT SPECIFIED | S-PBGA-B676 | 676-FCBGA (27x27) | BUS CONTROLLER, PCI | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEX8733-CA80BC G | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ExpressLane™ | Surface Mount | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 2016 | 676 | 22 Weeks | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 32 | S-PBGA-B676 | 676-FCBGA (27x27) | BUS CONTROLLER, PCI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEX8617-BA50BC G | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ExpressLane™ | Surface Mount | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 324 | 22 Weeks | 8542.31.00.01 | e1 | Configurable | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | NOT SPECIFIED | NOT SPECIFIED | S-PBGA-B324 | 324-PBGA (19x19) | BUS CONTROLLER, PCI | PCI; I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEX8749-CA80BC G | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ExpressLane™ | Surface Mount | Tray | 4 (72 Hours) | CMOS | ROHS3 Compliant | 676 | 22 Weeks | 8542.31.00.01 | e1 | Configurable | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | S-PBGA-B676 | 676-FCBGA (27x27) | BUS CONTROLLER, PCI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PEX8734-AB80BI G | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ExpressLane™ | Surface Mount | 4 (72 Hours) | CMOS | ROHS3 Compliant | /files/broadcomlimited-pex8734ab80big-datasheets-9507.pdf | 676 | 22 Weeks | 8542.31.00.01 | e1 | Configurable | Tin/Silver/Copper (Sn/Ag/Cu) | PCI Express® | YES | BOTTOM | BALL | S-PBGA-B676 | 676-FCBGA (27x27) | BUS CONTROLLER, PCI | PCI; I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HV2201FG-G-M931 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 5mA | 1.6mm | ROHS3 Compliant | 2011 | /files/microchiptechnology-hv2201pjgm904-datasheets-8278.pdf | 48-LQFP | 7mm | 10μA | 48 | 16 Weeks | 181.692094mg | 5.5V | 3V | 38Ohm | 48 | yes | IT ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY | 8 | Ultrasound | 1W | QUAD | GULL WING | 5V | 0.5mm | HV2201 | 8 | SINGLE-ENDED MULTIPLEXER | 50MHz | 5 μs | 5 μs | 200V | 100V | Dual | 40V | 19Ohm | 33 dB | 5Ohm | 5000ns | 5000ns | 40V~200V ±40V~160V | 1:1 | SPST | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| GX4002-INE3 | Semtech Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~100°C TA | Tray | 3 (168 Hours) | RoHS Compliant | 1996 | /files/semtech-gx4002ine3-datasheets-8615.pdf | QFN EP | 3.3V | Lead Free | 16 Weeks | 3.47V | 2.8V | 32 | yes | No | I2C | TELECOM CIRCUIT | 1 | 32-QFN (5x5) | Single | 2:2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8816AP1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | /files/microchiptechnology-mt8816af1-datasheets-6081.pdf | 44-LCC (J-Lead) | 16.66mm | 4.57mm | 16.66mm | Lead Free | 44 | 7 Weeks | 2.386605g | 13.2V | 4.5V | 65Ohm | 44 | yes | No | 1 | e3 | MATTE TIN | Telecommunications | QUAD | J BEND | 260 | 5V | 44 | 1 | CROSS POINT SWITCH | 30 | 45MHz | Single | -7V | 65Ohm | 95 dB | 5Ohm | 4.5V~13.2V ±4.5V | 8:16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MAX4740ETE+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | BICMOS | 300nA | ROHS3 Compliant | 2008 | /files/maximintegrated-max5858aecmd-datasheets-5095.pdf | 16-WFQFN Exposed Pad | 3.1mm | 1mm | 3.1mm | 1μA | 16 | 17 Weeks | Unknown | 5.5V | 1.6V | 900mOhm | 16 | yes | EAR99 | No | 4 | 300nA | e3 | Matte Tin (Sn) | Audio | 1.25W | QUAD | 260 | 3.3V | 0.5mm | MAX4740 | 16 | 4 | 30 | Multiplexer or Switches | 3/5V | 70 ns | 210 ns | Single | SEPARATE OUTPUT | 900mOhm | 64 dB | 0.06Ohm | 55ns | 2:1 | 1.6V~5.5V | SPDT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MAX4890ETJ+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | BICMOS | 280μA | ROHS3 Compliant | 2006 | /files/maximintegrated-max5858aecmd-datasheets-5095.pdf | 32-WFQFN Exposed Pad | 5.1mm | 750μm | 5.1mm | 650MHz | 32 | 6 Weeks | Unknown | 3.6V | 3V | 5.5Ohm | 32 | yes | EAR99 | No | 1 | e3 | Differential Compatibility, LAN, 1000 Base-T | Matte Tin (Sn) | Networking | QUAD | 260 | 3.3V | 0.5mm | MAX4890 | 32 | LAN SWITCHING CIRCUIT | 4 | 50 ns | 50 ns | 100 ps | Single | 5.5Ohm | 2:1 | 3V~3.6V | SPDT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| FSA2567UMX | ON Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | 2013 | /files/onsemiconductor-fsa2567umx-datasheets-8594.pdf | 16-UFQFN | 1.8mm | 550μm | 2.6mm | Lead Free | 15μA | 16 | 6 Weeks | 6.54mg | No SVHC | 4.3V | 1.65V | 600mOhm | 16 | ACTIVE (Last Updated: 3 days ago) | yes | EAR99 | Gold | No | 1 | 1μA | e4 | Break-Before-Make | Telecommunications | Non-Inverting | QUAD | 3.3V | FSA2567 | 1 | Multiplexer or Switches | 85°C | 475MHz | 80 ns | 40 ns | Single | 8 | 400mOhm | 4 | 10Ohm | 60 dB | 0.2Ohm | 50ns | 95ns | 1.65V~4.3V | 4PDT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PI3DBS16212XUAEX | Diodes Incorporated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | RoHS Compliant | /files/diodesincorporated-pi3dbs16212zbbex-datasheets-0005.pdf | 18-XFQFN Exposed Pad | 20 Weeks | Bi-Directional, USB 3.0, USB 3.1 | USB | 2 | 13GHz | 2:1 | 3.3V | SPDT |
