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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Operating Supply Current | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Consumer IC Type | Data Rate | Frequency (Max) | uPs/uCs/Peripheral ICs Type | Number of Transmitters | Bus Compatibility | Number of External Interrupts | Clock Frequency | Data Transfer Rate-Max | External Data Bus Width | Drive Interface Standard |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 89H64H16G3YCBLI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 | CMOS | 3.42mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h64h16g3ycbli-datasheets-7655.pdf | 35mm | 35mm | Contains Lead | 1156 | no | 2.82mm | EAR99 | not_compliant | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 1V | 1mm | INDUSTRIAL | 85°C | -40°C | 1.1V | 0.95V | NOT SPECIFIED | Bus Controllers | 11.83.3V | 8625mA | Not Qualified | BUS CONTROLLER, PCI | ISA; VGA | 100MHz | IEEE 1149.6AC; IEEE 1149.1 | ||||||||||||||||||||||||||||||||
| 89HP0504PZBAB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | Non-RoHS Compliant | 2011 | /files/integrateddevicetechnology-89hp0504pzbab-datasheets-7641.pdf | 9mm | 9mm | Contains Lead | 100 | 10 Weeks | 100 | PCI Express | no | 1.7mm | EAR99 | ALSO AVAILABLE 3.3V SUPPLY-NOM FOR I2C | Lead, Tin | not_compliant | 8542.39.00.01 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 240 | 0.8mm | 100 | COMMERCIAL | 70°C | 1.26V | 1.14V | NOT SPECIFIED | CONSUMER CIRCUIT | ||||||||||||||||||||||||||||||||||||
| 89H64H16G3YCBLGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 | CMOS | 3.42mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h64h16g3ycblgi-datasheets-7569.pdf | 35mm | 35mm | Lead Free | 1156 | yes | 2.82mm | EAR99 | 8542.39.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 245 | 1V | 1mm | INDUSTRIAL | 85°C | -40°C | 1.1V | 0.95V | NOT SPECIFIED | Bus Controllers | 11.83.3V | 8625mA | Not Qualified | BUS CONTROLLER, PCI | ISA; VGA | 100MHz | IEEE 1149.6AC; IEEE 1149.1 | |||||||||||||||||||||||||||||||||
| 89H64H16G3YCBL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 | CMOS | 3.42mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h64h16g3ycbl-datasheets-7467.pdf | 35mm | 35mm | Contains Lead | 1156 | no | 2.82mm | EAR99 | not_compliant | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 1V | 1mm | COMMERCIAL | 70°C | 1.1V | 0.95V | NOT SPECIFIED | Bus Controllers | 11.83.3V | 8625mA | Not Qualified | BUS CONTROLLER, PCI | ISA; VGA | 100MHz | IEEE 1149.6AC; IEEE 1149.1 | |||||||||||||||||||||||||||||||||
| 89H48H12G3YCHLI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 | CMOS | 2.9mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h48h12g3ychli-datasheets-7119.pdf | 27mm | 27mm | Contains Lead | 676 | 676 | no | 3.2mm | EAR99 | not_compliant | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 1V | 1mm | 676 | INDUSTRIAL | 85°C | -40°C | 1.1V | 0.95V | NOT SPECIFIED | Bus Controllers | 11.83.3V | 7420mA | Not Qualified | BUS CONTROLLER, PCI | ISA; VGA | 100MHz | IEEE 1149.6AC; IEEE 1149.1 | ||||||||||||||||||||||||||||||
| 89H48H12G3YCHLGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 | CMOS | 2.9mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h48h12g3ychlgi-datasheets-7040.pdf | 27mm | 27mm | Lead Free | 676 | 676 | yes | 3.2mm | EAR99 | 8542.39.00.01 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1V | 1mm | 676 | INDUSTRIAL | 85°C | -40°C | 1.1V | 0.95V | NOT SPECIFIED | Bus Controllers | 11.83.3V | 7420mA | Not Qualified | BUS CONTROLLER, PCI | ISA; VGA | 100MHz | IEEE 1149.6AC; IEEE 1149.1 | |||||||||||||||||||||||||||||||
| 89H48H12G3YCHL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 | CMOS | 2.9mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h48h12g3ychl-datasheets-6938.pdf | 27mm | 27mm | Contains Lead | 676 | 676 | no | 3.2mm | EAR99 | not_compliant | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 1V | 1mm | 676 | COMMERCIAL | 70°C | 1.1V | 0.95V | NOT SPECIFIED | Bus Controllers | 11.83.3V | 7420mA | Not Qualified | BUS CONTROLLER, PCI | ISA; VGA | 100MHz | IEEE 1149.6AC; IEEE 1149.1 | |||||||||||||||||||||||||||||||
| QLX4600SIQSR | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | 0°C | 260mA | 0.75mm | RoHS Compliant | 2009 | /files/intersil-qlx4600siqsr-datasheets-6780.pdf | QFN EP | 7mm | 4mm | 1.2V | Lead Free | 46 | 9 Weeks | 1.3V | 1.1V | 46 | 8542.39.00.01 | 1 | 260mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | NO LEAD | 260 | 1.2V | 0.4mm | 46 | COMMERCIAL | TELECOM CIRCUIT | 30 | Other Telecom ICs | Not Qualified | 6.25 Gbps | |||||||||||||||||||||||||||||||||
| 89H48H12G2ZCBL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 70°C | 0°C | CMOS | 3.22mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h48h12g2zcbl-datasheets-6726.pdf | FCBGA | 27mm | 27mm | 3.3V | Contains Lead | 676 | 10 Weeks | 676 | PCI Express | no | 3.4mm | 12 | EAR99 | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | 676 | COMMERCIAL | 1.1V | NOT SPECIFIED | Bus Controllers | Not Qualified | 384 Gbps | 125MHz | BUS CONTROLLER, PCI | I2C; ISA; VGA; SMBUS | 48 MBps | ||||||||||||||||||||||||||
| TW3811-TC1-CRT | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 2010 | /files/intersil-tw3811tc1crt-datasheets-6669.pdf | 23 Weeks | 100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89H32H8G3YCHLI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32h8g3ychli-datasheets-6524.pdf | 23mm | 23mm | Contains Lead | 484 | 484 | no | 2.92mm | EAR99 | not_compliant | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 1V | 1mm | 484 | INDUSTRIAL | 85°C | -40°C | 1.1V | 0.95V | NOT SPECIFIED | Bus Controllers | 13.3V | 6225mA | Not Qualified | BUS CONTROLLER, PCI | ISA; VGA | 100MHz | IEEE 1149.6AC; IEEE 1149.1 | |||||||||||||||||||||||||||||||
| 89H32H8G3YCHL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32h8g3ychl-datasheets-6430.pdf | 23mm | 23mm | Contains Lead | 484 | 484 | no | 2.92mm | EAR99 | not_compliant | 8542.39.00.01 | e0 | TIN LEAD | YES | BOTTOM | BALL | 225 | 1V | 1mm | 484 | COMMERCIAL | 70°C | 1.1V | 0.95V | NOT SPECIFIED | Bus Controllers | 13.3V | 6225mA | Not Qualified | BUS CONTROLLER, PCI | ISA; VGA | 100MHz | IEEE 1149.6AC; IEEE 1149.1 | ||||||||||||||||||||||||||||||||
| IS82C59A-12 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | CMOS | RoHS Compliant | 2001 | /files/intersil-is82c59a12-datasheets-6362.pdf | PLCC | 5.5V | Contains Lead | 28 | 3 Weeks | 28 | no | No | e0 | Tin/Lead (Sn/Pb) | QUAD | J BEND | 5V | 1.27mm | 28 | INDUSTRIAL | 85°C | -40°C | Interrupt Controllers | 5V | 12.5mA | INTERRUPT CONTROLLER | 8 | 12.5MHz | 8 | ||||||||||||||||||||||||||||||||||||||
| TSI107D-133LE | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 105°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi107d133le-datasheets-6207.pdf | FCBGA | 33mm | 33mm | Contains Lead | 503 | 503 | PCI | no | 2.75mm | EAR99 | No | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 503 | 2.625V | 2.375V | POWERPC 60X | 66MHz | |||||||||||||||||||||||||||||||||||||
| TSI350A-66CQY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 85°C | 0°C | CMOS | 4.1mm | RoHS Compliant | PQFP | 28mm | 28mm | Lead Free | 208 | 208 | PCI | yes | 3.5mm | EAR99 | No | 8542.39.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 208 | OTHER | 3.6V | 3V | PCI | 66MHz | |||||||||||||||||||||||||||||||||||||
| TSI108-200CL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | CMOS | 2.76mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-tsi108200cl-datasheets-5902.pdf | FCBGA | 33mm | 33mm | Contains Lead | 1023 | PCI | no | 2mm | 3A991.A.2 | not_compliant | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.2V | 1mm | COMMERCIAL | 70°C | 1.26V | 1.14V | NOT SPECIFIED | Not Qualified | POWERPC 60X | 33.33MHz | ||||||||||||||||||||||||||||||||||||
| 89HPES24N3A1ZCBXG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 | 70°C | 0°C | CMOS | 1.7mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24n3a1zcbxg-datasheets-5833.pdf | BGA | 27mm | 27mm | 420 | 10 Weeks | 420 | PCI Express | yes | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||||
| 89HPES48T12ZABLI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes48t12zabli-datasheets-5579.pdf | FCBGA | 35mm | 2.82mm | 35mm | Contains Lead | 10 Weeks | 1156 | PCI Express | no | 2.82mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | INDUSTRIAL | 85°C | -40°C | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 13.3V | 2635mA | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||
| TW3801-TC1-CRT | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 2012 | /files/intersil-tw3801tc1crt-datasheets-5497.pdf | TQFP | 23 Weeks | 3.3V | 1.8V | 100 | 36 Mbps | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89H32NT8AG2ZCHLG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 4 | 70°C | 0°C | CMOS | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32nt8ag2zchlg8-datasheets-5451.pdf | FCBGA | 23mm | 2.92mm | 23mm | 3.3V | Lead Free | 10 Weeks | 484 | PCI Express | yes | 2.92mm | 8 | EAR99 | Copper, Silver, Tin | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | 484 | 30 | 256 Gbps | 125MHz | BUS CONTROLLER, PCI | ||||||||||||||||||||||||||||||||||||||
| 89HPES32H8ZAAL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 4 | 70°C | 0°C | CMOS | 3.42mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes32h8zaal-datasheets-5412.pdf | FCBGA | 31mm | 31mm | 3.3V | Contains Lead | 900 | 10 Weeks | 900 | PCI Express | no | 2.82mm | 8 | EAR99 | Lead, Tin | not_compliant | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 900 | COMMERCIAL | 1.1V | NOT SPECIFIED | Bus Controllers | Not Qualified | 128 Gbps | 125MHz | BUS CONTROLLER, PCI | PCI | ||||||||||||||||||||||||||||
| 89H32T8G2ZCBL8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 70°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89h32t8g2zcbl8-datasheets-5323.pdf | FCBGA | 23mm | 3.34mm | 23mm | 3.3V | Contains Lead | 484 | 10 Weeks | 484 | PCI Express | no | 3.34mm | 8 | EAR99 | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | not_compliant | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | 484 | COMMERCIAL | 1.1V | NOT SPECIFIED | 256 Gbps | 125MHz | BUS CONTROLLER, PCI | I2C; ISA; SMBUS; VGA | 32000 MBps | |||||||||||||||||||||||||||||
| 89HPES4T4G2ZCALG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 4 | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | /files/integrateddevicetechnology-89hpes4t4g2zcalg8-datasheets-5246.pdf | FCBGA | 19mm | 3.27mm | 19mm | Lead Free | 324 | 10 Weeks | 324 | PCI Express | yes | 3.27mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 324 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 13.3V | Not Qualified | BUS CONTROLLER, PCI | PCI; SMBUS | 100MHz | ||||||||||||||||||||||||||||
| 89HPES24T6G2ZBALG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 4 | 70°C | 0°C | CMOS | 3.42mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t6g2zbalg8-datasheets-5197.pdf | FCBGA | 19mm | 19mm | Lead Free | 324 | 10 Weeks | 324 | PCI Express | yes | 3.27mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 324 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | Bus Controllers | 13.3V | Not Qualified | BUS CONTROLLER, PCI | PCI; SMBUS | 100MHz | ||||||||||||||||||||||||||||
| 89HPES24T6G2ZBALG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 70°C | 0°C | CMOS | 3.42mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t6g2zbalg-datasheets-5184.pdf | FCBGA | 19mm | 19mm | Lead Free | 324 | 10 Weeks | 324 | PCI Express | yes | 3.27mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 324 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 13.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||||
| 89HPES24T61ZCBX | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.7mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t61zcbx-datasheets-5086.pdf | BGA | 27mm | 27mm | 420 | 10 Weeks | 420 | PCI Express | no | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 420 | COMMERCIAL | 1.1V | 0.9V | 20 | Bus Controllers | 3.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | ||||||||||||||||||||||||||||||
| ID82C59A-12 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | CMOS | Non-RoHS Compliant | 2017 | /files/intersil-id82c59a12-datasheets-5061.pdf | 28 | not_compliant | e0 | Tin/Lead (Sn/Pb) | NO | DUAL | THROUGH-HOLE | 5V | 2.54mm | 28 | INDUSTRIAL | 85°C | -40°C | 5.5V | 4.5V | Interrupt Controllers | 5V | 12.5mA | Not Qualified | R-GDIP-T28 | INTERRUPT CONTROLLER | 80C86; 80C88; 80C286; 8080; 8085; 8086; 8088; 80286; NSC800 | 8 | 12.5MHz | 8 | |||||||||||||||||||||||||||||||||||||||||
| 89HPES24T3G2ZCALG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 4 | 70°C | 0°C | CMOS | 3.42mm | RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t3g2zcalg8-datasheets-5039.pdf | FCBGA | 19mm | 19mm | Lead Free | 324 | 10 Weeks | 324 | PCI Express | yes | 3.27mm | EAR99 | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | Copper, Silver, Tin | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 1mm | 324 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | BUS CONTROLLER, PCI | SMBUS | 625 MBps | ||||||||||||||||||||||||||||||
| 89HPES24T3G2ZCAL | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 | 70°C | 0°C | CMOS | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t3g2zcal-datasheets-4913.pdf | FCBGA | 19mm | 3.27mm | 19mm | Contains Lead | 324 | 10 Weeks | 324 | PCI Express | no | 3.27mm | EAR99 | ALSO REQUIRES 3.3V SUPPLY | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 324 | COMMERCIAL | 1.1V | 0.9V | 30 | Bus Controllers | 12.53.3V | Not Qualified | BUS CONTROLLER, PCI | PCI | 125MHz | |||||||||||||||||||||||||||
| 89HPES24T3G2ZBAL8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 4 | 70°C | 0°C | CMOS | 3.42mm | Non-RoHS Compliant | 1999 | /files/integrateddevicetechnology-89hpes24t3g2zbal8-datasheets-4795.pdf | FCBGA | 19mm | 19mm | Contains Lead | 324 | 10 Weeks | 324 | PCI Express | no | 3.27mm | EAR99 | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | Lead, Tin | not_compliant | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 1mm | 324 | COMMERCIAL | 1.1V | 0.9V | NOT SPECIFIED | BUS CONTROLLER, PCI | SMBUS | 625 MBps |
