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ContactSpecialized Power Management ICs(5989)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | ECCN Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | JESD-30 Code | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC33PF8100CFEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8200d2es-datasheets-8780.pdf | 56-VFQFN Exposed Pad | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||
| ACT8893 | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ActivePMU™ | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | /files/qorvousinc-act8893-datasheets-5905.pdf | 32-WFQFN Exposed Pad | Processor | 32-TQFN (5x5) | |||||||||||||||||||||||||||||||||||
| MC33PF8200CLES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8200d2es-datasheets-8780.pdf | 56-VFQFN Exposed Pad | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||
| UCC2976PW | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tube | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| MC34PF8100CDEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | 56-VFQFN Exposed Pad | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||
| ACT8937QJ2FA-T | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 40-WFQFN Exposed Pad | 40-TQFN (5x5) | ||||||||||||||||||||||||||||||||||||||
| MC34PF8100CGEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | 56-VFQFN Exposed Pad | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||
| MC33PF8200DAES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8200d2es-datasheets-8780.pdf | 56-VFQFN Exposed Pad | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||
| MC33909L5AD | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | MOS | 7mA | 1.6mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | EAR99 | 8542.39.00.01 | 1 | e3 | Tin (Sn) | System Basis Chip | YES | 3.5V~28V | QUAD | GULL WING | 260 | 0.5mm | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | NO | S-PQFP-G48 | ||||||||||||
| MC33909Q5ADR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | MOS | 7mA | 1.6mm | ROHS3 Compliant | 2006 | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | EAR99 | 8542.39.00.01 | 1 | e3 | Tin (Sn) | System Basis Chip | YES | 3.5V~28V | QUAD | GULL WING | 260 | 0.5mm | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | NO | S-PQFP-G48 | |||||||||||
| MC34PF1550A0EP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | ||||||||||||||||||||||||||||||||
| MC34PF8100CEEP | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | 56-VFQFN Exposed Pad | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||
| MWCT1013VLHSTR | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 1 (Unlimited) | 64-LQFP | General Purpose | 2.7V~3.6V | TELECOM CIRCUIT | |||||||||||||||||||||||||||||||||||
| MC34PF1550A0EPR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | 14 Weeks | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | 260 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | |||||||||||||||||||||||||||||||
| MWCT1013VLHST | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C TA | Tray | 1 (Unlimited) | 64-LQFP | 13 Weeks | General Purpose | 2.7V~3.6V | |||||||||||||||||||||||||||||||||||
| MC33PF8200DGES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8200d2es-datasheets-8780.pdf | 56-VFQFN Exposed Pad | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||
| MC33PF8100CGES | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount, Wettable Flank | -40°C~105°C TA | Tray | 3 (168 Hours) | /files/nxpusainc-mc33pf8200d2es-datasheets-8780.pdf | 56-VFQFN Exposed Pad | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||
| NX1A4WPZ | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 1 (Unlimited) | 12mA | ROHS3 Compliant | 2014 | /files/nxpusainc-nx1a4wpz-datasheets-5876.pdf | 42-UFBGA, WLCSP | Wireless Power Receiver | 6.1V~18V | ||||||||||||||||||||||||||||||||
| UC3901Q | Rochester Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tube | 2 (1 Year) | BIPOLAR | 4.57mm | Non-RoHS Compliant | 8.965mm | 8.965mm | 20 | 8542.39.00.01 | 1 | YES | QUAD | J BEND | 10V | 1.27mm | COMMERCIAL | 70°C | 40V | 4.5V | ANALOG CIRCUIT | S-PQCC-J20 | ||||||||||||||||||||||
| NX2A4WPZ | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Bulk | 1 (Unlimited) | 12mA | ROHS3 Compliant | /files/nxpusainc-nx2a4wpz-datasheets-5888.pdf | 42-UFBGA, WLCSP | Wireless Power Receiver | 6.1V~18V | |||||||||||||||||||||||||||||||||
| MC33909N3AD | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | MOS | 7mA | 1.6mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | EAR99 | 8542.39.00.01 | 1 | e3 | Tin (Sn) | System Basis Chip | YES | 3.5V~28V | QUAD | GULL WING | 260 | 0.5mm | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | NO | S-PQFP-G48 | ||||||||||||
| MC33909Q3ADR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | MOS | 7mA | 1.6mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | EAR99 | 8542.39.00.01 | 1 | e3 | Tin (Sn) | System Basis Chip | YES | 3.5V~28V | QUAD | GULL WING | 260 | 0.5mm | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | NO | S-PQFP-G48 | ||||||||||||
| ACT8937QJ11C-T | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 40-WFQFN Exposed Pad | 40-TQFN (5x5) | ||||||||||||||||||||||||||||||||||||||
| ACT8810QJ34B-T | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 40-WFQFN Exposed Pad | 40-TQFN (5x5) | ||||||||||||||||||||||||||||||||||||||
| ACT8892Q4I14C-T | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | 32-WFQFN Exposed Pad | 32-TQFN (4x4) | ||||||||||||||||||||||||||||||||||||||
| ACT8935QJ10D-T | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ActivePath™, ActivePMU™ | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 420μA | /files/qorvousinc-act8935-datasheets-5775.pdf | Processor | 2.7V~5.5V | |||||||||||||||||||||||||||||||||||
| MC33909N5ADR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | MOS | 7mA | 1.6mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | EAR99 | 8542.39.00.01 | 1 | e3 | Tin (Sn) | System Basis Chip | YES | 3.5V~28V | QUAD | GULL WING | 260 | 0.5mm | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | NO | S-PQFP-G48 | ||||||||||||
| MC33909L3ADR2 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | MOS | 7mA | 1.6mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | 7mm | 48 | EAR99 | 8542.39.00.01 | 1 | e3 | Tin (Sn) | System Basis Chip | YES | 3.5V~28V | QUAD | GULL WING | 260 | 0.5mm | 5V | 3.3V | 3 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | NO | S-PQFP-G48 | ||||||||||||
| ACT9040VM337-T | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | |||||||||||||||||||||||||||||||||||||||||
| ACT8931AQJ460-T | Qorvo US Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ActivePath™, ActivePMU™ | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | 65μA | Processor | 2.5V~5.5V |
