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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Resistance | Number of Pins | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Polarity | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Operating Temperature (Max) | Operating Temperature (Min) | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Number of Elements | Subcategory | Output Polarity | Power Supplies | Qualification Status | JESD-30 Code | Family | Logic IC Type | Max Output Current | Number of Bits | Differential Output | Interface IC Type | Forward Current | Forward Voltage | Turn On Delay Time | Max Surge Current | Max Reverse Leakage Current | Logic Function | Propagation Delay | Frequency (Max) | Number of Outputs | High Level Output Current | Low Level Output Current | Quiescent Current | Power Dissipation-Max | Direction | Peak Reverse Current | Max Repetitive Reverse Voltage (Vrrm) | Reverse Recovery Time | Recovery Time | Number of Signal Lines | Output Peak Current Limit-Nom | Output Current Flow Direction | Number of Inputs | Output Characteristics | Trigger Type | fmax-Min | Control Type | Translation | Prop. Delay@Nom-Sup | Clock Edge Trigger Type | Propagation Delay (tpd) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SN74S1053PWRG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel | 1 | 70°C | 0°C | 1.2mm | RoHS Compliant | TSSOP | 6.5mm | 4.4mm | Lead Free | 20 | 20 | EAR99 | No | 8542.39.00.01 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | GULL WING | 260 | 5V | 0.65mm | 20 | COMMERCIAL | 16 | NO | DIODE BUS TERMINATION ARRAY | 170mA | 5μA | 7V | 16 ns | 16 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SN74S1053PWG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 1 | 70°C | 0°C | RoHS Compliant | TSSOP | 6.5mm | 1.15mm | 4.4mm | Lead Free | 20 | 20 | EAR99 | No | 8542.39.00.01 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | GULL WING | 260 | 5V | 0.65mm | 20 | COMMERCIAL | 16 | NO | DIODE BUS TERMINATION ARRAY | 170mA | 1.45V | 1.2A | 625mW | 5μA | 7V | 16 ns | 8 ns | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 74F382 | Fairchild (ON Semiconductor) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SSTUAF32868AHLFT | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | 410MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-sstuaf32868ahlft-datasheets-1454.pdf | TFBGA | 15mm | 6mm | 1.8V | Lead Free | 176 | 1.9V | 1.7V | 176 | yes | 1.2mm | EAR99 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 176 | COMMERCIAL | NOT SPECIFIED | 1 | Other Logic ICs | Not Qualified | D FLIP-FLOP | 28 | Buffer | 3 ns | 410MHz | 56 | -6mA | 6mA | OPEN-DRAIN | Positive Edge | |||||||||||||||||||||||||||||||||||||||||||||||||||
| SN74LVTH18646APMG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 | 85°C | -40°C | BICMOS | RoHS Compliant | LQFP | 10mm | 1.4mm | 10mm | Lead Free | 64 | 342.689036mg | 3.6V | 2.7V | 64 | 2 | No | 2 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | Non-Inverting | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 64 | INDUSTRIAL | 2 | Bus Driver/Transceivers | 3.3V | LVT | BOUNDARY SCAN REG BUS TRANSCEIVER | 18 | 20 ns | AND, Transceiver | 20 ns | -32mA | 64mA | 20mA | Bidirectional | 3-STATE | POSITIVE EDGE | COMMON CONTROL | N/A | 4.7 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
| ISL55100BIRZ-T | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 85°C | -40°C | CMOS | RoHS Compliant | 2005 | /files/intersil-isl55100birzt-datasheets-6105.pdf | QFN | 10mm | 950μm | 10mm | 72 | 11 Weeks | 72 | EAR99 | REQUIRES 5.5V SUPPLY WHEN VEXT SUPPLY IS USED | 4 | e3 | Matte Tin (Sn) - annealed | QUAD | NO LEAD | 260 | 15V | 0.5mm | 72 | INDUSTRIAL | 18V | 9V | 4 | 40 | Other Interface ICs | 12-3V | Not Qualified | 1A | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | 0.6A | SOURCE SINK | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SSTUB32S868DHLFT | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | 410MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-sstub32s868dhlft-datasheets-5832.pdf | TFBGA | 15mm | 6mm | Lead Free | 1.9V | 1.7V | 176 | yes | 1.2mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Non-Inverting | 176 | 1 | 25 | Buffer | 3 ns | 56 | -16mA | 16mA | 28 | Positive Edge | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 74SSTUBF32866BBFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 410MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-74sstubf32866bbfg8-datasheets-1544.pdf | 13.5mm | 5.5mm | 1.8V | Lead Free | 96 | 9 Weeks | 1.9V | 1.7V | 96 | yes | 1.4mm | EAR99 | Copper, Silver, Tin | No | 1 | e1 | TIN SILVER COPPER | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 96 | COMMERCIAL | 30 | 1 | Other Logic ICs | 32866 | D FLIP-FLOP | 25 | 3 ns | Buffer | 3 ns | 410MHz | 25 | -8mA | 8mA | OPEN-DRAIN | Positive Edge | ||||||||||||||||||||||||||||||||||||||||||||||||
| SSTUAF32866BHLF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 410MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-sstuaf32866bhlf-datasheets-1325.pdf | BGA | 13.5mm | 5.5mm | Lead Free | 96 | 1.9V | 1.7V | 96 | yes | 1.4mm | unknown | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 96 | COMMERCIAL | NOT SPECIFIED | 1 | SSSTU | D FLIP-FLOP | 25 | Buffer | 3 ns | 25 | -8mA | 8mA | Positive Edge | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT74SSTVN16859NLG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | 1mm | RoHS Compliant | 2007 | /files/integrateddevicetechnology-idt74sstvn16859nlg8-datasheets-1010.pdf | 8mm | 8mm | 2.7V | 56 | 220 MHZ FOR PC3200 OPERATION | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | NO LEAD | 260 | 2.5V | 0.5mm | 56 | COMMERCIAL | 2.3V | 30 | Other Logic ICs | TRUE | 2.5V | Not Qualified | S-PQCC-N56 | SSTV | D FLIP-FLOP | 13 | Buffer | POSITIVE EDGE | 200 MHz | 2.5 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SN74ACT1073DWG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 1 | 85°C | -40°C | CMOS | RoHS Compliant | SOIC | 12.8mm | 2.35mm | 7.52mm | 5.5V | Lead Free | 20 | 500.709277mg | 20 | EAR99 | No | 8542.39.00.01 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | GULL WING | 260 | 5V | 1.27mm | 20 | INDUSTRIAL | Bus Terminators | 5V | 16 | NO | DIODE BUS TERMINATION ARRAY | 16 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLG7NT4317V | Silego |
Min: 1 Mult: 1 |
0 | 0x0x0 | Non-RoHS Compliant | ANALOG CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SSTUAF32865AHLFT | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | 410MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-sstuaf32865ahlft-datasheets-1743.pdf | 13mm | 9mm | 1.8V | Lead Free | 1.9V | 1.7V | 160 | yes | 1.3mm | EAR99 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Non-Inverting | 260 | 160 | NOT SPECIFIED | 1 | Other Logic ICs | Not Qualified | 28 | Buffer | 3 ns | 410MHz | 56 | -8mA | 8mA | Positive Edge | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLG7NT4229V | Silego |
Min: 1 Mult: 1 |
0 | 0x0x0 | 1 | RoHS Compliant | 8542.39.00.01 | NOT SPECIFIED | ANALOG CIRCUIT | NOT SPECIFIED | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 74SSTUBF32866BBFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | 410MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-74sstubf32866bbfg-datasheets-0391.pdf | BGA | 13.5mm | 5.5mm | 1.8V | Lead Free | 96 | 9 Weeks | 1.9V | 1.7V | 96 | yes | 1.4mm | EAR99 | Copper, Silver, Tin | 1 | e1 | TIN SILVER COPPER | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 96 | COMMERCIAL | 30 | 1 | Other Logic ICs | Not Qualified | SSTU | D FLIP-FLOP | 25 | Buffer | 3 ns | 410MHz | 25 | -8mA | 8mA | Positive Edge | ||||||||||||||||||||||||||||||||||||||||||||||||||
| SLG7NT4192V | Silego |
Min: 1 Mult: 1 |
0 | 0x0x0 | 0.8mm | RoHS Compliant | 3mm | 2mm | 20 | 1 | YES | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.4mm | INDUSTRIAL | 85°C | -40°C | 3.465V | 3.135V | ANALOG CIRCUIT | NOT SPECIFIED | R-XQCC-N20 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 74SSTUAE32866ABFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 | 70°C | 0°C | CMOS | 1.81mm | RoHS Compliant | 2006 | /files/integrateddevicetechnology-74sstuae32866abfg8-datasheets-9841.pdf | BGA | 13.5mm | 5.5mm | 1.575V | Lead Free | 96 | 96 | yes | 1.4mm | EAR99 | No | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Non-Inverting | BOTTOM | BALL | 260 | 1.5V | 0.8mm | 96 | COMMERCIAL | 1.425V | 30 | Other Logic ICs | 1.5V | 32865 | D FLIP-FLOP | 25 | Buffer | OPEN-DRAIN | POSITIVE EDGE | 410 MHz | 3 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLG7NT4083V | Silego |
Min: 1 Mult: 1 |
0 | 0x0x0 | 0.8mm | RoHS Compliant | 2.5mm | 2.5mm | 12 | 1 | YES | DUAL | NO LEAD | NOT SPECIFIED | 3.3V | 0.4mm | INDUSTRIAL | 85°C | -40°C | 3.6V | 3V | ANALOG CIRCUIT | NOT SPECIFIED | S-PDSO-N12 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SN74TVC3306DCURE4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 1 (Unlimited) | 85°C | -40°C | NMOS | 0.9mm | RoHS Compliant | /files/texasinstruments-sn74tvc3306dcure4-datasheets-6760.pdf | VSSOP | Lead Free | 8 | 9.610488mg | 5V | 0V | 16.5Ohm | 8 | No | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | GULL WING | 260 | 3V | 0.5mm | 8 | INDUSTRIAL | 3 | ANALOG CIRCUIT | 2 | 1.4 ns | Translator | 1.4 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SN74F1056DG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 1 | 70°C | 0°C | 1.75mm | RoHS Compliant | /files/texasinstruments-sn74f1056dg4-datasheets-2763.pdf | SOIC | 9.9mm | 3.9mm | Lead Free | 16 | 16 | EAR99 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | GULL WING | 260 | 1.27mm | 16 | COMMERCIAL | NOT SPECIFIED | Not Qualified | 8 | NO | DIODE BUS TERMINATION ARRAY | 170mA | 1.2V | 2μA | 2μA | 7V | 7 ns | 7 ns | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 74SSTVF16859PAG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 1 | 70°C | -40°C | CMOS | 220MHz | RoHS Compliant | 2007 | /files/integrateddevicetechnology-74sstvf16859pag8-datasheets-9426.pdf | TSSOP | 17mm | 1mm | 6.1mm | Lead Free | 64 | 2.7V | 2.3V | 64 | yes | 1mm | EAR99 | Tin | 1 | e3 | Non-Inverting | DUAL | GULL WING | 260 | 2.5V | 0.5mm | 64 | COMMERCIAL | 30 | 1 | Other Logic ICs | 2.5V | Not Qualified | SSTV | D FLIP-FLOP | 13 | Buffer | 2.9 ns | 220MHz | 26 | -16mA | 16mA | Positive Edge | |||||||||||||||||||||||||||||||||||||||||||||||||
| 74SSTUBF32869ABKG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | RoHS Compliant | 2006 | /files/integrateddevicetechnology-74sstubf32869abkg8-datasheets-4359.pdf | TFBGA | 13mm | 8mm | 1.9V | Lead Free | 150 | 8 Weeks | 150 | yes | 1.2mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | 1 | e1 | TIN SILVER COPPER | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 150 | COMMERCIAL | 1.7V | 30 | Other Logic ICs | 1.8V | Not Qualified | 32869 | D FLIP-FLOP | 14 | Buffer | 340MHz | OPEN-DRAIN | POSITIVE EDGE | 3 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 74SSTVF16857PAG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 | 70°C | -40°C | 200MHz | RoHS Compliant | 2007 | /files/integrateddevicetechnology-74sstvf16857pag-datasheets-5640.pdf | TSSOP | 12.5mm | 6.1mm | 2.5V | Lead Free | 48 | 2.7V | 2.3V | 48 | yes | 1mm | EAR99 | No | 1 | e3 | Matte Tin (Sn) - annealed | Non-Inverting | DUAL | GULL WING | 260 | 2.5V | 0.5mm | 48 | COMMERCIAL | 30 | 1 | FF/Latch | SSTV | D FLIP-FLOP | 14 | Buffer | 2.8 ns | 14 | -20mA | 20mA | Positive Edge | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SSTUAF32869AHLF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | 340MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-sstuaf32869ahlf-datasheets-8817.pdf | TFBGA | 13mm | 8mm | Lead Free | 150 | 1.9V | 1.7V | 150 | yes | 1.2mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 150 | COMMERCIAL | NOT SPECIFIED | 1 | D FLIP-FLOP | 14 | Buffer | 3 ns | 28 | -12mA | 12mA | OPEN-DRAIN | Positive Edge | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SSTUAF32869AHLFT | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 | 70°C | 0°C | 340MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-sstuaf32869ahlft-datasheets-6815.pdf | TFBGA | 13mm | 8mm | Lead Free | 150 | 1.9V | 1.7V | 150 | yes | 1.2mm | EAR99 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 150 | COMMERCIAL | NOT SPECIFIED | 1 | Other Logic ICs | Not Qualified | D FLIP-FLOP | 14 | Buffer | 3 ns | 28 | -12mA | 12mA | OPEN-DRAIN | Positive Edge | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 74SSTUBF32869ABKG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | RoHS Compliant | 2006 | /files/integrateddevicetechnology-74sstubf32869abkg-datasheets-2502.pdf | TFBGA | 13mm | 8mm | 1.9V | Lead Free | 150 | 8 Weeks | 150 | yes | 1.2mm | EAR99 | Copper, Silver, Tin | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 150 | COMMERCIAL | 1.7V | 30 | Other Logic ICs | 1.8V | Not Qualified | SSTU | D FLIP-FLOP | 14 | Buffer | 340MHz | POSITIVE EDGE | 1.5 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SN74TVC3010PWG4 | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 1 | 85°C | -40°C | MOS | RoHS Compliant | /files/texasinstruments-sn74tvc3010pwg4-datasheets-9651.pdf | TSSOP | 7.8mm | 1.15mm | 4.4mm | Lead Free | 24 | 89.499445mg | 5V | 0V | 12.5Ohm | 24 | EAR99 | No | 8542.39.00.01 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | GULL WING | 260 | 2.1V | 0.65mm | 24 | INDUSTRIAL | 11 | Other Logic ICs | 2.1V | 74 | LOGIC CIRCUIT | 10 | 4 ns | 4 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 74SSTUBF32865ABKG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 | 70°C | 0°C | CMOS | 410MHz | RoHS Compliant | 2006 | /files/integrateddevicetechnology-74sstubf32865abkg-datasheets-7188.pdf | BGA | 13mm | 9mm | Lead Free | 160 | 8 Weeks | 1.9V | 1.7V | 160 | yes | 1.3mm | EAR99 | Copper, Silver, Tin | 1 | e1 | TIN SILVER COPPER | Non-Inverting | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 160 | COMMERCIAL | 30 | 1 | Not Qualified | D FLIP-FLOP | 28 | Buffer | 3 ns | 410MHz | 56 | -8mA | 8mA | OPEN-DRAIN | Positive Edge | |||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT74SSTVN16859CPAG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape & Reel (TR) | 70°C | 0°C | 1.1mm | RoHS Compliant | 2007 | /files/integrateddevicetechnology-idt74sstvn16859cpag8-datasheets-2234.pdf | TFSOP | 17mm | 6.1mm | 2.7V | 64 | 8542.39.00.01 | 1 | e3 | MATTE TIN | DUAL | GULL WING | NOT SPECIFIED | 2.5V | 0.5mm | 64 | COMMERCIAL | 2.3V | NOT SPECIFIED | TRUE | Not Qualified | R-PDSO-G64 | SSTV | D FLIP-FLOP | 13 | Buffer | POSITIVE EDGE | 220 MHz | 2.4 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT74SSTVN16859CPAG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 1 | 70°C | 0°C | 1.1mm | RoHS Compliant | 2007 | /files/integrateddevicetechnology-idt74sstvn16859cpag-datasheets-2154.pdf | TFSOP | 17mm | 6.1mm | 2.7V | 64 | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 2.5V | 0.5mm | 64 | COMMERCIAL | 2.3V | 30 | Other Logic ICs | TRUE | 2.5V | Not Qualified | R-PDSO-G64 | SSTV | D FLIP-FLOP | 13 | Buffer | POSITIVE EDGE | 220 MHz | 2.4 ns |
