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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Operating Supply Current | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Weight | Number of Pins | Interface | Pbfree Code | Reach Compliance Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Time@Peak Reflow Temperature-Max (s) | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Function | Power (Watts) | Number of Transceivers |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCM88440B0KFSBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| M83159G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | ROHS3 Compliant | 12 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18267HB/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | 13 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18264HB/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | 80-TFQFN Exposed Pad | 13 Weeks | 16 | Transceiver | 2.55W | |||||||||||||||||||||||||||||||||||||||||||
| VSC8490YJU-13 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 4 (72 Hours) | 1.4mm | 15mm | 15mm | 196 | compliant | 1 | YES | BOTTOM | BALL | 1V | 1mm | INDUSTRIAL | TELECOM CIRCUIT | 110°C | -40°C | S-PBGA-B196 | |||||||||||||||||||||||||||||||||||
| VSC7104VP-01 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~110°C | Tray | 1 (Unlimited) | 110°C | 0°C | RoHS Compliant | 2004 | /files/microchiptechnology-vsc7104xvp01-datasheets-1277.pdf | 69-FBGA | TTL/CMOS | 1.5W | 2.5V 3.3V | 4 | 69-BGA | Quad Signal Conditioner | 1.5W | |||||||||||||||||||||||||||||||||||
| VSC8489YJU-10 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 1.4mm | 15mm | 15mm | 196 | compliant | 1 | YES | BOTTOM | BALL | 1V | 1mm | INDUSTRIAL | ETHERNET TRANSCEIVER | 110°C | -40°C | S-PBGA-B196 | ||||||||||||||||||||||||||||||||||||
| VSC8584EV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MAX20803ECM+T | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM88562A0KFSBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vendor Undefined | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18256HN/C1K | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| M83160G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2014 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18284HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | |||||||||||||||||||||||||||||||||||||||||||||||||
| BCM84540A1IFSBLG | Broadcom Limited |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | SPI | 4 | Ethernet | |||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18256HN/C1E | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| TEA1062AT/C4,112 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~75°C | Tube | 1 (Unlimited) | 900μA | ROHS3 Compliant | 1997 | /files/nxpusainc-tea1062ac4m1112-datasheets-2872.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | 16 | yes | e4 | NICKEL PALLADIUM GOLD | YES | 3.4V | DUAL | GULL WING | 260 | 2.7V | TEA1062 | TELEPHONE SPEECH CIRCUIT | 30 | 1 | Not Qualified | Low Voltage Transmission | 454mW | |||||||||||||||||||||||||
| M83263G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | ROHS3 Compliant | 12 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7454YIH-02 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | /files/microchiptechnology-vsc7454yih02-datasheets-2928.pdf | |||||||||||||||||||||||||||||||||||||||||||||||||||
| M82108G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2014 | 672-BGA | |||||||||||||||||||||||||||||||||||||||||||||||
| M83240G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2014 | 12 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7108VP-01 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~110°C | Tray | 1 (Unlimited) | RoHS Compliant | 2004 | /files/microchiptechnology-vsc7104xvp01-datasheets-1277.pdf | 36-FBGA | TTL/CMOS | 2.65W | 2.5V 3.3V | 8 | Octal Signal Conditioner | |||||||||||||||||||||||||||||||||||||||
| VSC8489EV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDA18264HB/C1,557 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | 80-TFQFN Exposed Pad | 13 Weeks | 16 | Transceiver | 2.55W | |||||||||||||||||||||||||||||||||||||||||||
| TDA18285HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | |||||||||||||||||||||||||||||||||||||||||||||||||
| AS2540TR | ams |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -15°C~60°C | Tape & Reel (TR) | 1 (Unlimited) | 3mA | RoHS Compliant | /files/ams-as2540tr-datasheets-2843.pdf | 28-SOIC (0.295, 7.50mm Width) | 5V | Lead Free | 2.214806g | 28 | Serial | 1 | Single-Chip Solution | |||||||||||||||||||||||||||||||||||||
| BCM84753A1KFSBLG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | /files/broadcomlimited-bcm84754a1kfsblg-datasheets-2845.pdf | Serial | 4 | Switch | ||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8584XKS-09 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | 1.8mm | 256-BGA | 17mm | 17mm | 256 | compliant | 1 | YES | BOTTOM | BALL | 1V | 1mm | AUTOMOTIVE | ETHERNET TRANSCEIVER | 125°C | -40°C | S-PBGA-B256 | 1000000 Mbps | 1 | |||||||||||||||||||||||||||||||
| TDA18204HN/C1,518 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-tda18204hnc1518-datasheets-2919.pdf | 13 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||
| TDA18256HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | |||||||||||||||||||||||||||||||||||||||||||||||||
| MAX20803ECM+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download |
