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ContactTelecom Interface ICs(3995)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Current - Supply | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Interface | Pbfree Code | Reach Compliance Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Temperature Grade | Telecom IC Type | Operating Temperature (Max) | Operating Temperature (Min) | Time@Peak Reflow Temperature-Max (s) | Number of Circuits | Qualification Status | JESD-30 Code | Supplier Device Package | Data Rate | Function | Power (Watts) | Number of Transceivers |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TDA18287HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||
| TDA18286HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||
| M83240G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2014 | 12 Weeks | ||||||||||||||||||||||||||||||||||||||||||||
| VSC7108VP-01 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~110°C | Tray | 1 (Unlimited) | RoHS Compliant | 2004 | /files/microchiptechnology-vsc7104xvp01-datasheets-1277.pdf | 36-FBGA | TTL/CMOS | 2.65W | 2.5V 3.3V | 8 | Octal Signal Conditioner | ||||||||||||||||||||||||||||||||||
| VSC8489EV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | |||||||||||||||||||||||||||||||||||||||||||||||
| TDA18264HB/C1,557 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2016 | 80-TFQFN Exposed Pad | 13 Weeks | 16 | Transceiver | 2.55W | ||||||||||||||||||||||||||||||||||||||
| TDA18285HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||
| TDA18267HB/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | 13 Weeks | |||||||||||||||||||||||||||||||||||||||||||
| TDA18264HB/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2016 | 80-TFQFN Exposed Pad | 13 Weeks | 16 | Transceiver | 2.55W | ||||||||||||||||||||||||||||||||||||||
| VSC8490YJU-13 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 4 (72 Hours) | 1.4mm | 15mm | 15mm | 196 | compliant | 1 | YES | BOTTOM | BALL | 1V | 1mm | INDUSTRIAL | TELECOM CIRCUIT | 110°C | -40°C | S-PBGA-B196 | ||||||||||||||||||||||||||||||
| VSC7104VP-01 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | 0°C~110°C | Tray | 1 (Unlimited) | 110°C | 0°C | RoHS Compliant | 2004 | /files/microchiptechnology-vsc7104xvp01-datasheets-1277.pdf | 69-FBGA | TTL/CMOS | 1.5W | 2.5V 3.3V | 4 | 69-BGA | Quad Signal Conditioner | 1.5W | ||||||||||||||||||||||||||||||
| VSC8489YJU-10 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | 1.4mm | 15mm | 15mm | 196 | compliant | 1 | YES | BOTTOM | BALL | 1V | 1mm | INDUSTRIAL | ETHERNET TRANSCEIVER | 110°C | -40°C | S-PBGA-B196 | |||||||||||||||||||||||||||||||
| VSC8584EV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | |||||||||||||||||||||||||||||||||||||||||||||||
| MAX20803ECM+T | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ||||||||||||||||||||||||||||||||||||||||||||||||
| BCM88562A0KFSBG | Broadcom |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Vendor Undefined | |||||||||||||||||||||||||||||||||||||||||||||||
| TDA18256HN/C1K | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2017 | |||||||||||||||||||||||||||||||||||||||||||||
| M83160G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2014 | |||||||||||||||||||||||||||||||||||||||||||||
| TDA18284HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||
| BCM84540A1IFSBLG | Broadcom Limited |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | SPI | 4 | Ethernet | ||||||||||||||||||||||||||||||||||||||||||||
| TDA18256HN/C1E | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | 2017 | |||||||||||||||||||||||||||||||||||||||||||||
| TEA1062AT/C4,112 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~75°C | Tube | 1 (Unlimited) | 900μA | ROHS3 Compliant | 1997 | /files/nxpusainc-tea1062ac4m1112-datasheets-2872.pdf | 16-SOIC (0.154, 3.90mm Width) | 9.9mm | 3.9mm | 16 | yes | e4 | NICKEL PALLADIUM GOLD | YES | 3.4V | DUAL | GULL WING | 260 | 2.7V | TEA1062 | TELEPHONE SPEECH CIRCUIT | 30 | 1 | Not Qualified | Low Voltage Transmission | 454mW | ||||||||||||||||||||
| M83263G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | ROHS3 Compliant | 12 Weeks | |||||||||||||||||||||||||||||||||||||||||||||
| VSC7454YIH-02 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | /files/microchiptechnology-vsc7454yih02-datasheets-2928.pdf | ||||||||||||||||||||||||||||||||||||||||||||||
| M82108G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2014 | 672-BGA | ||||||||||||||||||||||||||||||||||||||||||
| VSC8502EV | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | /files/microchiptechnology-vsc8502xml-datasheets-2919.pdf | ||||||||||||||||||||||||||||||||||||||||||||||
| M82154G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | ROHS3 Compliant | 2014 | 672-BGA | ||||||||||||||||||||||||||||||||||||||||||
| MC34017A-3P | NXP USA Inc. | $2.12 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -20°C~60°C | Tube | 1 (Unlimited) | 20mA | Non-RoHS Compliant | 2006 | /files/nxpusainc-mc34017a3p-datasheets-2891.pdf | 8-DIP (0.300, 7.62mm) | 5V | MC34017 | 1 | Tone Ringer | 1W | |||||||||||||||||||||||||||||||||
| TDA18225HN/C1Y | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2017 | ||||||||||||||||||||||||||||||||||||||||||||
| VSC8584XKS-06 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 4 (72 Hours) | 1.8mm | 256-BGA | 17mm | 17mm | 256 | compliant | 1 | YES | BOTTOM | BALL | 1V | 1mm | OTHER | ETHERNET TRANSCEIVER | 125°C | S-PBGA-B256 | 1000000 Mbps | 1 | |||||||||||||||||||||||||||
| M83262G13 | NXP Semiconductors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 4 (72 Hours) | ROHS3 Compliant |
