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ContactNXP USA Inc.(32998)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Accessory Type | ECCN Code | Additional Feature | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Number of Elements | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Oscillator Type | Number of I/O | Peripherals | RAM Size | Transistor Element Material | Configuration | Case Connection | Transistor Application | Drain to Source Voltage (Vdss) | DS Breakdown Voltage-Min | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | CPU Family | Power Dissipation-Max | JEDEC-95 Code | ROM (words) | Boundary Scan | Low Power Mode | Format | Integrated Cache | RAM (bytes) | Clock Frequency | Address Bus Width | External Data Bus Width | Drain Current-Max (Abs) (ID) | Pulsed Drain Current-Max (IDM) | Drain-source On Resistance-Max | Feedback Cap-Max (Crss) | Avalanche Energy Rating (Eas) | USB | Core Processor | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Additional Interfaces | Co-Processors/DSP | Security Features | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size | FET Type | Input Capacitance (Ciss) (Max) @ Vds | Turn Off Time-Max (toff) | Turn On Time-Max (ton) | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Current - Continuous Drain (Id) @ 25°C | Gate Charge (Qg) (Max) @ Vgs | Drive Voltage (Max Rds On,Min Rds On) | Vgs (Max) |
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| KMPC8541EVTAQF | NXP USA Inc. |
Min: 1 Mult: 1 |
download | MPC85xx | 0°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-kmpc8541vtaqf-datasheets-1274.pdf | 783-BBGA, FCBGA | MPC8541 | 783-FCPBGA (29x29) | 1.0GHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | DUART, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08QA2CPAE | NXP USA Inc. |
Min: 1 Mult: 1 |
download | S08 | Through Hole | -40°C~85°C TA | Tube | Not Applicable | CMOS | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qa2cpae-datasheets-4332.pdf | 8-DIP (0.300, 7.62mm) | 7.62mm | 8 | 10 Weeks | 3A991.A.2 | e3 | Matte Tin (Sn) | NO | DUAL | NOT SPECIFIED | 3V | MC9S08QA2 | 3.6V | 1.8V | NOT SPECIFIED | Microcontrollers | 2/3.3V | 5mA | Not Qualified | R-PDIP-T8 | Internal | 4 | LVD, POR, PWM, WDT | 160 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 20MHz | 1.8V~3.6V | FLASH | 8-Bit | 2KB 2K x 8 | A/D 4x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EVBUSB2SER | NXP USA Inc. |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | 2011 | USB to Serial TTL Adapter | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| P5CC081UA/S1AA821V | NXP USA Inc. |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | /files/nxpusainc-p5cc081xss1ap52aj-datasheets-3491.pdf | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| KMPC8560VTAQFB | NXP USA Inc. |
Min: 1 Mult: 1 |
download | MPC85xx | 0°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | /files/nxpusainc-mpc8560pxaqfb-datasheets-7158.pdf | 784-BBGA, FCBGA | MPC8560 | 783-FCPBGA (29x29) | 1.0GHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08SH32CTGR | NXP USA Inc. | $4.88 |
Min: 1 Mult: 1 |
download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.2mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08sh16ctg-datasheets-5382.pdf | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 4.4mm | 16 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 3V | 0.65mm | MC9S08SH32 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | Not Qualified | R-PDSO-G16 | Internal | 13 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 32768 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OM13518,598 | NXP USA Inc. |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-om13518598-datasheets-1165.pdf | Interface Board | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| J3D016YXU/T1AY599J | NXP USA Inc. |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| KMPC860SRCVR50D4 | NXP USA Inc. |
Min: 1 Mult: 1 |
download | MPC8xx | -40°C~95°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2004 | /files/nxpusainc-mpc855tczq50d4-datasheets-5903.pdf | 357-BBGA | MPC860 | 50MHz | 3.3V | 10Mbps (4) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08RNA60W1MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna32w1vlc-datasheets-0724.pdf | 48-LQFP | 16 Weeks | 260 | 40 | Internal | 39 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S32V-SONYCAM | NXP USA Inc. |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-fs32v234con1vub-datasheets-3199.pdf | 14 Weeks | Camera | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BUK7575-55,127 | NXP USA Inc. | $2.75 |
Min: 1 Mult: 1 |
download | TrenchMOS™ | Through Hole | -55°C~175°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-buk757555127-datasheets-5841.pdf | TO-220-3 | 3 | EAR99 | ESD PROTECTION | unknown | e3 | Matte Tin (Sn) | NO | SINGLE | NOT SPECIFIED | 3 | NOT SPECIFIED | 1 | FET General Purpose Power | Not Qualified | R-PSFM-T3 | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 55V | 55V | 61W Tc | TO-220AB | 19.7A | 79A | 0.075Ohm | 85 pF | 30 mJ | N-Channel | 500pF @ 25V | 45ns | 35ns | 75m Ω @ 10A, 10V | 4V @ 1mA | 19.7A Tc | 10V | ±16V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC68302FC20C | NXP USA Inc. |
Min: 1 Mult: 1 |
download | M683xx | 0°C~70°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | 1996 | /files/nxpusainc-mc68302eh20c-datasheets-9827.pdf | 132-BQFP Bumpered | MC68302 | 20MHz | M68000 | 5.0V | 1 Core 8/16-Bit | No | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12GN32F0WLF | NXP USA Inc. |
Min: 1 Mult: 1 |
download | HCS12 | Surface Mount | -40°C~150°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2008 | 48-LQFP | 7mm | 7mm | 48 | 12 Weeks | 3A001.A.2.A | 8542.31.00.01 | YES | QUAD | GULL WING | 5V | 0.5mm | 5.5V | 3.13V | Microcontrollers | 3.3/5V | 17mA | Not Qualified | S-PQFP-G48 | AEC-Q100 | Internal | 40 | LVD, POR, PWM, WDT | 2K x 8 | 25MHz | MICROCONTROLLER | 16 | YES | NO | YES | CPU12 | 32768 | 2048 | 16MHz | 12V1 | 3.13V~5.5V | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | A/D 8x10b | 1K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TWR-LCDC-EPSON | NXP USA Inc. |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | 2013 | 10 Weeks | Interface Board | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PHB145NQ06T,118 | NXP USA Inc. |
Min: 1 Mult: 1 |
download | TrenchMOS™ | Surface Mount | -55°C~175°C TJ | Tape & Reel (TR) | 1 (Unlimited) | MOSFET (Metal Oxide) | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-phb145nq06t118-datasheets-5861.pdf | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB | 55V | 250W Tc | N-Channel | 3825pF @ 25V | 6m Ω @ 25A, 10V | 4V @ 1mA | 75A Tc | 64.7nC @ 10V | 10V | ±20V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8260ACZUMHBB | NXP USA Inc. |
Min: 1 Mult: 1 |
download | MPC82xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 1.65mm | Non-RoHS Compliant | 1994 | /files/nxpusainc-mpc8260acvvmibb-datasheets-1790.pdf | 480-LBGA Exposed Pad | 37.5mm | 480 | 12 Weeks | 3A991.A.2 | 8542.31.00.01 | YES | BOTTOM | BALL | 220 | 2V | 1.27mm | PC8260 | 2.2V | 1.9V | 30 | S-PBGA-B480 | 266MHz | MICROPROCESSOR, RISC | 32 | YES | NO | FLOATING POINT | YES | 66.66MHz | 32 | 64 | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08RN16W2VTG | NXP USA Inc. |
Min: 1 Mult: 1 |
download | S08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08rna16w2mlcr-datasheets-5909.pdf | 16-TSSOP (0.173, 4.40mm Width) | 16 Weeks | 260 | 40 | Internal | 12 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | A/D 8x10b | 256 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LFSMPBS12XDFM | NXP USA Inc. |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | 2008 | 11 Weeks | Daughter Board | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PHM15NQ20T,518 | NXP USA Inc. | $0.33 |
Min: 1 Mult: 1 |
download | TrenchMOS™ | Surface Mount | -55°C~150°C TJ | Tape & Reel (TR) | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-phm15nq20t518-datasheets-5877.pdf | 8-VDFN Exposed Pad | 8 | EAR99 | YES | DUAL | NO LEAD | 8 | 1 | Not Qualified | R-PDSO-N8 | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 200V | 200V | 62.5W Tc | 17.5A | 60A | 0.085Ohm | 210 mJ | N-Channel | 2170pF @ 30V | 85m Ω @ 15A, 10V | 4V @ 1mA | 17.5A Tc | 40nC @ 10V | 10V | ±20V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8245ARZU400D | NXP USA Inc. |
Min: 1 Mult: 1 |
download | MPC82xx | 0°C~85°C TA | Tray | 3 (168 Hours) | Non-RoHS Compliant | 2002 | /files/nxpusainc-mpc8245lvv300d-datasheets-1504.pdf | 352-LBGA | MPC8245 | 352-TBGA (35x35) | 400MHz | PowerPC 603e | 3.3V | 1 Core 32-Bit | No | SDRAM | I2C, I2O, PCI, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC68HC908QY2MDTE | NXP USA Inc. |
Min: 1 Mult: 1 |
download | HC08 | Surface Mount | -40°C~125°C TA | Tube | 3 (168 Hours) | HCMOS | 1.2mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc908qy4cdte-datasheets-4172.pdf | 16-TSSOP (0.173, 4.40mm Width) | 5mm | 4.4mm | 16 | 3A991.A.2 | OPERATES AT 2.7V MINIMUM SUPPLY @ 4MHZ | 8542.31.00.01 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 5V | 0.65mm | MC68HC908 | 5.5V | 4.5V | 40 | Not Qualified | R-PDSO-G16 | Internal | 13 | LVD, POR, PWM | 128 x 8 | 8MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 24MHz | 2.7V~5.5V | FLASH | 8-Bit | 1.5KB 1.5K x 8 | A/D 4x8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BATT-6EMULATOR | NXP USA Inc. |
Min: 1 Mult: 1 |
download | ROHS3 Compliant | 8 Weeks | Battery Pack Emulator | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PHP129NQ04LT,127 | NXP USA Inc. |
Min: 1 Mult: 1 |
download | TrenchMOS™ | Through Hole | -55°C~175°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-phb129nq04lt118-datasheets-7627.pdf | TO-220-3 | 3 | EAR99 | unknown | e3 | Matte Tin (Sn) | NO | SINGLE | NOT SPECIFIED | 3 | NOT SPECIFIED | 1 | FET General Purpose Power | Not Qualified | R-PSFM-T3 | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 40V | 40V | 200W Tc | TO-220AB | 75A | 240A | 0.0071Ohm | 475 mJ | N-Channel | 3965pF @ 25V | 5m Ω @ 25A, 10V | 2V @ 1mA | 75A Tc | 44.2nC @ 5V | 4.5V 10V | ±15V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| KMPC850DEVR80BU | NXP USA Inc. |
Min: 1 Mult: 1 |
download | MPC8xx | 0°C~95°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2001 | /files/nxpusainc-mc850deczq50bur2-datasheets-6645.pdf | 256-BBGA | MPC850 | 256-PBGA (23x23) | 80MHz | USB 1.x (1) | MPC8xx | 3.3V | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08RNA8W2CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
download | S08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2012 | 20-TSSOP (0.173, 4.40mm Width) | 16 Weeks | 260 | 40 | Internal | 16 | LVD, POR, PWM, WDT | 2K x 8 | 20MHz | MICROPROCESSOR | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | A/D 10x10b | 256 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSPB721DB1E | NXP USA Inc. |
Min: 1 Mult: 1 |
download | 1 (Unlimited) | ROHS3 Compliant | 2004 | 15 Weeks | Daughter Board | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PHP152NQ03LTA,127 | NXP USA Inc. |
Min: 1 Mult: 1 |
download | TrenchMOS™ | Through Hole | -55°C~175°C TJ | Tube | 1 (Unlimited) | MOSFET (Metal Oxide) | ENHANCEMENT MODE | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-phb152nq03lta118-datasheets-7616.pdf | TO-220-3 | 3 | EAR99 | unknown | e3 | Matte Tin (Sn) | NO | SINGLE | NOT SPECIFIED | 3 | NOT SPECIFIED | 1 | FET General Purpose Power | Not Qualified | R-PSFM-T3 | SILICON | SINGLE WITH BUILT-IN DIODE | DRAIN | SWITCHING | 25V | 25V | 150W Tc | TO-220AB | 75A | 240A | 0.005Ohm | 560 mJ | N-Channel | 3140pF @ 25V | 4m Ω @ 25A, 10V | 2V @ 1mA | 75A Tc | 36nC @ 5V | 5V 10V | ±20V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8323ECZQADDC | NXP USA Inc. |
Min: 1 Mult: 1 |
download | MPC83xx | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | 2.55mm | ROHS3 Compliant | 2004 | /files/nxpusainc-mpc8323eczqafdc-datasheets-4021.pdf | 516-BBGA | 27mm | 516 | 8542.31.00.01 | YES | BOTTOM | BALL | 1V | 1mm | MPC8323 | 1.05V | 0.95V | S-PBGA-B516 | 266MHz | MICROPROCESSOR, RISC | YES | YES | FLOATING POINT | YES | 14 | 32 | USB 2.0 (1) | PowerPC e300c2 | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR, DDR2 | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08PT32VQH | NXP USA Inc. |
Min: 1 Mult: 1 |
download | S08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08pt32vld-datasheets-4572.pdf | 64-QFP | 14mm | 14mm | 64 | 8 Weeks | 3A991.A.2 | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | MC9S08PT32 | 5.5V | 2.7V | 40 | Microcontrollers | 3/5V | 14.8mA | Not Qualified | S-PQFP-G64 | Internal | 57 | LVD, POR, PWM, WDT | 4K x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | 32768 | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | A/D 16x12b | 256 x 8 |
