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ContactRFI & EMI Contacts(4965)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Material | Shape | Factory Lead Time | Thickness | Plating | Plating Thickness | Storage/Refrigeration Temperature | Shelf Life | Attachment Method |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0097053802 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | All-Purpose | 121°C | Bulk | 1 (Unlimited) | RoHS Compliant | /files/laird-0097053802-datasheets-2596.pdf | 24.000 609.60mm | 0.250 6.35mm | 0.780 19.81mm | Beryllium Copper | 4 Weeks | 6.35mm | Adhesive | ||||||||||||
| 10-30C-070-BD-16 | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | TechMESH | -55°C~121°C | Not Applicable | ROHS3 Compliant | 2007 | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 16.000 406.40mm | 0.100 2.54mm | 0.300 7.62mm | Beryllium Copper | 4 Weeks | Unplated | Adhesive | ||||||||||||
| 2070001500 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Large Enclosure | RoHS Compliant | 6 Weeks | |||||||||||||||||||||||
| 4186PA51G09600 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | 51G | 1 (Unlimited) | ROHS3 Compliant | 2013 | /files/lairdtechnologiesemi-4375ab51g07200-datasheets-4197.pdf | 96.000 243.84cm | 0.079 2.00mm | 0.201 5.10mm | Rectangle | 3 Weeks | 2.032mm | 73°F 23°C | 12 Months | Adhesive | |||||||||||
| 7900-9035-76 | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Gasket | -75°C~260°C | Not Applicable | ROHS3 Compliant | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 0.125 3.18mm | 0.500 12.70mm | Rectangular | 4 Weeks | |||||||||||||||||
| 11-S-35DTS-BD-15 | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | -55°C~121°C | Not Applicable | ROHS3 Compliant | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 15.000 381.00mm | 0.110 2.79mm | 0.350 8.89mm | Beryllium Copper | 4 Weeks | Unplated | Adhesive | ||||||||||||||
| 4529PAH1K01475 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | Sculpted Foam UL94 | 1 (Unlimited) | ROHS3 Compliant | 2009 | /files/lairdtechnologiesemi-4529pah1k01475-datasheets-4218.pdf | 14.750 374.65mm | 0.465 11.80mm | 0.421 10.70mm | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | C-Fold | 4 Weeks | 11.811mm | Adhesive | ||||||||||||
| 11-90S-BD-16 | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | -55°C~121°C | Not Applicable | ROHS3 Compliant | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 16.000 406.40mm | 0.110 2.79mm | 0.900 22.86mm | Beryllium Copper | 4 Weeks | Unplated | Adhesive | ||||||||||||||
| 4228AB51S04800 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | 51S | 1 (Unlimited) | RoHS Compliant | 2013 | /files/lairdtechnologiesemi-4228ab51s04800-datasheets-4222.pdf | 48.000 121.92cm | 0.150 3.80mm | 0.150 3.80mm | D-Shape | 3 Weeks | 3.81mm | ||||||||||||||
| 4048AB51H07200 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | 51H | Not Applicable | 158°C | -40°C | ROHS3 Compliant | 2013 | /files/lairdtechnologiesemi-4522pa51h08400-datasheets-4154.pdf | 6.000' 1.83m | 0.236 6.00mm | 0.236 6.00mm | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | Square | 3 Weeks | 5.9944mm | 73°F 23°C | 12 Months | |||||||||
| 0097063117 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | Clip-On | 121°C | 1 (Unlimited) | RoHS Compliant | 16.000 406.40mm | 0.280 7.11mm | 0.600 15.24mm | Beryllium Copper | 4 Weeks | 127μm | Tin | 299.21μin 7.60μm | Clip | ||||||||||||
| 11-S-32AH-BD-16 | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | -55°C~121°C | Not Applicable | ROHS3 Compliant | 2014 | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 16.000 406.40mm | 0.110 2.79mm | 0.320 8.13mm | Beryllium Copper | 4 Weeks | Unplated | Adhesive | |||||||||||||
| 29100015 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 7 Weeks | |||||||||||||||||||||||||
| 0097054017 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | All-Purpose | 121°C | 1 (Unlimited) | RoHS Compliant | 16.000 406.40mm | 0.110 2.79mm | 0.280 7.11mm | Beryllium Copper | 4 Weeks | 2.794mm | Tin | 299.21μin 7.60μm | Adhesive | ||||||||||||
| 0097063217 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | Clip-On | 121°C | 1 (Unlimited) | RoHS Compliant | 16.000 406.40mm | 0.280 7.11mm | 0.600 15.24mm | Beryllium Copper | 4 Weeks | 127μm | Tin | 299.21μin 7.60μm | Clip | ||||||||||||
| 0097054118 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | Foldover | 121°C | 1 (Unlimited) | RoHS Compliant | 16.000 406.40mm | 0.120 3.05mm | 0.380 9.65mm | Beryllium Copper | 4 Weeks | 3.048mm | Nickel | 299.21μin 7.60μm | Adhesive | ||||||||||||
| 4697ABH1K01000 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | Sculpted Foam UL94 | 1 (Unlimited) | ROHS3 Compliant | 2009 | /files/lairdtechnologiesemi-4529pah1k01475-datasheets-4218.pdf | 10.000 254.00mm | 0.673 17.10mm | 0.591 15.00mm | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | C-Fold | 4 Weeks | 17.145mm | |||||||||||||
| 10-30C-065-DL-BD-16 | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | TechMESH | -55°C~121°C | Not Applicable | ROHS3 Compliant | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 16.000 406.40mm | 0.100 2.54mm | 0.300 7.62mm | Beryllium Copper | 4 Weeks | Unplated | Adhesive | |||||||||||||
| 10-30C-065-BD-16 | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | TechMESH | -55°C~121°C | Not Applicable | ROHS3 Compliant | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 16.000 406.40mm | 0.100 2.54mm | 0.300 7.62mm | Beryllium Copper | 4 Weeks | Unplated | Adhesive | |||||||||||||
| 0C97044018 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | Large Enclosure | 121°C | 1 (Unlimited) | RoHS Compliant | 25.000' 7.62m | 0.410 10.41mm | 1.630 41.40mm | Beryllium Copper | 4 Weeks | 10.541mm | Nickel | 299.21μin 7.60μm | Hardware, Rivet, Solder | ||||||||||||
| 4548AB51S04800 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | 51S | 1 (Unlimited) | RoHS Compliant | 2013 | /files/lairdtechnologiesemi-4228ab51s04800-datasheets-4222.pdf | 48.000 121.92cm | 0.059 1.50mm | 0.252 6.40mm | D-Shape | 3 Weeks | 1.524mm | ||||||||||||||
| 10-30C-045-BD-16 | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | TechMESH | -55°C~121°C | Not Applicable | ROHS3 Compliant | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 16.000 406.40mm | 0.100 2.54mm | 0.300 7.62mm | Beryllium Copper | 4 Weeks | Unplated | Adhesive | |||||||||||||
| 0097051517 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | Foldover | 121°C | 1 (Unlimited) | RoHS Compliant | 24.000 609.60mm | 0.230 5.84mm | 0.760 19.30mm | Beryllium Copper | 4 Weeks | 101.6μm | Tin | 299.21μin 7.60μm | Adhesive | ||||||||||||
| 4375AB51G07200 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | 51G | 1 (Unlimited) | ROHS3 Compliant | 2013 | /files/lairdtechnologiesemi-4375ab51g07200-datasheets-4197.pdf | 72.000 182.88cm | 0.094 2.40mm | 0.201 5.10mm | D-Shape | 3 Weeks | 2.3876mm | 73°F 23°C | 12 Months | ||||||||||||
| 14-45DTS-BD-15-NTP | Leader Tech Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | -55°C~121°C | Not Applicable | ROHS3 Compliant | /files/leadertechinc-sb28b0010at-datasheets-4155.pdf | 15.000 381.00mm | 0.140 3.56mm | 0.450 11.43mm | Beryllium Copper | 4 Weeks | Unplated | Adhesive | ||||||||||||||
| 4742AB51K09600 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | 51K | Bulk | 1 (Unlimited) | ROHS3 Compliant | 2013 | /files/lairdtechnologiesemi-4418ab51k08400-datasheets-4109.pdf | 120 | 96.000 243.84cm | 0.118 3.00mm | 0.150 3.80mm | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | D-Shape | 3 Weeks | 3.048mm | 73°F 23°C | 12 Months | |||||||||
| 0098091617 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | Ultrasoft Symmetrical (S3) Slotted | 121°C | 1 (Unlimited) | RoHS Compliant | 15.000 381.00mm | 0.140 3.56mm | 0.450 11.43mm | Beryllium Copper | 4 Weeks | Tin | 299.21μin 7.60μm | Adhesive | |||||||||||||
| 4522PA51H08400 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fabric Over Foam | 51H | Not Applicable | 158°C | -40°C | ROHS3 Compliant | 2008 | /files/lairdtechnologiesemi-4522pa51h08400-datasheets-4154.pdf | 84.000 213.36cm | 4.000 101.60mm | 4.000 101.60mm | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | Square | 3 Weeks | 3.9878mm | 73°F 23°C | 12 Months | Adhesive | ||||||||
| 0098053717 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | Ultrasoft All-Purpose | 121°C | 1 (Unlimited) | RoHS Compliant | 12.000 304.80mm | 0.410 10.41mm | 1.130 28.70mm | Beryllium Copper | 4 Weeks | Tin | 299.21μin 7.60μm | Adhesive | |||||||||||||
| 0C97044017 | Laird Technologies EMI |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Fingerstock | Large Enclosure | 121°C | 1 (Unlimited) | RoHS Compliant | 2013 | 25.000' 7.62m | 0.410 10.41mm | 1.630 41.40mm | Beryllium Copper | 4 Weeks | 10.541mm | Tin | 299.21μin 7.60μm | Hardware, Rivet, Solder |
