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ContactIC Adapters(274)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Length | Height | Lead Free | Material | Factory Lead Time | REACH SVHC | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | Insulation Resistance | JESD-609 Code | Feature | Pitch | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 28-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | 105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2012 | 3A | 5 Weeks | 28 | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||
| 20-354000-21-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | /files/arieselectronics-1835400021rc-datasheets-0533.pdf | 3A | 5 Weeks | 20 | yes | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 2.286mm | e4 | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.089 2.28mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||
| 32-655000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 655000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-3265500010-datasheets-0573.pdf | 40.6mm | 1.58mm | Lead Free | 5 Weeks | 32 | 32 | Silver | EAR99 | SOCKET ADAPTER | e3 | IC SOCKET | TSOP | DIP, 0.6 (15.24mm) Row Spacing | Copper | Brass | 0.020 0.50mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||
| PA-TS1D6SM18-40 | Logical Systems Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Not Applicable | Solder | RoHS Compliant | 2006 | 7 Weeks | 40 | TSOP | DIP | 0.020 0.50mm | 0.125 3.18mm | 0.100 2.54mm | ||||||||||||||||||||||||||||||||||||||||||||
| 32-655000-10-P | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 655000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-3265500010-datasheets-0573.pdf | 5 Weeks | 32 | Silver | EAR99 | 3.175mm | IC SOCKET | TSOP | DIP, 0.6 (15.24mm) Row Spacing | Copper | Brass | 0.020 0.50mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||
| 16-651000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 651000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1665100010-datasheets-0581.pdf | 1A | 5 Weeks | 16 | 16 | NOT SPECIFIED | EAR99 | SOCKET ADAPTER | 3.683mm | e3 | IC SOCKET | SSOP | DIP, 0.6 (15.24mm) Row Spacing | Brass | 0.026 0.65mm | 0.145 3.68mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||
| 20-354000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | /files/arieselectronics-1835400021rc-datasheets-0533.pdf | 3A | Glass, Polyester, Thermoplastic | 5 Weeks | No SVHC | 20 | 2.54mm | yes | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | 762μm | e4 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.030 0.76mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||
| 14-651000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 651000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1665100010-datasheets-0581.pdf | 1A | 5 Weeks | 14 | 14 | NOT SPECIFIED | EAR99 | SOCKET ADAPTER | 3.683mm | e3 | IC SOCKET | SSOP | DIP, 0.6 (15.24mm) Row Spacing | Brass | 0.026 0.65mm | 0.145 3.68mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||
| 28-350002-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 350000 | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-0835000011rcp-datasheets-6604.pdf | 35.6mm | 1.58mm | Lead Free | 5 Weeks | No SVHC | 28 | 28 | 28 | Brass | Gold | 3.81 mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||
| 28-354000-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-1435400010-datasheets-0450.pdf | 3A | 1.58mm | Lead Free | 5 Weeks | 28 | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2.54mm | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||
| 18-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1435400010-datasheets-0450.pdf | 3A | SOIC | 5 Weeks | 18 | 18 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 08-354000-11-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | /files/arieselectronics-1835400021rc-datasheets-0533.pdf | 3A | 5 Weeks | 8 | 8 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER, UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 762μm | e4 | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.030 0.76mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||
| 24-354W00-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354W00 | Through Hole | 105°C | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-16354w0010-datasheets-0511.pdf | 30.5mm | 1.58mm | Lead Free | 5 Weeks | 24 | 24 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | IC SOCKET | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | |||||||||||||||||||||||||
| 24-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | /files/arieselectronics-1435400010-datasheets-0450.pdf | 3A | 5 Weeks | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Gold, Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||
| 1111903 |
Min: 1 Mult: 1 |
0 | 0x0x0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 14-354W00-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354W00 | Through Hole | 105°C | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/arieselectronics-16354w0010-datasheets-0511.pdf | 5 Weeks | 14 | 14 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | IC SOCKET | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 248-1282-39-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2009 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 48 | 48 | Female | 48 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 1GOhm | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||
| 240-1280-39-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2006 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 40 | 40 | Female | 40 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | |||||||||||||||||||
| 16-354W00-10 |
Min: 1 Mult: 1 |
0 | 0x0x0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24-354W00-20 |
Min: 1 Mult: 1 |
0 | 0x0x0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 16-354W00-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354W00 | Through Hole | 105°C | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-16354w0010-datasheets-0511.pdf | 5 Weeks | 16 | 16 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | IC SOCKET | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| PA-SOD6SM18-40 | Logical Systems Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Not Applicable | Solder | RoHS Compliant | 7 Weeks | 40 | SOIC | DIP, 0.6 (15.24mm) Row Spacing | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | |||||||||||||||||||||||||||||||||||||||||||||
| 20-354W00-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354W00 | Through Hole | 105°C | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-16354w0010-datasheets-0511.pdf | 25.4mm | 1.58mm | Lead Free | 5 Weeks | 20 | 20 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | IC SOCKET | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | |||||||||||||||||||||||||
| 14-354W00-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354W00 | Through Hole | 105°C | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-16354w0010-datasheets-0511.pdf | 17.8mm | 1.58mm | Lead Free | 5 Weeks | 14 | 14 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | IC SOCKET | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOWIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | |||||||||||||||||||||||||
| 28-650000-10-P | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 650000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2010 | /files/arieselectronics-2465000010-datasheets-8346.pdf | SOIC | 35.6mm | 1.58mm | 5 Weeks | 28 | 28 | SOIC | DIP, 0.6 (15.24mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||
| 18-354000-21-RC | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | ROHS3 Compliant | 2009 | /files/arieselectronics-1835400021rc-datasheets-0533.pdf | 3A | 5 Weeks | 18 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 2.286mm | 3A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.089 2.28mm | 0.050 1.27mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 18-665000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 665000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666500000-datasheets-0505.pdf | 5 Weeks | 18 | 18 | EAR99 | 787.4μm | e0 | IC SOCKET | SOIC-W | SOIC | Brass | 0.050 1.27mm | 0.031 0.80mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||
| 20-354000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 354000 | Surface Mount | 105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 3A | 5 Weeks | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | SOIC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 16-304235-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 304235 | Through Hole | 105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | 5 Weeks | 16 | 16 | Gold | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e0 | Socket Included | IC SOCKET | 1A | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||
| 28-450001-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 450001 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-2465000010-datasheets-8346.pdf | 35.6mm | 1.58mm | Lead Free | 5 Weeks | 28 | 28 | TIN LEAD | EAR99 | SOCKET ADAPTER | e0 | IC SOCKET | SOJ | DIP, 0.4 (10.16mm) Row Spacing | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | FR4 Epoxy Glass |
