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ContactIC Adapters(274)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Length | Height | Lead Free | Factory Lead Time | Weight | REACH SVHC | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | JESD-609 Code | Feature | Pitch | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | PCB Contact Row Spacing | Material Flammability Rating | Convert From (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 22-666000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 666000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666600000-datasheets-9487.pdf | 5 Weeks | 22 | 22 | EAR99 | UL 94V-0 | 2.032mm | e0 | IC SOCKET | SOIC | SOWIC | Brass | 0.050 1.27mm | 0.080 2.03mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 18-350000-10-HT | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 350000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2005 | /files/arieselectronics-1435000010ht-datasheets-0250.pdf | 6 Weeks | 18 | 18 | Tin | EAR99 | SOCKET ADAPTER | POLYAMIDE | 3.175mm | High Temperature | IC SOCKET | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | Polyimide (PI) | ||||||||||||||||||||||||||||||||||
| 28-505-110 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 505 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-68505110-datasheets-8557.pdf | 5 Weeks | 28 | 28 | EAR99 | SOCKET ADAPTER | 3.81mm | e0 | IC SOCKET | PLCC | PGA | Brass | 0.050 1.27mm | 0.150 3.81mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 20-666000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 666000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666600000-datasheets-9487.pdf | 5 Weeks | 20 | 20 | EAR99 | UL 94V-0 | 2.032mm | e0 | IC SOCKET | SOIC | SOWIC | Brass | 0.050 1.27mm | 0.080 2.03mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 10-666000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 666000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666600000-datasheets-9487.pdf | 5 Weeks | 10 | 10 | EAR99 | UL 94V-0 | 2.032mm | e0 | IC SOCKET | SOIC | SOWIC | Brass | 0.050 1.27mm | 0.080 2.03mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 20-301550-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 301550 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-2030155020-datasheets-0273.pdf | 5 Weeks | 20 | 32 | EAR99 | SOCKET ADAPTER | 2.286mm | e0 | IC SOCKET | SOIC | PLCC | Brass | 0.050 1.27mm | 0.090 2.29mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 18-666000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 666000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666600000-datasheets-9487.pdf | 5 Weeks | 18 | 18 | EAR99 | UL 94V-0 | 2.032mm | e0 | IC SOCKET | SOIC | SOWIC | Brass | 0.050 1.27mm | 0.080 2.03mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 1107254-36 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 36 | 2.54mm | yes | 36 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 0.7 inch | 2 | IC SOCKET | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||
| 24-666000-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 666000 | Surface Mount | Surface Mount | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-1666600000-datasheets-9487.pdf | 5 Weeks | 24 | 24 | EAR99 | UL 94V-0 | 2.032mm | e0 | IC SOCKET | SOIC | SOWIC | Brass | 0.050 1.27mm | 0.080 2.03mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 18-35W000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2003 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | 22.9mm | 1.58mm | Lead Free | 5 Weeks | 18 | 18 | NOT SPECIFIED | EAR99 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||
| 08-305479-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 305479 | Through Hole | Through Hole | Box | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | /files/arieselectronics-1109814-datasheets-1511.pdf | Lead Free | 5 Weeks | 8 | 8 | EAR99 | 3.175mm | e3 | IC SOCKET | SOIC | JEDEC | Brass | 0.050 1.27mm | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 28-350002-11-RC-P | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 350000 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-0835000011rcp-datasheets-6604.pdf | SOIC | 5 Weeks | 28 | 3.175mm | SOIC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||||
| 228-1290-29-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2000 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 453.59237g | 28 | 28 | Female | 28 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | 2.54mm | 1A | UL94 V-0 | DIP, 0.4 (10.16mm) Row Spacing | DIP, 0.4 (10.16mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.070 1.78mm | 0.130 3.30mm | 0.070 1.78mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||
| 24-35W000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2003 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | SOIC | 30.5mm | 1.58mm | Lead Free | 5 Weeks | 24 | 24 | EAR99 | e0 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 44-505-111 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 505 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2013 | /files/arieselectronics-68505110-datasheets-8557.pdf | 5 Weeks | 44 | 44 | GOLD (10) | EAR99 | SOCKET ADAPTER | 3.81mm | e4 | IC SOCKET | PLCC | PGA | Brass | 0.050 1.27mm | 0.150 3.81mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||
| 1107254-32 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 32 | 2.54mm | yes | 32 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 0.7 inch | 2 | IC SOCKET | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||
| 1106396-24 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1106396 | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 30.5mm | 2.29mm | Lead Free | 5 Weeks | No SVHC | 2.54mm | yes | 24 | 24 | Gold | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | 2 | 7.62 mm | IC SOCKET | 3A | RECTANGULAR | RND PIN-SKT | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||
| 1106396-32 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1106396 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 32 | 2.54mm | yes | 32 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 2 | IC SOCKET | RECTANGULAR | RND PIN-SKT | 0.6 mm | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||
| 1111841 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1111841 | Through Hole | 105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | /files/aries-1111841-datasheets-1954.pdf | Lead Free | 6 Weeks | 10 | 10 | EAR99 | UL 94V-0 | Tin | e3 | 2 | IC SOCKET | MSOP | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.020 0.50mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||
| LCQT-QFP0.65-52 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | /files/arieselectronics-lcqtqfp0564-datasheets-0071.pdf | QFP | Lead Free | 5 Weeks | No SVHC | 52 | UL94 V-0 | Polyester | 5.9944mm | UL94 V-0 | Multiple Packages | QFP | Brass | 0.026 0.65mm | 0.236 6.00mm | 0.100 2.54mm | Gold | Flash | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||
| 16-304633-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 304633 | Through Hole | 105°C | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2009 | 6 Weeks | 16 | 16 | EAR99 | SOCKET ADAPTER | e0 | IC SOCKET | PLCC | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||||
| 44-505-110 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 505 | Through Hole | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2006 | /files/arieselectronics-68505110-datasheets-8557.pdf | 5 Weeks | 44 | 44 | EAR99 | SOCKET ADAPTER | 3.81mm | e0 | IC SOCKET | PLCC | PGA | Brass | 0.050 1.27mm | 0.150 3.81mm | 0.050 1.27mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 1107254-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1107254 | Through Hole | Through Hole | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-110639628-datasheets-0009.pdf | 3A | 5 Weeks | 20 | 2.54mm | yes | 20 | Gold | UL94 V-0 | EAR99 | SOCKET ADAPTER | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.302mm | e3 | 0.7 inch | 2 | IC SOCKET | RECTANGULAR | 0.3 inch | RND PIN-SKT | 0.3 mm | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.3 (7.62mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||
| 240-1280-29-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 150°C | -55°C | RoHS Compliant | 2001 | /files/3m-2163340190602j-datasheets-9985.pdf | 1A | Lead Free | 8 Weeks | 40 | 40 | Female | 40 | Gold | UL94 V-0 | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.6 (15.24mm) Row Spacing | DIP, 0.6 (15.24mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.130 3.30mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm | ||||||||||||||||||||||||
| LCQT-QFP0.8-32 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® | Through Hole | Through Hole | -55°C~125°C | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | /files/arieselectronics-lcqtqfp0564-datasheets-0071.pdf | QFP | Lead Free | 5 Weeks | No SVHC | 32 | UL94 V-0 | Polyester | 5.9944mm | UL94 V-0 | Multiple Packages | QFP | Brass | 0.031 0.80mm | 0.236 6.00mm | 0.100 2.54mm | Gold | Flash | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||
| 08-301296-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 301296 | Through Hole | Through Hole | 1 (Unlimited) | Solder | 105°C | -55°C | Non-RoHS Compliant | 2009 | /files/arieselectronics-1109814-datasheets-1511.pdf | Lead Free | 5 Weeks | 8 | 8 | EAR99 | Tin | 3.175mm | e3 | 1 | IC SOCKET | SOIC | JEDEC | Brass | 0.050 1.27mm | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||
| 14-35W000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2003 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | SOIC | 17.8mm | 1.58mm | Lead Free | 5 Weeks | 14 | 14 | NOT SPECIFIED | EAR99 | IC SOCKET | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | ||||||||||||||||||||||||||||||||||||
| 1109522 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 1109522 | Through Hole | Through Hole | 1 (Unlimited) | Solder | 105°C | -55°C | Non-RoHS Compliant | 2006 | /files/arieselectronics-1109523-datasheets-0101.pdf | 3A | TO-8 | 6 Weeks | 8 | 2.54mm | 8 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e0 | 2 | IC SOCKET | UL94 V-0 | DIP, 0.3 (7.62mm) Row Spacing | JEDEC | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | Tin-Lead | 200.0μin 5.08μm | FR4 Epoxy Glass | |||||||||||||||||||||||||
| 20-35W000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Correct-A-Chip® 35W000 | Through Hole | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2003 | /files/arieselectronics-2835w00010-datasheets-8362.pdf | SOIC | 25.4mm | 1.58mm | Lead Free | 5 Weeks | 20 | 20 | SOIC-W | DIP, 0.3 (7.62mm) Row Spacing | Brass | 0.050 1.27mm | 0.125 3.18mm | 0.100 2.54mm | Tin-Lead | FR4 Epoxy Glass | |||||||||||||||||||||||||||||||||||||||
| 222-3343-19-0602J | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Textool™ | Wire | Through Hole | -55°C~125°C | 1 (Unlimited) | Wire Wrap | 150°C | -55°C | RoHS Compliant | 2011 | /files/3m-2163340190602j-datasheets-9985.pdf | Lead Free | 8 Weeks | 453.59237g | 22 | 22 | 22 | Gold | Copper | Gold | Polysulfone (PSU), Glass Filled | Closed Frame | 2.54mm | 1A | UL94 V-0 | DIP, 0.4 (10.16mm) Row Spacing | DIP, 0.4 (10.16mm) Row Spacing | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.620 15.75mm | 0.100 2.54mm | Gold | 30.0μin 0.76μm |
