Products
Manufacturer
RFQ
NEWS
ContactTransistor Sockets(21155)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | RoHS Status | Published | Datasheet | Current Rating | Factory Lead Time | Number of Pins | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | HTS Code | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Operating Temperature (Min) | Body Length or Diameter | Body Breadth | Termination Type | Device Socket Type | Current Rating (Amps) | Mounting Style | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Device Type Used On | Contact Configuration | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 48-6554-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/aries-48655418-datasheets-3824.pdf | 1A | 6 Weeks | yes | 48 | 48 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyetheretherketone (PEEK), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 2.99 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 48 (2 x 24) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||
| 523-13-441-21-000003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 1A | 3 Weeks | yes | 441 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e4 | 2.54mm | 125°C | -55°C | 2.1 inch | 2.1 inch | WIRE WRAP | IC SOCKET | STRAIGHT | Gold (Au) - with Nickel (Ni) barrier | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA441 | 21X21 | |||||||||||||||||||||||||||||||
| 48-6553-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | yes | 48 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.99 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 48 (2 x 24) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||
| 550-10-480M29-001152 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001152-datasheets-4176.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 480 (29 x 29) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||
| 518-77-420M26-001105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 420 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Open Frame | 420 (26 x 26) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||||||||||||||
| 514-83-560M33-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51487192m16001148-datasheets-7359.pdf | 10 Weeks | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 10mOhm | Open Frame | 1A | 560 (33 x 33) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||||
| 514-87-652M35-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 652 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 652 (35 x 35) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||
| 558-10-432M31-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 432 (31 x 31) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| 40-6574-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 40 | 40 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 2.59 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 40 (2 x 20) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||
| 518-77-400M20-000106 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf | 1A | 10 Weeks | 400 | Gold | UL94 V-0 | FR4 Epoxy Glass | 1.5748mm | 10mOhm | Closed Frame | 400 (20 x 20) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.062 1.57mm | 0.050 1.27mm | |||||||||||||||||||||||||||||||||
| 40-3574-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||
| 558-10-456M26-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 456 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| 518-77-388M26-001105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 388 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Open Frame | 388 (26 x 26) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||||||||||||||
| 2A8-4204-00 | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/3m-248420501-datasheets-2397.pdf | 8 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 514-83-500M30-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 500 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 500 (30 x 30) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||
| 558-10-400M20-000101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 400 (20 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| 514-83-504M29-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 504 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 504 (29 x 29) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||
| 42-3552-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 42 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.69 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 42 (2 x 21) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||
| 514-87-576M30-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 576 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 576 (30 x 30) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||
| 40-6575-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 40 | 40 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 2.59 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 40 (2 x 20) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||
| 44-3551-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | yes | 44 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.79 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 44 (2 x 22) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||
| 558-10-356M26-001104 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 558 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-55810256m20001104-datasheets-4888.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 356 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||
| 514-83-520M31-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 520 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 520 (31 x 31) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||
| 44-6552-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | yes | 44 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.79 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 44 (2 x 22) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||
| 518-77-360M19-001105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 360 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Open Frame | 360 (19 x 19) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||||||||||||||
| 44-3552-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 44 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.79 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 44 (2 x 22) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||
| 40-3575-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||
| 523-13-400-20-000003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 1A | 3 Weeks | yes | 400 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e4 | 2.54mm | 125°C | -55°C | 2 inch | 2 inch | WIRE WRAP | IC SOCKET | STRAIGHT | Gold (Au) - with Nickel (Ni) barrier | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA400 | 20X20 | |||||||||||||||||||||||||||||||
| 518-77-400M20-000105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 400 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Closed Frame | 400 (20 x 20) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||||||||||||||
| 522-13-441-21-000003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 1A | 3 Weeks | yes | 441 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e4 | 2.54mm | 125°C | -55°C | 2.1 inch | 2.1 inch | WIRE WRAP | IC SOCKET | STRAIGHT | Gold (Au) - with Nickel (Ni) barrier | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA441 | 21X21 |
