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Transistor Sockets(21155)

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Type Series Mount Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Termination Max Operating Temperature Min Operating Temperature RoHS Status Published Datasheet Current Rating Factory Lead Time Number of Pins Pbfree Code Number of Positions Number of Contacts Contact Finish - Mating Flammability Rating ECCN Code Additional Feature Contact Material Contact Plating Housing Material Lead Length HTS Code Insulation Resistance Contact Resistance JESD-609 Code Feature Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Termination Type Device Socket Type Current Rating (Amps) Mounting Style Contact Finish Termination PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch PCB Contact Row Spacing Dielectric Withstanding Voltage Device Type Used On Contact Configuration Number of Positions or Pins (Grid) Material Flammability Rating Contact Finish Thickness - Mating Contact Material - Mating Contact Material - Post Pitch - Mating Termination Post Length Pitch - Post Contact Finish - Post Contact Finish Thickness - Post
550-10-432M31-001152 550-10-432M31-001152 Preci-Dip
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 0 0x0x0 download BGA 550 Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-55010192m16001152-datasheets-4176.pdf 10 Weeks Gold FR4 Epoxy Glass 10mOhm Closed Frame 1A 432 (31 x 31) UL94 V-0 10.0μin 0.25μm Brass 0.050 1.27mm 0.086 2.20mm 0.050 1.27mm 10.0μin 0.25μm
523-13-400-20-000001 523-13-400-20-000001 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
281-PLS19029-12 281-PLS19029-12 Aries Electronics
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 0 0x0x0 download PGA, ZIF (ZIP) PLS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2016 /files/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
273-PRS21004-12 273-PRS21004-12 Aries Electronics
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 0 0x0x0 download PGA, ZIF (ZIP) PRS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks 273 Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
44-6553-18 44-6553-18 Aries Electronics
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 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks yes 44 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.79 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 44 (2 x 22) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
558-10-388M26-001101 558-10-388M26-001101 Preci-Dip
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 0 0x0x0 download PGA 558 Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 /files/precidip-55810272m20001101-datasheets-4926.pdf 10 Weeks Gold FR4 Epoxy Glass 10mOhm Closed Frame 1A 388 (26 x 26) UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm 0.111 2.83mm 0.050 1.27mm 10.0μin 0.25μm
336-PRS21022-12 336-PRS21022-12 Aries Electronics
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Min: 1

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 0 0x0x0 download PGA, ZIF (ZIP) PRS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2008 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
36-3574-18 36-3574-18 Aries Electronics
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 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2007 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 6 Weeks yes 36 36 Tin UL94 V-0 EAR99 UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm Closed Frame 36 (2 x 18) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
44-6551-18 44-6551-18 Aries Electronics
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Min: 1

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 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks 44 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.79 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 44 (2 x 22) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
42-6554-18 42-6554-18 Aries Electronics
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 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/aries-42655418-datasheets-3810.pdf 1A 6 Weeks yes 42 42 Nickel Boron UL94 V-0 EAR99 STANDARD: UL 94V-0 Nickel Polyetheretherketone (PEEK), Glass Filled 2.794mm 1000000000Ohm Closed Frame 2.54mm 2.69 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
42-3554-18 42-3554-18 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/aries-42355418-datasheets-3814.pdf 1A 6 Weeks 42 42 Nickel Boron UL94 V-0 EAR99 STANDARD: UL 94V-0 Nickel Polyetheretherketone (PEEK), Glass Filled 2.794mm 1000000000Ohm Closed Frame 2.54mm 2.69 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
522-13-441-21-000002 522-13-441-21-000002 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
522-13-441-21-000001 522-13-441-21-000001 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
336-PRS20019-12 336-PRS20019-12 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download PGA, ZIF (ZIP) PRS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2006 /files/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks 336 Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
36-6574-18 36-6574-18 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 6 Weeks yes 36 36 Tin UL94 V-0 EAR99 UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm 1000000000Ohm Closed Frame 2.54mm 250°C 2.39 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 0.6 mm 1000VAC V 36 (2 x 18) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
523-13-361-19-000002 523-13-361-19-000002 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
36-3575-18 36-3575-18 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2007 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 6 Weeks yes 36 36 Tin UL94 V-0 EAR99 UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm Closed Frame 36 (2 x 18) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
518-77-356M26-001106 518-77-356M26-001106 Preci-Dip
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 0 0x0x0 download PGA 518 Surface Mount Surface Mount -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf 1A 10 Weeks 356 Gold UL94 V-0 FR4 Epoxy Glass 1.5748mm 10mOhm Open Frame 356 (26 x 26) UL94 V-0 Flash Beryllium Copper Brass 0.050 1.27mm 0.062 1.57mm 0.050 1.27mm
518-77-357M19-001105 518-77-357M19-001105 Preci-Dip
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Min: 1

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 0 0x0x0 download PGA 518 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-51877256m20001105-datasheets-4892.pdf 1A 10 Weeks 357 Gold UL94 V-0 FR4 Epoxy Glass 2.794mm 10mOhm Open Frame 357 (19 x 19) UL94 V-0 Flash Beryllium Copper Brass 0.050 1.27mm 0.110 2.78mm 0.050 1.27mm
42-6551-18 42-6551-18 Aries Electronics
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Min: 1

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 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.69 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
550-10-600M35-001166 550-10-600M35-001166 Preci-Dip
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Min: 1

Mult: 1

 0 0x0x0 download BGA 550 Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-55010192m16001166-datasheets-7079.pdf 10 Weeks Gold FR4 Epoxy Glass 10mOhm Closed Frame 1A 600 (35 x 35) UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm 0.098 2.50mm 0.050 1.27mm 10.0μin 0.25μm
550-10-420M26-001152 550-10-420M26-001152 Preci-Dip
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Min: 1

Mult: 1

 0 0x0x0 download BGA 550 Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-55010192m16001152-datasheets-4176.pdf 10 Weeks Gold FR4 Epoxy Glass 10mOhm Closed Frame 1A 420 (26 x 26) UL94 V-0 10.0μin 0.25μm Brass 0.050 1.27mm 0.086 2.20mm 0.050 1.27mm 10.0μin 0.25μm
523-13-400-20-000002 523-13-400-20-000002 Mill-Max Manufacturing Corp.
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Min: 1

Mult: 1

 0 0x0x0 download ROHS3 Compliant 3 Weeks
42-3551-18 42-3551-18 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks yes 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.69 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
181-PLS18041-12 181-PLS18041-12 Aries Electronics
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Min: 1

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 0 0x0x0 download PGA, ZIF (ZIP) PLS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks 181 Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
42-3553-18 42-3553-18 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.69 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
336-PLS20019-12 336-PLS20019-12 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download PGA, ZIF (ZIP) PLS Through Hole Through Hole -65°C~125°C Bulk 1 (Unlimited) Solder 125°C -65°C ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf 1A 5 Weeks 336 Gold UL94 V-0 Gold Polyphenylene Sulfide (PPS) 3.175mm Closed Frame 1A UL94 V-0 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin 200.0μin 5.08μm
42-6552-18 42-6552-18 Aries Electronics
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Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole -55°C~250°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 6 Weeks yes 42 Nickel Boron EAR99 STANDARD: UL 94V-0 Polyetheretherketone (PEEK), Glass Filled 1000000000Ohm Closed Frame 2.54mm 2.69 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 42 (2 x 21) UL94 V-0 50.0μin 1.27μm Beryllium Nickel Beryllium Nickel 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm Nickel Boron 50.0μin 1.27μm
523-13-361-19-000003 523-13-361-19-000003 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 1A 3 Weeks yes 361 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.9 inch 1.9 inch WIRE WRAP IC SOCKET STRAIGHT Gold (Au) - with Nickel (Ni) barrier RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA361 19X19
514-87-600M35-001148 514-87-600M35-001148 Preci-Dip
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 0 0x0x0 download BGA 514 Surface Mount Surface Mount -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf 1A 10 Weeks 600 Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 1.397mm 10mOhm Open Frame 600 (35 x 35) UL94 V-0 Flash Beryllium Copper Brass 0.100 2.54mm 0.055 1.40mm 0.100 2.54mm Tin
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