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ContactTransistor Sockets(21155)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Factory Lead Time | Number of Pins | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | HTS Code | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Operating Temperature (Min) | Body Length or Diameter | Body Breadth | Termination Type | Device Socket Type | Current Rating (Amps) | Mounting Style | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Device Type Used On | Contact Configuration | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 209-PRS17030-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 209 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 208-PLS17017-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 181-PRS18040-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 181 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 523-13-256-19-081002 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 523-13-273-21-125001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 522-13-281-19-081003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 1A | 3 Weeks | yes | 281 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e4 | 2.54mm | 125°C | -55°C | 1.9 inch | 1.9 inch | WIRE WRAP | IC SOCKET | STRAIGHT | Gold (Au) - with Nickel (Ni) barrier | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA281 | 19X19 | |||||||||||||||||||||||||||||||||
| 518-77-272M20-001106 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf | 1A | 10 Weeks | 272 | Gold | UL94 V-0 | FR4 Epoxy Glass | 1.5748mm | 10mOhm | Open Frame | 272 (20 x 20) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.062 1.57mm | 0.050 1.27mm | |||||||||||||||||||||||||||||||||||
| 32-3553-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 32 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.19 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 32 (2 x 16) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||||
| 192-PRS17027-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 192 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 550-10-456M26-001166 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001166-datasheets-7079.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 456 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.098 2.50mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||||||
| 169-PRS17012-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 169-PRS17053-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 209-PRS17046-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 514-83-356M26-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 356 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 356 (26 x 26) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||
| 522-13-323-21-005001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 522-93-361-19-000001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 514-83-360M19-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 360 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 360 (19 x 19) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||
| 24-3575-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 24 | 24 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 24 (2 x 12) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 180-PLS18007-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 180 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||
| 179-PRS18038-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 522-93-400-20-000001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 551-10-383-22-105005 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | yes | 383 | GOLD (10) OVER NICKEL (150) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | e4 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | PGA383 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 208-PRS17017-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||
| 522-13-281-19-081002 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 523-13-256-16-000003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 1A | 3 Weeks | yes | 256 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e4 | 2.54mm | 125°C | -55°C | 1.6 inch | 1.6 inch | WIRE WRAP | IC SOCKET | STRAIGHT | Gold (Au) - with Nickel (Ni) barrier | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA256 | 16X16 | |||||||||||||||||||||||||||||||||
| 523-93-299-20-096003 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 1A | 3 Weeks | no | 299 | GOLD (30) OVER NICKEL (100) | EAR99 | PGA SOCKET | NOT SPECIFIED | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 8536.90.40.00 | 10000000000Ohm | e0 | 2.54mm | 125°C | -55°C | 2 inch | 2 inch | WIRE WRAP | IC SOCKET | STRAIGHT | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 1000VAC V | PGA299 | 20X20 | |||||||||||||||||||||||||||||||||
| 514-83-357M19-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 357 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 357 (19 x 19) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||||
| 518-77-255M16-001105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 255 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Open Frame | 255 (16 x 16) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||||||||||||||||
| 522-13-299-20-096001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 558-10-272M20-001104 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 558 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810256m20001104-datasheets-4888.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 272 (20 x 20) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm |
