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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Factory Lead Time | Number of Pins | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Plating | Housing Material | Lead Length | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Body Length or Diameter | Body Breadth | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 280-PRS19006-12 | Aries Electronics | $108.24 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/aries-280prs1900612-datasheets-3781.pdf | 1A | 5 Weeks | 280 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||
| 48-6571-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | 250°C | -55°C | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | 48 | Nickel Boron | UL94 V-0 | Nickel | Polyetheretherketone (PEEK), Glass Filled | 2.794mm | Closed Frame | 1A | 48 (2 x 24) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||||
| 280-PLS19006-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/aries-280pls1900612-datasheets-3782.pdf | 1A | 5 Weeks | 280 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 281-PRS18037-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 281 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 216-PRS21016-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 216 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 36-6553-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | yes | 36 | Tin | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 2.39 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 40 (2 x 20) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||
| 210-PRS19034-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 550-10-504M29-001166 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001166-datasheets-7079.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 504 (29 x 29) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.098 2.50mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 244-5205-00 | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Not Applicable | Solder | Non-RoHS Compliant | /files/3m-248420501-datasheets-2397.pdf | QFN | 11 Weeks | 44 | Female | Straight | 500μm | |||||||||||||||||||||||||||||||||||||||||||||||
| 36-3551-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | yes | 36 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.39 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||
| 514-83-400M20-000148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 400 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Closed Frame | 400 (20 x 20) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||
| 522-13-361-19-000002 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 28-6573-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 28 | 28 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 28 (2 x 14) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 36-6552-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | yes | 36 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.39 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||
| 36-3554-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | 1A | 6 Weeks | 36 | 36 | Nickel Boron | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Nickel | Polyetheretherketone (PEEK), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 2.39 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||
| 523-93-400-20-000002 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 28-6574-18 | Aries Electronics | $109.92 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/aries-28657418-datasheets-3770.pdf | 1A | 6 Weeks | yes | 28 | 28 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 1.99 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 28 (2 x 14) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||
| 550-10-480M29-001166 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001166-datasheets-7079.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 480 (29 x 29) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.098 2.50mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 225-PRS18003-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | yes | 225 | 225 | Gold | UL94 V-0 | EAR99 | Polyphenylene Sulfide (PPS) | 3.175mm | e3 | Closed Frame | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 32-6574-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 32 | 32 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 2.19 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 32 (2 x 16) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||
| 514-83-420M26-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 420 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 420 (26 x 26) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||
| 550-10-356M26-001152 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-55010192m16001152-datasheets-4176.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 356 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||
| 223-PRS18017-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 223 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 28-3575-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 28 | 28 | Gold | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 28 (2 x 14) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 223-PLS18017-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/aries-223pls1801712-datasheets-3773.pdf | 1A | 5 Weeks | 223 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 223-PRS18039-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 523-13-299-20-096001 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 550-10-500M30-001166 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001166-datasheets-7079.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 500 (30 x 30) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.098 2.50mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 36-3553-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 36 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.39 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 36 (2 x 18) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | |||||||||||||||||||||||
| 28-6575-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 28 | 28 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 1.99 inch | 0.9 inch | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 1000VAC V | 28 (2 x 14) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm |
