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ContactApplication Specific Microcontrollers(1956)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Pbfree Code | Additional Feature | Contact Plating | Max Frequency | HTS Code | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Time@Peak Reflow Temperature-Max (s) | Subcategory | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Number of I/O | Memory Type | Core Architecture | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | Number of Timers/Counters | On Chip Program ROM Width | CPU Family | ROM (words) | Number of UART Channels | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of Timers | On Chip Data RAM Width | Number of DMA Channels | Clock Frequency | Time-Min | Address Bus Width | Core Processor | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WIN867NHEI-300A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MEC1701H-C1-SZ | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | /files/microchiptechnology-mec1705qc1isz-datasheets-2860.pdf | 144-WFBGA | 9mm | 9mm | 144 | 12 Weeks | ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI | ALSO OPERATES AT 3.3V NOMINAL | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Keyboard and Embedded Controller | YES | 1.71V~3.465V | BOTTOM | BALL | 260 | 1.8V | 0.65mm | MEC170 | 30 | S-PBGA-B144 | TS 16949 | 123 | 256KB | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M4 | MEC170x | ||||||||||||||||||||||||||||||||||||||||||||||
| TMG201A-32LQXIT | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TrueTouch™ | Surface Mount | -40°C~85°C | 1 (Unlimited) | ROHS3 Compliant | 32-VFQFN Exposed Pad | I2C, SPI, UART/USART, USB | Touchscreen Controller | 1.8V | 32-QFN | 28 | 2K x 8 | M8C | FLASH (16kB) | CY8CT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MEC1701H-C1-SZ-TR | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Cut Tape (CT) | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | 2017 | /files/microchiptechnology-mec1705qc1isz-datasheets-2860.pdf | 144-WFBGA | 9mm | 9mm | 144 | ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI | ALSO OPERATES AT 3.3V NOMINAL | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Keyboard and Embedded Controller | YES | 1.71V~3.465V | BOTTOM | BALL | 1.8V | 0.65mm | MEC170 | S-PBGA-B144 | TS 16949 | 123 | 256KB | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M4 | MEC170x | ||||||||||||||||||||||||||||||||||||||||||||||||
| WP3260W2EFEI-400B2 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 1997 | /files/microsemicorporation-wp3260w2efei400b2-datasheets-3005.pdf | 896-BGA, FCBGA | I2C, RMII, UART | Network Processor | 896-FCBGA (31x31) | MIPS32® 34Kc™ | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WIN840W6NHEI-300A1 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 8 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-U3A1420B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tu3a1420-datasheets-1760.pdf | 28-TSSOP (0.173, 4.40mm Width) | 9.7mm | 28 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | AT97SC3205T | NOT SPECIFIED | R-PDSO-G28 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | |||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-X3A1420B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | 1.1mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tu3a1420-datasheets-1760.pdf | 28-TSSOP (0.173, 4.40mm Width) | 9.7mm | 28 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | AT97SC3205T | NOT SPECIFIED | R-PDSO-G28 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | |||||||||||||||||||||||||||||||||||||||||||||||||
| WINMXTA2EHEI-305A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WP3160W6EFEI-320B1 | Microsemi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | RoHS Compliant | 1997 | /files/microsemicorporation-wp3160w6efei320b1-datasheets-2954.pdf | 896-BGA, FCBGA | I2C, RMII, UART | Network Processor | MIPS32® 34Kc™ | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WIN867NHEI-350A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CEC1702Q-B1-SX-TR | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.8mm | ROHS3 Compliant | 2017 | /files/microchiptechnology-ma990004-datasheets-6606.pdf | 84-WFBGA | 7mm | 7mm | 84 | 5 Weeks | I2C, SPI, UART | yes | Cryptography | YES | 1.71V~3.465V | BOTTOM | BALL | 3.3V | CEC1702 | 14.5mA | S-PBGA-B84 | 65 | 480KB | 48 MHz | MICROCONTROLLER, RISC | 32 | YES | YES | YES | NO | SRAM | 8 | CORTEX-M4F | 425984 | YES | YES | FLOATING-POINT | NO | 6 | 32 | 14 | 48MHz | SECONDS | ARM® Cortex®-M4F | |||||||||||||||||||||||||||||||||
| WIN827NHEI-260A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 8 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| WIN247NHEI-300A1 | Microsemi Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RoHS Compliant | 8 Weeks | Ethernet, PCI, SPI, USB | Network Processor | MIPS32® 24Kc™ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-G3M4B-10 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | AT97SC3205T | NOT SPECIFIED | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | |||||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66R32SNBZZZA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | my-d™ | Surface Mount | 3 (168 Hours) | Non-RoHS Compliant | Die | 9 Weeks | Die | ARM® Cortex®-M4 | EEPROM (4kB) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66CL80PENBZZZA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C | 3 (168 Hours) | Non-RoHS Compliant | Die | 9 Weeks | ISO/IEC 14443 for both Type A and Type B | Security | 2.7V~5.5V | Wafer | 2.25K x 8 | 8051 | EEPROM (8kB) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-H3M4B00B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | I2C | Trusted Platform Module (TPM) | 3.3V | AT97SC3205T | 32-VQFN (4x4) | 4 | AVR | EEPROM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CP3BT26Y98AWU/NOPB | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | /files/texasinstruments-cp3bt26y98awunopb-datasheets-5459.pdf | 144-LQFP | 3.63V | Contains Lead | 144 | 144 | Bluetooth, ACCESS.bus, Audio, CAN, Microwire/SPI, UART, USB | no | Tin | 24MHz | e3 | Connectivity Processor | 2.25V~2.75V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | CP3BT26 | 144 | NOT SPECIFIED | Microcontrollers | Not Qualified | 256kB | 48 | FLASH | RISC | 32K x 8 | 16b | 16 | 2 | YES | YES | FIXED POINT | NO | 23 | CR16C | FLASH (256kB) | CP3000 | ||||||||||||||||||||||||||||||||||
| AT97SC3205T-H3M4B20B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 1 (Unlimited) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | yes | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | AT97SC3205T | NOT SPECIFIED | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3204-G4M44-20 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | CryptoController™ | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1997 | /files/microchiptechnology-at97sc3204tu2mb00-datasheets-2249.pdf | 16 Weeks | LPC | Trusted Platform Module (TPM) | 3.3V | AT97SC3204 | AVR | EEPROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CP3BT26Y98AGK/NOPB | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | /files/texasinstruments-cp3bt26y98agknopb-datasheets-5461.pdf | 144-LQFP | 3.63V | Contains Lead | 144 | 144 | Bluetooth, ACCESS.bus, Audio, CAN, Microwire/SPI, UART, USB | no | Tin | 24MHz | e3 | Connectivity Processor | 2.25V~2.75V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | CP3BT26 | 144 | NOT SPECIFIED | Microcontrollers | Not Qualified | 256kB | 48 | FLASH | RISC | 32K x 8 | 16b | 16 | 2 | YES | YES | FIXED POINT | NO | 23 | CR16C | FLASH (256kB) | CP3000 | ||||||||||||||||||||||||||||||||||
| SLE66R35RMCC8XHSA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | 70°C | -25°C | ROHS3 Compliant | Die | 26 Weeks | 8 | ISO14443-3 Type A | Security | Wafer | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-G3M4B-20 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | 3.3V | AT97SC3205T | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66R35MCC8IXHSA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | Die | 26 Weeks | ISO14443-3 Type A | Security | Wafer | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66R35RMCC2XHSA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | 70°C | -25°C | ROHS3 Compliant | Die | 26 Weeks | ISO14443-3 Type A | Security | Wafer | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MAXQ1050B-2012+ | Maxim Integrated |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | ROHS3 Compliant | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SLE66R35E7MCC2ZZZA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~70°C | Tape & Reel (TR) | 1 (Unlimited) | ROHS3 Compliant | Die | 26 Weeks | ISO14443-3 Type A | Security | Wafer | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-G3M4B10B | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tray | 1 (Unlimited) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | yes | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | 3.3V | AT97SC3205T | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT97SC3205T-H3M4B-00 | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 0.9mm | ROHS3 Compliant | /files/microchiptechnology-at97sc3205tx3m4300-datasheets-2055.pdf | 32-VFQFN Exposed Pad | 32 | I2C | Trusted Platform Module (TPM) | YES | 3.3V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | AT97SC3205T | NOT SPECIFIED | S-XQCC-N32 | 4 | MICROPROCESSOR, RISC | 8 | NO | YES | FIXED POINT | YES | AVR | EEPROM |
