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ContactApplication Specific Microcontrollers(1956)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | Interface | ECCN Code | Additional Feature | Reach Compliance Code | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Applications | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Time@Peak Reflow Temperature-Max (s) | Adjustable Threshold | Subcategory | Power Supplies | Supply Current-Max (Isup) | Qualification Status | JESD-30 Code | Supplier Device Package | Consumer IC Type | Number of I/O | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MM912JS812AMAF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | /files/nxpusainc-mm912js812amafr2-datasheets-3330.pdf | 100-LQFP Exposed Pad | 14mm | 14mm | 100 | 18 Weeks | CAN, SCI, SPI | 3A991.A.2 | 8542.39.00.01 | e3 | Matte Tin (Sn) | Engine Control | YES | 4.7V~36V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MM912JS812 | 40 | S-PQFP-G100 | 6 | 8K x 8 | MICROPROCESSOR CIRCUIT | S12XS | FLASH (128kB) | HCS12 | ||||||||||||||||||||
| ASC8849ET/M2,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8849 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||
| ASC8850ET/M2,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8850 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||
| MM912F634CV2APR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3201.pdf | 48-LQFP | LIN, SCI | Automotive | 2.25V~5.5V | MM912F634 | 9 | 2K x 8 | S12 | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||
| MM912JP812AMAF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mm912ip812amaf-datasheets-3267.pdf | 100-LQFP Exposed Pad | 14mm | 14mm | 100 | 18 Weeks | CAN, SCI, SPI | 3A991.A.2 | e3 | Matte Tin (Sn) | Engine Control | YES | 4.7V~36V | QUAD | GULL WING | 260 | 0.5mm | MM912JP812 | 40 | S-PQFP-G100 | 8 | 6K x 8 | MICROPROCESSOR CIRCUIT | S12P | FLASH (128kB) | HCS12 | |||||||||||||||||||||
| ASC8848ET/M2,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | /files/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8848 | ARM9® | |||||||||||||||||||||||||||||||||||||||||||||
| MM912IP812AMAFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mm912ip812amaf-datasheets-3267.pdf | 100-LQFP Exposed Pad | 14mm | 14mm | 100 | 26 Weeks | CAN, SCI, SPI | 3A991.A.2 | e3 | Matte Tin (Sn) | Engine Control | YES | 4.7V~36V | QUAD | GULL WING | 260 | 0.5mm | MM912IP812 | 40 | S-PQFP-G100 | 8 | 6K x 8 | MICROPROCESSOR CIRCUIT | S12P | FLASH (96KB) | HCS12 | |||||||||||||||||||||
| MM912I637AV1EP | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | BICMOS | 0.9mm | ROHS3 Compliant | 2012 | /files/nxpusainc-mm912i637av1epr2-datasheets-3184.pdf | 48-VFQFN Exposed Pad | 7mm | 7mm | 48 | 26 Weeks | LIN, SCI, SPI | EAR99 | 1 | e3 | Matte Tin (Sn) | Battery Monitor | YES | 2.25V~5.5V | QUAD | NO LEAD | 260 | 0.5mm | MM912I637 | 3.5V | 1 | POWER SUPPLY MANAGEMENT CIRCUIT | 40 | YES | Power Management Circuits | 25mA | Not Qualified | 8 | 6K x 8 | S12 | FLASH (96KB) | HCS12 | |||||||||||||||
| ASC8849AETE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | /files/nxpusainc-asc8849aete-datasheets-3310.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8849 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||
| ASC8851AETE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2015 | /files/nxpusainc-asc8849aete-datasheets-3310.pdf | 484-TFBGA | 13 Weeks | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8851 | ARM9® | |||||||||||||||||||||||||||||||||||||||||||
| ASC8851ET/M2,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8851 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||
| MM912G634CV2APR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP | LIN, SCI | Automotive | 2.25V~5.25V | MM912G634 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||
| ASC8851ET/M2,557 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8851 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||
| MM912JS812AMAFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2011 | /files/nxpusainc-mm912js812amafr2-datasheets-3330.pdf | 100-LQFP Exposed Pad | 14mm | 14mm | 100 | 18 Weeks | CAN, SCI, SPI | 3A991.A.2 | 8542.39.00.01 | e3 | Matte Tin (Sn) | Engine Control | YES | 4.7V~36V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | MM912JS812 | 40 | S-PQFP-G100 | 6 | 8K x 8 | MICROPROCESSOR CIRCUIT | S12XS | FLASH (128kB) | HCS12 | ||||||||||||||||||||
| ASC8849ET/M2,557 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | /files/nxpusainc-asc8848etm2557-datasheets-3271.pdf | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8849 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||
| EM783-MC6E | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2013 | /files/nxpusainc-em783mc6e-datasheets-3334.pdf | 32-VQFN Exposed Pad | I2C, IrDA, SPI, UART/USART | Energy Measurement | 2.6V~3.6V | 32-HVQFN (7x7) | 22 | 8K x 8 | ARM® Cortex®-M0 | FLASH (32kB) | |||||||||||||||||||||||||||||||||||||||
| ASC8849ET,557 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8849 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||||
| MM912F634CV2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | LIN, SCI | Automotive | 2.25V~5.5V | MM912F634 | 9 | 2K x 8 | S12 | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||
| MM912F634BV1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | LIN, SCI | Automotive | 2.25V~5.5V | MM912F634 | 9 | 2K x 8 | S12 | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||
| TLE9831QVXUMA1 | Infineon Technologies |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~150°C TJ | Tape & Reel (TR) | 3 (168 Hours) | Non-RoHS Compliant | 2016 | 48-VFQFN Exposed Pad | LIN, SSI, UART | Automotive | 3V~27V | PG-VQFN-48-31 | 5 | 3.25K x 8 | XC800 | FLASH (36kB) | ||||||||||||||||||||||||||||||||||||||||
| MM912F634CV1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | LIN, SCI | Automotive | 2.25V~5.5V | MM912F634 | 9 | 2K x 8 | S12 | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||
| A7001AGHN1/T1AG315 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C | Tray | 1 (Unlimited) | ROHS3 Compliant | 2011 | /files/nxpusainc-a7001aghn1t1ag315-datasheets-3241.pdf | 32-VFQFN Exposed Pad | I2C, 2-Wire Serial | Authentication | 1.62V~5.5V | A700* | 32-HVQFN (5x5) | 3.2kB | MX51 | EEPROM (76.4kB) | A700x | ||||||||||||||||||||||||||||||||||||||
| ASC8850ET,557 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8850 | ARM9® | ||||||||||||||||||||||||||||||||||||||||||||||
| MM912G634CV1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | LIN, SCI | Automotive | 2.25V~5.25V | MM912G634 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||
| ASC8848ET,557 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tray | 3 (168 Hours) | ROHS3 Compliant | 2012 | 484-TFBGA | EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG | Embedded Multimedia Communication, Security and Entertainment | ASC8848 | ARM9® | |||||||||||||||||||||||||||||||||||||||||||||
| MM912H634CM1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP Exposed Pad | LIN, SCI | Automotive | 2.25V~5.25V | MM912H634 | 9 | 6K x 8 | S12 | FLASH (64kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||
| PNX1502E,557 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PNX15xx | Surface Mount | 0°C~85°C | Tray | 3 (168 Hours) | 2.45mm | ROHS3 Compliant | 2002 | /files/nxpusainc-pnx1501e557-datasheets-3213.pdf | 456-BGA | 27mm | 27mm | 456 | I2C, 2-Wire Serial | ALSO REQUIRES 3.3V SUPPLY | unknown | 8542.39.00.01 | 1 | e0 | TIN LEAD | Multimedia | YES | 1.23V~1.37V | BOTTOM | BALL | 225 | 1mm | PNX15* | 456 | 3.47V | 3.13V | 20 | Other Consumer ICs | 1.3V | Not Qualified | S-PBGA-B456 | CONSUMER CIRCUIT | 61 | TM3260 | Nexperia | |||||||||||||||
| MM912G634CM1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | 48-LQFP | LIN, SCI | Automotive | 2.25V~5.25V | MM912G634 | 9 | 2K x 8 | S12 | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||
| MM912F634CV2AP | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP | LIN, SCI | Automotive | 2.25V~5.5V | MM912F634 | 9 | 2K x 8 | S12 | FLASH (32KB) | HCS12 | ||||||||||||||||||||||||||||||||||||||
| MM912F634BV1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~105°C | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | /files/nxpusainc-mm912f634bv1aer2-datasheets-3202.pdf | 48-LQFP Exposed Pad | LIN, SCI | Automotive | 2.25V~5.5V | MM912F634 | 9 | 2K x 8 | S12 | FLASH (32KB) | HCS12 |
