Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Operating Temperature | Packaging | Size / Dimension | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Frequency | RoHS Status | Published | Datasheet | Package / Case | Operating Supply Voltage | Factory Lead Time | Interface | Connector Type | Radiation Hardening | Base Part Number | Memory Size | Memory Type | Core Architecture | RAM Size | Speed | Core Processor | Flash Size | Module/Board Type | Co-Processor |
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CENGPXA270-416-11-505EXR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Socket | -25°C~85°C | 2.37 x 2.67 60.2mmx67.8mm | 1 (Unlimited) | 85°C | -25°C | 416MHz | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/logic-cengpxa27052011504hcr-datasheets-7017.pdf | 12 Weeks | Edge Connector | No | 64MB | 416MHz | PXA270 | 64MB | MCU Core | |||||||||||||
3354-GX-X38-RC | Critical Link LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MitySOM | 0°C~70°C | Bulk | 2.66 x 1.5 67.6mmx38.1mm | 1 (Unlimited) | 70°C | 0°C | 720MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/criticallinkllc-80000634-datasheets-3699.pdf | Module | 3.3V | CAN, GPIO, I2C, MMC, SD, SPI, USB | SO-DIMM-204 | 512MB | DDR3 | ARM | 512MB | 720MHz | ARM® Cortex®-A8, AM3354 | 512MB | MPU Core | NEON™ SIMD | |||||||
CC-WMX-KD47-VM | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | ||||||||||||||||||||||||
CC-MX-KD47-ZM | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | 2016 | Board-to-Board (BTB) Socket - 360 | 1GHz | ARM® Cortex®-A8, i.MX53 | 512MB | MPU Core | ||||||||||||||||||||||
TE0741-02-160-2C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0741 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | ROHS3 Compliant | 2016 | /files/trenzelectronicgmbh-te0741021602if-datasheets-7107.pdf | Samtec LSHM | 200MHz | Kintex-7 160T | 32MB | FPGA Core | ||||||||||||||||||||
SOMDM3730-20-1880AGIR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DM37x | -40°C~85°C | 0.59 x 1.06 15mmx27mm | 1 (Unlimited) | 85°C | -40°C | 800MHz | RoHS Compliant | 2013 | Module | 12 Weeks | Board-to-Board (BTB) Socket - 200 | ARM | 512MB | 800MHz | ARM® Cortex®-A8, DM3730 | 512MB | MPU, DSP Core | TMS320C64x (DSP) | ||||||||||||
TE0600-02IN | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0600 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | ROHS3 Compliant | 2008 | /files/xilinxinc-xc6slx452csg484c-datasheets-5636.pdf | Samtec LSHM | 256MB | 125MHz | Spartan-6 LX-45 | 16MB | FPGA Core | |||||||||||||||||||
CC-WMX-LB69-EYK1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | ||||||||||||||||||||||||
SOMXOMAPL138-10-1602AHCR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP-L138 | 0°C~70°C | 1.18 x 1.57 30mmx40mm | 1 (Unlimited) | 70°C | 0°C | 375MHz | RoHS Compliant | 2010 | /files/logic-sdkxomapl138106408r-datasheets-4390.pdf | Module | Board-to-Board (BTB) Socket - 300 | ARM | 128MB | 375MHz | ARM926EJ-S, OMAP-L138 | 8MB | MPU, DSP Core | TMS320C6748 | ||||||||||||
CC-MX-MB6B-SLB | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | |||||||||||||||||||||||
TE0745-01-35-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | 0°C~70°C | 2.05 x 2.99 52mmx76mm | ROHS3 Compliant | 2013 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4558.pdf | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | |||||||||||||||||||
TE0600-02B | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0600 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc6slx452csg484c-datasheets-5636.pdf | Samtec LSHM | 256MB | 125MHz | Spartan-6 LX-100 | 16MB | FPGA Core | |||||||||||||||||||
TE0741-02-160-2IF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0741 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | ROHS3 Compliant | 2016 | /files/trenzelectronicgmbh-te0741021602if-datasheets-7107.pdf | Samtec LSHM | 200MHz | Kintex-7 160T | 32MB | FPGA Core | ||||||||||||||||||||
CC-WMX-LD79-QTC1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | |||||||||||||||||||||||
CC-WMX-LB69-CV-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | |||||||||||||||||||||||
TE0725-02-15-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0725 | 0°C~70°C | 2.87 x 1.38 73mmx35mm | ROHS3 Compliant | 2012 | /files/xilinxinc-xc7a15t2fgg484c-datasheets-5466.pdf | 50 Pin | 100MHz | Artix-7 A15T | 32MB | FPGA Core | ||||||||||||||||||||
TE0745-01-45-2I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/xilinxinc-xc7z045l2ffg676i-datasheets-4558.pdf | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | |||||||||||||||||||
CC-WMX-KD47-VM-B | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | ||||||||||||||||||||||||
CC-WMX-LC47-VM | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | |||||||||||||||||||||||
SOMDM3730-32-2880AKXR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DM37x | -40°C~70°C | 0.59 x 1.3 15mmx33mm | 1 (Unlimited) | 70°C | -40°C | 1GHz | RoHS Compliant | 2012 | 16 Weeks | Board-to-Board (BTB) Socket - 200 | ARM | 512MB | 1GHz | ARM® Cortex®-A8, DM3730 | 512MB | MPU, DSP Core | TMS320C64x (DSP) | |||||||||||||
CC-WMX-LD79-QTC | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® i.MX53 | 1 (Unlimited) | RoHS Compliant | 2016 | /files/digi-ccwmxld79qtc-datasheets-7078.pdf | 800MHz | i.MX53 | MPU Core | |||||||||||||||||||||||
TE0741-02-070-2IF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0741 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | ROHS3 Compliant | 2016 | /files/trenzelectronicgmbh-te0741021602if-datasheets-7107.pdf | Samtec LSHM | 200MHz | Kintex-7 70T | 32MB | FPGA Core | ||||||||||||||||||||
CC-MX-MB6B-SLB-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | |||||||||||||||||||||||
CC-WMX-LB69-EYK | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | ||||||||||||||||||||||||
CC-MX-LD79-QTC-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | 1GB | 800MHz | ARM® Cortex®-A8, i.MX53 | 512MB | MPU Core | ||||||||||||||||||||
DLP-HS-FPGA3 | DLP Design Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | FPGA | 0°C~70°C | 3 x 1.2 76.2mmx30.5mm | 1 (Unlimited) | 70°C | 0°C | 66MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/dlpdesigninc-dlphsfpga3-datasheets-7050.pdf | Module | 5V | 8 Weeks | SPI, USB | USB - B, Pin Header | 32MB | 66MHz | Spartan-3A, XC3S1400A | FPGA, USB Core | FT2232H | |||||||||||
CC-MX-LD79-QTC | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | 1GB | 800MHz | ARM® Cortex®-A8, i.MX53 | 512MB | MPU Core | ||||||||||||||||||||
100-1470-2 | BECOM Systems GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | i.MX | -40°C~85°C | 3.15 x 1.77 80mmx45mm | 5A (24 Hours) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/becomsystemsgmbh-1004120-datasheets-5034.pdf | Expansion 3 x 100 | 1GB | 800MHz | CM-i.MX53 | 2GB N 4MB NOR | MPU Core | |||||||||||||||||||
CC-MX-MB69-ZK-B | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1 (Unlimited) | RoHS Compliant | 2015 | Module | 4 Weeks | |||||||||||||||||||||||||
XRM57D843ZWTT | Texas Instruments |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | ROHS3 Compliant | Module | 57D843 |
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