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ContactEmbedded ICs Modules(1001)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Operating Temperature | Size / Dimension | Moisture Sensitivity Level (MSL) | RoHS Status | Published | Datasheet | Factory Lead Time | Connector Type | RAM Size | Speed | Core Processor | Flash Size | Module/Board Type | Co-Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TE0808-04-09EG-1EE | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te08080415eg1ee-datasheets-7549.pdf | B2B | 4GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | 128MB | MPU Core | |||||||
| TE0807-02-07EV-1E | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0807 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08070207ev1e-datasheets-7641.pdf | 14 Weeks | B2B | 4GB | Zynq UltraScale+ XCZU7EV-1FBVB900E | 128MB | MPU Core | |||||||
| TE0745-02-35-1CA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | 0°C~70°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | 2018 | /files/trenzelectronicgmbh-te074501452i-datasheets-7133.pdf | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | |||||
| TE0820-03-03CG-1ED | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 1GB | Zynq UltraScale+ XCZU3CG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0745-02-45-1CA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | 0°C~70°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te074501452i-datasheets-7133.pdf | 14 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | |||||
| TE0713-01-200-2C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0713 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | Not Applicable | /files/trenzelectronicgmbh-te0713012002c-datasheets-7652.pdf | Samtec LSHM | 1GB | 200MHz | Artix-7 A200T | 32MB | FPGA Core | |||||||
| TE0841-02-035-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | ROHS3 Compliant | /files/trenzelectronicgmbh-te0841020351c-datasheets-7596.pdf | B2B | 2GB | Kintex UltraScale KU035 | 64MB | FPGA Core | ||||||||
| TE0808-04-15-1EE-S | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te080804151ees-datasheets-7659.pdf | MPU Core | |||||||||||||
| TE0820-02-03CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | /files/trenzelectronicgmbh-te08200202cg1ea-datasheets-7520.pdf | B2B | 1GB | Zynq UltraScale+ XCZU3CG-1SFVC784E | 128MB | MPU Core | |||||||||
| DC-ME4-01T-HPA-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~85°C | 1.45 x 0.75 36.7mmx19.1mm | 1 (Unlimited) | RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 4MB | MPU Core | ||||||||
| TE0820-03-04CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU4EV-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0803-03-4DE21-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te0803034de21l-datasheets-7661.pdf | |||||||||||||||
| TE0820-03-02CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | Not Applicable | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0820-03-4AE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||
| SOMM5485-MED01-0201R-A | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||
| TE0630-01IBF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0630 | -40°C~85°C | 1.6 x 1.9 40.5mmx47.5mm | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te063001i-datasheets-7476.pdf | 12 Weeks | B2B | 128MB | 100MHz | Spartan-6 LX-75 | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | ||||
| DC-ME4-01T-CC-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~85°C | 1.45 x 0.75 36.7mmx19.1mm | Not Applicable | RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 4MB | MPU Core | ||||||||
| TE0808-04-15EG-1EE | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08080415eg1ee-datasheets-7549.pdf | 14 Weeks | B2B | 2GB | Zynq UltraScale+ XCZU15EG-1FFVC900E | 128MB | MPU Core | |||||||
| SOMDM3730-11-1783IFXR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DM37x | -20°C~70°C | 3 x 1.22 76.2mmx31mm | 1 (Unlimited) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/logic-somdm3730101782ifxr-datasheets-6854.pdf | 12 Weeks | 256MB | 800MHz | DM3730 | 512MB N 16MB NOR | MPU Core | ||||||
| TE0820-02-02EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08200202cg1ea-datasheets-7520.pdf | B2B | 1GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0745-02-30-1IA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | 2018 | /files/trenzelectronicgmbh-te074501452i-datasheets-7133.pdf | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | |||||
| UC2550-13NNN | GHI Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 2.67 x 1.25 67.7mmx31.7mm | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/ghielectronicsllc-uc255013nnn-datasheets-7557.pdf | 8 Weeks | 320KB | 100MHz | ARM® Cortex®-M4 | 1MB Internal 4MB External | MPU Core | ||||||||
| CC-9C-V223-RJ | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | -40°C~85°C | 2.06 x 3.59 52.2mmx91.2mm | 1 (Unlimited) | SO-DIMM-144 | 155MHz | ARM926EJ-S, NS9360 | MPU Core | ||||||||||
| TE0841-02-035-1I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te0841020351i-datasheets-7558.pdf | B2B | 2GB | Kintex UltraScale KU035 | 64MB | FPGA Core | ||||||||
| TE0745-02-45-2IA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | 2018 | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te074501452i-datasheets-7133.pdf | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | ||||
| TE0820-02-03EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | Not Applicable | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08200202cg1ea-datasheets-7520.pdf | B2B | 1GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | ||||||||
| DC-ME4-01T-CC | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~85°C | 1.45 x 0.75 36.7mmx19.1mm | Not Applicable | RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 4MB | MPU Core | ||||||||
| M5475JFEE-B | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | 0°C~70°C | 1 (Unlimited) | 64MB | 266MHz | ColdFire V4e, MCF5475 | 16MB | MPU Core | ||||||||||
| M5485BFEE-E | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ColdFire® | -40°C~85°C | 3.7 x 4.5 95mmx114mm | 1 (Unlimited) | /files/logic-m5485afeed-datasheets-6652.pdf | 64MB | 200MHz | ColdFire V4e, MCF5485 | 16MB NOR 2MB Boot | MPU Core | ||||||||
| TE0841-01-040-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | Not Applicable | 2012 | /files/xilinxinc-xcku0402ffva1156e-datasheets-6080.pdf | 12 Weeks | Samtec LSHM | 4GB | Kintex UltraScale KU40 | 32MB | FPGA Core |
