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ContactEmbedded ICs Modules(1001)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Operating Temperature | Size / Dimension | Moisture Sensitivity Level (MSL) | RoHS Status | Published | Datasheet | Factory Lead Time | Connector Type | RAM Size | Speed | Core Processor | Flash Size | Module/Board Type | Co-Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TE0808-04-06EG-1EK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | ROHS3 Compliant | /files/trenzelectronicgmbh-te080804151ees-datasheets-7659.pdf | B2B | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | 128MB | MPU Core | |||||||
| TE0803-01-03CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0803 | 0°C~85°C | 2.99 x 2.05 76mmx52mm | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08030103cg1ea-datasheets-7617.pdf | B2B | 2GB | Zynq UltraScale+ XCZU3CG-1SFVC784E | 128MB | MPU Core | |||||||
| CC-WMX-LB69-CV | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | 1.97 x 3.23 50mmx82mm | 1 (Unlimited) | RoHS Compliant | 2016 | Board-to-Board (BTB) Socket - 360 | ARM® Cortex®-A8, i.MX53 | MPU Core | ||||||||||
| TE0820-03-02EG-1EL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200302eg1el-datasheets-7621.pdf | B2B | 2GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0820-03-03EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~80°C | 1.57 x 1.97 40mmx50mm | Not Applicable | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | B2B | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0820-03-03EG-1EL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.57 x 1.97 40mmx50mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200302eg1el-datasheets-7621.pdf | B2B | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | 128MB | MPU Core | ||||||||
| TEC0850-03-BBEX1-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Not Applicable | ROHS3 Compliant | ||||||||||||||||
| TE0841-02-040-1C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | 0°C~70°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te0841020401c-datasheets-7625.pdf | 14 Weeks | B2B | 2GB | Kintex UltraScale KU40 | 64MB | MCU, FPGA | |||||||
| TE0820-03-3BE21FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | /files/trenzelectronicgmbh-te08200304cg1ea-datasheets-7603.pdf | ||||||||||||||||
| UC5550-67HFN | GHI Electronics, LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 2.67 x 1.25 67.7mmx31.7mm | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/ghielectronicsllc-uc555067hfn-datasheets-7631.pdf | 8 Weeks | 512KB Internal 32MB External | 216MHz | ARM® Cortex®-M7 | 2MB Internal 4MB External | MPU Core | ||||||||
| TE0808-04-06EG-1EE | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | /files/trenzelectronicgmbh-te08080409eg2ie-datasheets-7578.pdf | 12 Weeks | B2B | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | 128MB | MPU Core | |||||||
| DC-ME-01T-KC-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~85°C | 0.75 x 1.44 19.1mmx36.7mm | 1 (Unlimited) | RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 2MB | MPU Core | ||||||||
| TE0808-04-09EG-2IE | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te08080409eg2ie-datasheets-7578.pdf | 14 Weeks | B2B | 4GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | 128MB | MPU Core | |||||||
| TE0841-02-040-1I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0841 | -40°C~85°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | /files/trenzelectronicgmbh-te0841020401i-datasheets-7637.pdf | 14 Weeks | B2B | 512MB | Kintex UltraScale KU40 | 32MB | FPGA Core | |||||||
| SOMOMAP3530-12-1783IFXR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP35x | -20°C~70°C | 3.01 x 1.23 76.5mmx31.2mm | 1 (Unlimited) | RoHS Compliant | 12 Weeks | 256MB | 600MHz | OMAP3530 | 512MB N 16MB NOR | MPU, DSP Core | TMS320C64x (DSP) | ||||||
| TE0820-02-02CG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08200202cg1ea-datasheets-7520.pdf | B2B | 1GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | 128MB | MPU Core | |||||||||
| 3354-IX-X3A-RC | Critical Link LLC |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MitySOM | 0°C~70°C | 2.66 x 1.5 67.6mmx38.1mm | RoHS Compliant | 2014 | /files/criticallinkllc-80000634-datasheets-3699.pdf | 10 Weeks | SO-DIMM-204 | 1GB | 1GHz | ARM® Cortex®-A8, AM3354 | 512MB | MPU Core | NEON™ SIMD | ||||
| SOMOMAP3503-11-1782GFIR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | OMAP35x | -40°C~85°C | 1.23 x 3.01 31.2mmx76.5mm | 1 (Unlimited) | Non-RoHS Compliant | 2017 | Board-to-Board (BTB) Socket - 240 | 256MB | 600MHz | ARM® Cortex®-A8, OMAP3503 | 512MB N 8MB NOR | MPU Core | ||||||
| FS-3038 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ConnectCore® | -40°C~85°C | 1 (Unlimited) | 32MB | 150MHz | ARM926EJ-S, NS9215 | 16MB | MPU Core | ||||||||||
| SOMMCF5485-INV01-0703R-A | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||
| TE0745-02-45-2I | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | 2010 | /files/xilinxinc-xc7z045l2ffg676i-datasheets-4558.pdf | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | |||||
| TE0630-01IV | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0630 | -40°C~85°C | 1.6 x 1.9 40.5mmx47.5mm | Not Applicable | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te063001i-datasheets-7476.pdf | 12 Weeks | B2B | 128MB | 100MHz | Spartan-6 LX-150 | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | |||
| TE0745-02-30-2IA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.99 x 2.05 76mmx52mm | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te074501452i-datasheets-7133.pdf | 14 Weeks | 1GB | ARM® Cortex®-A9 | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | ||||||
| SOMM5485-MED01-0201R-A | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | |||||||||||||||||
| TE0630-01IBF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0630 | -40°C~85°C | 1.6 x 1.9 40.5mmx47.5mm | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te063001i-datasheets-7476.pdf | 12 Weeks | B2B | 128MB | 100MHz | Spartan-6 LX-75 | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | ||||
| DC-ME4-01T-CC-1 | Digi |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Digi Connect ME® | -40°C~85°C | 1.45 x 0.75 36.7mmx19.1mm | Not Applicable | RJ45 | 8MB | 55MHz | ARM7TDMI, NS7520 | 4MB | MPU Core | ||||||||
| TE0808-04-15EG-1EE | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0808 | 0°C~85°C | 2.05 x 2.99 52mmx76mm | Not Applicable | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08080415eg1ee-datasheets-7549.pdf | 14 Weeks | B2B | 2GB | Zynq UltraScale+ XCZU15EG-1FFVC900E | 128MB | MPU Core | |||||||
| SOMDM3730-11-1783IFXR | Logic |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DM37x | -20°C~70°C | 3 x 1.22 76.2mmx31mm | 1 (Unlimited) | RoHS Compliant | https://pdf.utmel.com/r/datasheets/logic-somdm3730101782ifxr-datasheets-6854.pdf | 12 Weeks | 256MB | 800MHz | DM3730 | 512MB N 16MB NOR | MPU Core | ||||||
| TE0820-02-02EG-1EA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0820 | 0°C~85°C | 1.97 x 1.57 50mmx40mm | 1 (Unlimited) | https://pdf.utmel.com/r/datasheets/trenzelectronicgmbh-te08200202cg1ea-datasheets-7520.pdf | B2B | 1GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | 128MB | MPU Core | ||||||||
| TE0745-02-30-1IA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | TE0745 | -40°C~85°C | 2.05 x 2.99 52mmx76mm | 1 (Unlimited) | 2018 | /files/trenzelectronicgmbh-te074501452i-datasheets-7133.pdf | 12 Weeks | Samtec UFPS | 1GB | ARM® Cortex®-A9 | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) |
