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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Access Mode | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 7130LA55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la55pf-datasheets-6330.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 1kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 20b | 1KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||
| 70T3589S200BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3589s200bc8-datasheets-6322.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 2.3 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 525mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 32b | 64KX36 | 0.015A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| IDT71V25761SA183BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 183MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761sa183bq8-datasheets-6318.pdf | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V9369L7PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 45.45MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9369l7pf-datasheets-6314.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 288 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 18 ns | 28b | 16KX18 | 0.005A | 18b | Synchronous | COMMON | 3V | ||||||||||||||||||||||
| 70V7339S133BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.5mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7339s133bc8-datasheets-6273.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 645mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 25 ns | 38b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71V3556S166BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | SYNCHRONOUS | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s166bq8-datasheets-6244.pdf | 165 | 165 | Parallel | not_compliant | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 3.3V | 1mm | COMMERCIAL | SRAMs | 3.3V | 0.35mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.04A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||
| 71321SA25TF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa25tf8-datasheets-6235.pdf | TQFP | 10mm | 10mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 11b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 7024L20G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024l20g-datasheets-6170.pdf | 27.94mm | 27.94mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.68mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | PERPENDICULAR | PIN/PEG | 240 | 5V | 84 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 24b | 4KX16 | 0.0015A | COMMON | 2V | ||||||||||||||||||||||||||
| 70V3379S4PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s4prf-datasheets-6147.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | 460mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | 72kB | RAM, SDR, SRAM | 3-STATE | 4.2 ns | 30b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7132SA55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132sa55j-datasheets-6134.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| 71V3556SA166BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa166bqg8-datasheets-6130.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | 350mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | RAM, SRAM | 3.5 ns | 17b | 36b | Synchronous | ||||||||||||||||||||||||||||||||
| IDT71V25761SA183BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 183MHz | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761sa183bq-datasheets-6120.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 2.53.3V | 0.34mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.03A | 3.3 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 71V67903S75BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 117MHz | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67903s75bqgi-datasheets-6081.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 3.465V | 3.135V | 165 | Parallel | 9 Mb | yes | 1.2mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 285mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 7.5 ns | 19b | 0.07A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 70V658S15BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v658s15bc8-datasheets-6077.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 2.3 Mb | no | 1.4mm | 2 | No | 1 | 440mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 32b | 64KX36 | 0.015A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| W97AH2KBQX2E | Winbond Electronics Corporation |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -25°C | CMOS | 400MHz | SYNCHRONOUS | 0.8mm | RoHS Compliant | 12mm | 12mm | 168 | 168 | Parallel | 1 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 1 | YES | BOTTOM | BALL | 1.2V | 0.5mm | 1.3V | 1.14V | RAM, SDRAM | 32MX32 | 32 | 1073741824 bit | MULTI BANK PAGE BURST | ||||||||||||||||||||||||||||||||||||||||||||||
| 71V3579S85PFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3579s85pfgi-datasheets-6069.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW THROUGH ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 87MHz | 3-STATE | 8.5 ns | 18b | 0.035A | COMMON | |||||||||||||||||||||||||||
| 7132SA25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132sa25j-datasheets-6066.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 220mA | 2kB | RAM, SDR, SRAM | 25 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70V9179L12PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9179l12pf-datasheets-6054.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 288 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 230mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 36kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 30b | 0.003A | 9b | Synchronous | COMMON | 3V | |||||||||||||||||||||
| 70V3379S4BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s4bf8-datasheets-6042.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | 72kB | RAM, SDR, SRAM | 3-STATE | 4.2 ns | 15b | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| IDT71V25761SA183BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 183MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v25761sa183bgi8-datasheets-6039.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 3.3V | 1.27mm | 119 | INDUSTRIAL | 3.465V | 3.135V | SRAMs | 2.53.3V | 0.35mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.035A | 3.3 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| IDT71V65803S100PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65803s100pfi8-datasheets-6038.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.27mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX18 | 18 | 9437184 bit | 0.06A | 5 ns | COMMON | 3.14V | |||||||||||||||||||||||||
| IDT71V416L12Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416l12y8-datasheets-6029.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.17mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.01A | 12 ns | COMMON | 3V | ||||||||||||||||||||||||||||
| 7027L25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7027l25pf8-datasheets-6030.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 265mA | 64kB | RAM, SDR, SRAM | 25 ns | 30b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 71T75902S75BGG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | 2.36mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75902s75bgg-datasheets-6002.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 275mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | INDUSTRIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 100MHz | 3-STATE | 7.5 ns | 20b | 0.04A | 18b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||
| 70V3379S4BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s4bf-datasheets-5975.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | 72kB | RAM, SDR, SRAM | 3-STATE | 4.2 ns | 30b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 6116SA25SOGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 1 (Unlimited) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116sa25sogi8-datasheets-5965.pdf | SOIC | 15.4mm | 7.6mm | 5V | Lead Free | 24 | 7 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | yes | 2.34mm | 1 | EAR99 | No | 1 | 100mA | e3 | MATTE TIN | DUAL | GULL WING | 260 | 5V | 24 | INDUSTRIAL | 30 | SRAMs | 5V | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 25 ns | 11b | 2KX8 | 0.002A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| CY7C1352F-133AC | Cypress Semiconductor |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | LQFP | 20mm | 14mm | Contains Lead | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | TIN LEAD (800) | YES | QUAD | GULL WING | 225 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.63V | 3.135V | 30 | SRAMs | 2.5/3.33.3V | 0.225mA | Not Qualified | R-PQFP-G100 | 4.3MB | RAM, SRAM | 3-STATE | 133 μs | 256KX18 | 18 | 4718592 bit | 0.04A | COMMON | 3.14V | |||||||||||||||||||||||||
| IDT71V416S10Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s10y8-datasheets-5955.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | 1 | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | SRAMs | 3.3V | 0.2mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 10 ns | COMMON | 3V | YES | |||||||||||||||||||||||||||||
| 70V06L25PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06l25pfi8-datasheets-5947.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | LOW POWER STANDBY; BATTERY BACK UP | No | 1 | 180mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | INDUSTRIAL | 20 | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 28b | 16KX8 | 0.005A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||
| 70121S55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70121s55j-datasheets-5946.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 18 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2.3kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.015A | 9b | Asynchronous | COMMON | 2V |
