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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RMLV0408EGSP-4S2#CA0 | Renesas | $424.31 |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | CMOS | ASYNCHRONOUS | RoHS Compliant | SOIC | Lead Free | 32 | Parallel | yes | 1 | YES | DUAL | GULL WING | 3V | 32 | INDUSTRIAL | 3.6V | 2.7V | R-PDSO-G32 | 512kB | RAM, SRAM | 45 ns | 512KX8 | 8 | 4194304 bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3579S6BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s6bci-datasheets-5774.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | No | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | 0.36mA | 128kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 83MHz | 30b | COMMON | ||||||||||||||||||||||||||||||||||||
| IDT71024S12YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71024s12yi-datasheets-5745.pdf | 20.96mm | 10.16mm | 32 | 32 | Parallel | no | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.16mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||
| 7006S25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s25pf8-datasheets-5737.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 28b | 16KX8 | 0.015A | COMMON | ||||||||||||||||||||||||||||||
| IDT71V3559S75PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3559s75pf-datasheets-5728.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.275mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 256KX18 | 18 | 4718592 bit | 0.04A | 7.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||
| 7133SA90GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133sa90gb-datasheets-5700.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.68mm | 2 | No | 1 | 310mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | MILITARY | 20 | SRAMs | 5V | MIL-PRF-38535 | 4kB | RAM, SDR, SRAM | 3-STATE | 90 ns | 22b | 0.015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||||||
| 71V35761SA183BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 183MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa183bgi-datasheets-5677.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 350mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 183MHz | 3-STATE | 3.3 ns | 17b | 0.035A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||
| 71V016SA15BF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa15bf8-datasheets-5673.pdf | 7mm | 7mm | 3.3V | Contains Lead | 12 Weeks | 3.6V | 3V | 48 | Parallel | 1 Mb | 1.4mm | 1 | No | 130mA | 128kB | RAM, SDR, SRAM - Asynchronous | 15 ns | 16b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7132SA55CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2007 | /files/integrateddevicetechnology-7132sa55cb-datasheets-5626.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 16 kb | 3.3mm | 2 | No | 190mA | RAM, SRAM | 55 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V7519S133DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7519s133dr-datasheets-5628.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 9 Mb | no | 3.5mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 645mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | INDUSTRIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 25 ns | 36b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||
| 70261L20PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70261l20pfi8-datasheets-5624.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 315mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 28b | 16KX16 | 0.01A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 70V631S12PRFGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v631s12prfgi-datasheets-5623.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 4.5 Mb | yes | 1.4mm | 2 | No | 1 | 515mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 128 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 36b | 0.015A | 18b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||
| IDT71V016SA10PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa10ph8-datasheets-5619.pdf | TSOP | 3.3V | 44 | 3.6V | 3.15V | 44 | Parallel | 1 Mb | 1 | not_compliant | 1 | 160mA | e0 | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 20 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 10 ns | 16b | 16 | 16b | Asynchronous | COMMON | YES | |||||||||||||||||||||||||||||||||||||||
| IDT71024S12Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 1997 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71024s12y-datasheets-5612.pdf | 20.96mm | 10.16mm | 32 | 32 | Parallel | no | 1 | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.16mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | YES | |||||||||||||||||||||||||||||||||||
| 709269L15PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709269l15pf8-datasheets-5611.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 40MHz | 28b | 16KX16 | 0.005A | COMMON | ||||||||||||||||||||||||||||||
| 70V3589S166DRG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Through Hole | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s166drg8-datasheets-5542.pdf | PQFP | 28mm | 28mm | 3.3V | Lead Free | 208 | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | yes | 3.5mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 208 | COMMERCIAL | 30 | SRAMs | 0.5mA | 256kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 32b | 64KX36 | 0.03A | COMMON | |||||||||||||||||||||||||||||||||
| IDT71024S12TY | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.759mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71024s12ty-datasheets-5540.pdf | 20.96mm | 7.62mm | 32 | 32 | Parallel | no | 1 | 3A991.B.2.B | not_compliant | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 5V | 1.27mm | 32 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.16mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | YES | |||||||||||||||||||||||||||||||||||
| 7008L20JI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l20ji8-datasheets-5532.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 335mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | INDUSTRIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 32b | 64KX8 | 0.01A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 71V3556SA150BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | 150MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa150bg-datasheets-5520.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | No | e0 | Tin/Lead (Sn63Pb37) | 225 | 119 | 512kB | RAM, SDR, SRAM | 150MHz | 17b | |||||||||||||||||||||||||||||||||||||||||||||||||
| 71V35761SA200BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa200bqg-datasheets-5511.pdf | FBGA | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 360mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 200MHz | 3-STATE | 3.1 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||
| 7034L20PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 85°C | -40°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7034l20pfi-datasheets-5487.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 72 kb | 1.4mm | 2 | No | 320mA | 9kB | RAM, SDR, SRAM | 20 ns | 12b | 18b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 7005L17PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l17pf8-datasheets-5416.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 17 ns | 26b | 8KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||
| 70V3589S166DRG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s166drg-datasheets-5417.pdf | PQFP | 28mm | 28mm | 3.3V | Lead Free | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | yes | 3.5mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 3.3V | 0.5mm | 208 | COMMERCIAL | SRAMs | 0.5mA | 256kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 32b | 64KX36 | 0.03A | COMMON | ||||||||||||||||||||||||||||||||
| 70261S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70261s20pf-datasheets-5406.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 315mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 28b | 16KX16 | 0.015A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 70T633S10BFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s10bfi8-datasheets-5404.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 38b | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||||
| 709269S15PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 28.5MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709269s15pf8-datasheets-5405.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 325mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 14b | 16KX16 | 0.015A | 16b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 70T653MS12BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t653ms12bc-datasheets-5402.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 18 Mb | no | 1.4mm | 2 | No | 1 | 710mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 2.3MB | RAM, SDR, SRAM | 3-STATE | 12 ns | 38b | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||
| MX25U3235FZNI-10G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 104MHz | SYNCHRONOUS | 0.8mm | RoHS Compliant | 6mm | 5mm | Lead Free | 8 | SPI, Serial | CAN BE ORGANISED AS 32 MBIT X 1 | 1 | e3 | Matte Tin (Sn) | YES | DUAL | NO LEAD | 260 | 1.8V | 1.27mm | 8 | INDUSTRIAL | 2V | 1.65V | 40 | Flash Memories | 1.8V | 0.025mA | Not Qualified | R-PDSO-N8 | 4MB | FLASH, NOR | 1.8V | 8MX4 | 4 | 33554432 bit | 2 | 0.00002A | SPI | 100000 Write/Erase Cycles | 10 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||
| 70T3539MS166BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3539ms166bcg-datasheets-5347.pdf | 17mm | 17mm | 2.5V | Lead Free | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 18 Mb | yes | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 900mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.6 ns | 38b | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||
| 70V24L35PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24l35pfg-datasheets-5339.pdf | TQFP | 14mm | 14mm | 3.3V | Lead Free | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 64 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | 155mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100 | COMMERCIAL | 30 | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX16 | 16b | Asynchronous | COMMON | 3V |
