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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| X20C16SI-35 | Intersil (Renesas Electronics America) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Bulk | 85°C | -40°C | 35GHz | Non-RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/intersil-x20c16si35-datasheets-5329.pdf | SOIC | Contains Lead | Parallel | 15.6kB | Non-Volatile, RAM, SRAM | 35 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3589S133DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s133dr-datasheets-5315.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 3.5mm | 2 | No | 1 | 400mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | COMMERCIAL | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX36 | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||
| 7015L17PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7015l17pf-datasheets-5304.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 72 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | 5V | 9kB | RAM, SDR, SRAM | 3-STATE | 17 ns | 26b | 8KX9 | 0.005A | 9b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 70V24L35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24l35j8-datasheets-5300.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX16 | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||||||
| IDT71T75702S85PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75702s85pf-datasheets-5297.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | COMMERCIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.225mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 90MHz | 512KX36 | 36 | 18874368 bit | 0.04A | 8.5 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||
| 70V26S55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v26s55j8-datasheets-5287.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 256 kb | no | 3.63mm | 2 | EAR99 | SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | 32kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 14b | 16KX16 | 0.006A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||
| MX25U3235FM2I-10G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 104MHz | SYNCHRONOUS | 2.16mm | RoHS Compliant | SOIC | 5.23mm | Lead Free | 8 | 8 | SPI, Serial | CAN BE ORGANISED AS 32 MBIT X 1 | 1 | e3 | Matte Tin (Sn) | YES | DUAL | GULL WING | 260 | 1.8V | 1.27mm | 8 | INDUSTRIAL | 2V | 1.65V | 40 | Flash Memories | 0.025mA | Not Qualified | 4MB | FLASH, NOR | 4 | 33554432 bit | 2 | 0.00002A | SPI | 100000 Write/Erase Cycles | 10 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||
| 70V35L20PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v35l20pfgi8-datasheets-5239.pdf | LQFP | 14mm | 14mm | 3.3V | Lead Free | 100 | 7 Weeks | 100 | Parallel | 144 kb | yes | 1.4mm | 2 | EAR99 | No | 1 | e3 | Matte Tin (Sn) | YES | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100 | INDUSTRIAL | 3.6V | 3V | RAM, SRAM | 26b | 8KX18 | ||||||||||||||||||||||||||||||||||||||||
| 71V321S55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321s55j8-datasheets-5204.pdf | PLCC | 19mm | 19mm | 3.3V | Contains Lead | 52 | 7 Weeks | 3.6V | 3V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | BATTERY BACKUP;AUTOMATIC POWER DOWN | No | 1 | 115mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 52 | COMMERCIAL | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.005A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||||
| 7164S85DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s85db-datasheets-5195.pdf | CDIP | 37.2mm | 15.24mm | 5V | Contains Lead | 28 | 28 | Parallel | 64 kb | no | 1.65mm | 1 | No | 1 | e0 | Tin/Lead (Sn63Pb37) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 28 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | RAM, SRAM - Asynchronous | 3-STATE | 13b | 8KX8 | 0.02A | 85 ns | COMMON | ||||||||||||||||||||||||||||||||||||||
| 70V9359L9PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 40MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9359l9pf8-datasheets-5193.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 230mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 9 ns | 26b | 8KX18 | 0.003A | 18b | Synchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| 7164S20TPG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.572mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s20tpg-datasheets-5162.pdf | PDIP | 34.3mm | 7.62mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 64 kb | yes | 3.3mm | 1 | EAR99 | 1 | 100mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 2.54mm | 28 | COMMERCIAL | NOT SPECIFIED | SRAMs | 5V | Not Qualified | 8kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 13b | 8KX8 | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||
| 70V3579S6BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 83MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s6bc-datasheets-5149.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | No | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 6 ns | 30b | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||||||
| 7006S55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s55pf8-datasheets-5139.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 28b | 16KX8 | 0.015A | COMMON | ||||||||||||||||||||||||||||||||
| 7140SA100CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140sa100cb-datasheets-5117.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 48 | Parallel | 8 kb | 3.3mm | 2 | No | 190mA | RAM, SRAM | 100 ns | 20b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7008L15J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l15j-datasheets-5114.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | No | 1 | 325mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||
| IDT71V3579S75PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579s75pf8-datasheets-5107.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | SRAMs | 3.3V | 0.255mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 117MHz | 256KX18 | 18 | 4718592 bit | 0.03A | 7.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||
| 7134LA70J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134la70j8-datasheets-5096.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 70 ns | 24b | 4KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||||
| 70V9359L7PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 45.45MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9359l7pfi-datasheets-5080.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 330mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 7 ns | 26b | 8KX18 | 0.003A | 18b | Synchronous | COMMON | 3V | |||||||||||||||||||||||||||||
| 70V3579S5BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s5bc-datasheets-5047.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | No | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 30b | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||||||
| 70T651S10BCI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s10bci8-datasheets-5041.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 18b | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||||
| 71V35761SA183BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 183MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa183bqg8-datasheets-5037.pdf | FBGA | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 340mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.3 ns | 17b | 0.03A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||
| 7015S12PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7015s12pf8-datasheets-5010.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 72 kb | no | 1.4mm | 2 | EAR99 | No | 325mA | 80 | 9kB | RAM, SDR, SRAM | 12 ns | 26b | 9b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71016S20PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 70°C | 0°C | CMOS | Non-RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71016s20ph-datasheets-4971.pdf | TSOP | 5V | 44 | 5.5V | 4.5V | 44 | Parallel | 1 Mb | no | 1 | not_compliant | 1 | 170mA | e0 | DUAL | GULL WING | 225 | 5V | 0.8mm | 44 | COMMERCIAL | 20 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 20 ns | 16b | 16 | 16b | Asynchronous | COMMON | YES | ||||||||||||||||||||||||||||||||||||||
| 70V3579S4BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s4bcg-datasheets-4962.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | yes | 1.4mm | 2 | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | No | 1 | 460mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 7.5 ns | 30b | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| 70V7319S166BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7319s166bc-datasheets-4932.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 4 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 790mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 18b | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| 7142LA25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7142la25j-datasheets-4897.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | 3.63mm | 2 | No | 170mA | 2kB | RAM, SDR, SRAM | 25 ns | 22b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V18L20PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | /files/integrateddevicetechnology-70v18l20pfi8-datasheets-4879.pdf | TQFP | 14mm | 1.4mm | 14mm | 3.3V | Contains Lead | 220mA | 100 | 7 Weeks | 657.000198mg | 3.6V | 3V | 100 | Parallel | 576 kb | no | 1.4mm | 2 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 72kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 32b | 64KX9 | 0.003A | 9b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||
| 7016S35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7016s35j-datasheets-4868.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 144 kb | no | 3.63mm | 2 | EAR99 | SEMAPHORE; INTERRUPT FLAG; AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 18kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 14b | 16KX9 | 0.015A | 9b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 7140LA35L48B | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140la35l48b-datasheets-4840.pdf | LCC | 14.2mm | 14.22mm | 5V | Contains Lead | 48 | 10 Weeks | 5.5V | 4.5V | 48 | Parallel | 8 kb | no | 1.78mm | 2 | No | 1 | 170mA | e0 | Tin/Lead (Sn/Pb) | QUAD | 240 | 5V | 1.016mm | 48 | MILITARY | SRAMs | 5V | MIL-PRF-38535 | RAM, SRAM | 3-STATE | 35 ns | 20b | 1KX8 | 0.004A | 8b | Asynchronous | COMMON | 2V |
