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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V65703S85BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 91MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65703s85bqgi-datasheets-3246.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 7 Weeks | 3.465V | 3.135V | 165 | Parallel | 9 Mb | yes | 1.2mm | 1 | FLOW-THROUGH | No | 1 | 60mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 30 | RAM, SRAM | 8.5 ns | 18b | 256KX36 | 36b | Synchronous | ||||||||||||||||||||||||||||||
| IDT71V416S10BEI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 4 (72 Hours) | 85°C | -40°C | CMOS | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s10bei-datasheets-6244.pdf | TFBGA | 9mm | 3.3V | 48 | 3.6V | 3V | 48 | Parallel | 4 Mb | 1 | not_compliant | 1 | 200mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 10 ns | 18b | 16 | 0.02A | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||
| 70121S25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70121s25j8-datasheets-3201.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 18 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2.3kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.015A | 9b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 71V124SA10YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa10yg8-datasheets-3067.pdf | 20.9mm | 10.2mm | 3.3V | Lead Free | 32 | 7 Weeks | 3.6V | 3.15V | 32 | Parallel | 1 Mb | yes | 2.2mm | 1 | No | 1 | 145mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 17b | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 70T631S12BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t631s12bf-datasheets-2955.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4 Mb | no | 1.4mm | 2 | No | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 36b | 0.01A | 18b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 7143LA90J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143la90j8-datasheets-2947.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | 3.63mm | 2 | No | 250mA | 4kB | RAM, SDR, SRAM | 90 ns | 22b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 71V3558SA166BQGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3558sa166bqgi8-datasheets-2936.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 3.465V | RAM, SRAM | 18b | 3.5 ns | ||||||||||||||||||||||||||||||||||||
| 70V06L20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06l20pf8-datasheets-2920.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 175mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 28b | 16KX8 | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 71T75602S133PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s133pfg8-datasheets-2733.pdf | TQFP | 20mm | 14mm | 2.5V | Lead Free | 100 | 8 Weeks | 2.625V | 2.375V | 100 | Parallel | 18 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 195mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 19b | 0.04A | 36b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||
| 71V3558SA100BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3558sa100bqgi-datasheets-2695.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | INDUSTRIAL | 30 | SRAMs | 0.255mA | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 5 ns | 18b | 0.045A | COMMON | ||||||||||||||||||||||||||||
| IDT71256SA20PZ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71256sa20pz8-datasheets-6045.pdf | TSSOP | 11.8mm | 8mm | 28 | Parallel | no | 1 | EAR99 | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | DUAL | GULL WING | 240 | 5V | 0.55mm | 28 | COMMERCIAL | 5.5V | 4.5V | 20 | Not Qualified | R-PDSO-G28 | RAM, SRAM - Asynchronous | 3-STATE | 32KX8 | 8 | 262144 bit | 20 ns | YES | ||||||||||||||||||||||||||||||||
| IDT71V424S12YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424s12yi-datasheets-6046.pdf | 23.495mm | 10.16mm | 36 | 36 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 36 | INDUSTRIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.17mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 512KX8 | 8 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | ||||||||||||||||||||||||||||||
| 70V08S35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v08s35pf-datasheets-2624.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 195mA | 64kB | RAM, SDR, SRAM | 35 ns | 32b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70V3569S6BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 83.3MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3569s6bc-datasheets-2504.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | No | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | 72kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 28b | 16KX36 | 0.015A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71V3557S80PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s80pfgi8-datasheets-2483.pdf | LQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 30 | SRAMs | 0.26mA | RAM, SRAM | 3-STATE | 95MHz | 17b | 0.045A | 8 ns | COMMON | |||||||||||||||||||||||||||
| 71T75802S150BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s150bgg8-datasheets-2422.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 119 | COMMERCIAL | 2.625V | 2.375V | SRAMs | RAM, SRAM | 3-STATE | 20b | 0.04A | 3.8 ns | COMMON | 2.38V | |||||||||||||||||||||||||||
| IDT71256SA25PZI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | RoHS Compliant | 2009 | /files/integrateddevicetechnology-idt71256sa25pzi-datasheets-5942.pdf | TSSOP | 11.8mm | 8mm | 28 | Parallel | EAR99 | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 240 | 5V | 0.55mm | 28 | INDUSTRIAL | 5.5V | 4.5V | 20 | SRAMs | 5V | 0.145mA | Not Qualified | R-PDSO-G28 | RAM, SRAM - Asynchronous | 3-STATE | 32KX8 | 8 | 262144 bit | 0.015A | 25 ns | COMMON | 4.5V | ||||||||||||||||||||||||||||||
| IDT71V016SA15Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa15y-datasheets-5924.pdf | 28.575mm | 3.3V | 44 | 3.6V | 3V | 44 | Parallel | 1 Mb | no | 1 | not_compliant | 1 | 130mA | e0 | DUAL | J BEND | 225 | 3.3V | 44 | COMMERCIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 15 ns | 16b | 16 | 16b | Asynchronous | COMMON | YES | |||||||||||||||||||||||||||||||
| 7024S70GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024s70gb-datasheets-2368.pdf | 27.94mm | 27.94mm | 5V | Contains Lead | 84 | 84 | Parallel | 64 kb | no | 3.68mm | 2 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | PERPENDICULAR | PIN/PEG | 240 | 5V | 84 | MILITARY | 20 | SRAMs | 5V | 0.3mA | 38535Q/M;38534H;883B | RAM, SRAM | 3-STATE | 24b | 4KX16 | 0.03A | 70 ns | COMMON | |||||||||||||||||||||||||||||
| 6116LA25TDB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116la25tdb-datasheets-2311.pdf | CDIP | 32.51mm | 7.62mm | 5V | Contains Lead | 24 | 5.5V | 4.5V | 24 | Parallel | 16 kb | no | 3.56mm | 1 | No | 1 | 85mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 2.54mm | 24 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 25 ns | 11b | 2KX8 | 0.0003A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 71V016SA10PHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa10phgi-datasheets-2303.pdf | TSOP | 18.41mm | 10.16mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3.15V | 44 | Parallel | 1 Mb | yes | 1mm | 1 | No | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 16b | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 71T75602S100BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s100bgi8-datasheets-2221.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 195mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 5 ns | 19b | 0.06A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||||
| IDT71256SA15PZI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71256sa15pzi8-datasheets-5840.pdf | TSSOP | 11.8mm | 8mm | 28 | Parallel | no | 1 | EAR99 | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | DUAL | GULL WING | 240 | 5V | 0.55mm | 28 | INDUSTRIAL | 5.5V | 4.5V | 20 | Not Qualified | R-PDSO-G28 | RAM, SRAM - Asynchronous | 3-STATE | 32KX8 | 8 | 262144 bit | 15 ns | YES | ||||||||||||||||||||||||||||||||
| 70V5388S166BCI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | 1.5mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v5388s166bci8-datasheets-2151.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 4 | 3A991.B.2.A | PIPELINED ARCHITECTURE | No | 1 | 400mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 3.2 ns | 16b | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||
| 6116SA70TDB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116sa70tdb-datasheets-2149.pdf | CDIP | 32.51mm | 7.62mm | 5V | Contains Lead | 24 | 5.5V | 4.5V | 24 | Parallel | 16 kb | no | 3.56mm | 1 | No | 1 | 90mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 2.54mm | 24 | MILITARY | SRAMs | 5V | MIL-STD-883 Class B | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 70 ns | 11b | 2KX8 | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| IDT71P72604S167BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 167MHz | Non-RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p72604s167bq-datasheets-5836.pdf | 15mm | 1.8V | 165 | 1.9V | 1.7V | 165 | Parallel | 18 Mb | 2 | not_compliant | 1 | 850mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.8V | 1mm | 165 | COMMERCIAL | 20 | SRAMs | Not Qualified | QDR, RAM, SRAM | 3-STATE | 500 ps | 18b | 36 | 36b | Synchronous | SEPARATE | ||||||||||||||||||||||||||||||||
| 7143SA90GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 125°C | -55°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143sa90gb-datasheets-2146.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | Parallel | 32 kb | 3.68mm | 2 | No | RAM, SRAM | 22b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V25L35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v25l35pf-datasheets-2119.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 26b | 8KX16 | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||
| 70T3599S133BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.5mm | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3599s133bci-datasheets-2066.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | INDUSTRIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM | 133MHz | 3-STATE | 15 ns | 34b | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7130SA100CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2013 | /files/integrateddevicetechnology-7130sa100cb-datasheets-2043.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 48 | Parallel | 8 kb | 3.3mm | 2 | No | 190mA | RAM, SRAM | 100 ns | 20b | 8b | Asynchronous |
