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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IDT71V016SA12Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa12y8-datasheets-4052.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | 1 | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.15mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 12 ns | COMMON | 3.15V | YES | ||||||||||||||||||||||||||||||||
| 70T3339S133BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3339s133bf-datasheets-7521.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | COMMERCIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 38b | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||||
| 71V016SA12BFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa12bfg8-datasheets-7507.pdf | 7mm | 7mm | 3.3V | Lead Free | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 1 Mb | yes | 1.4mm | 1 | No | 1 | 150mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.75mm | 48 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||
| 70V3389S5PRFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3389s5prfi8-datasheets-7449.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 1.1 Mb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | No | 1 | 415mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 5 ns | 16b | 64KX18 | 0.03A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 7134SA45P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa45p-datasheets-7412.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 32 kb | 3.8mm | 2 | No | 240mA | 4kB | RAM, SDR, SRAM | 45 ns | 24b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V08S15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v08s15pf-datasheets-7410.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 32b | 64KX8 | 0.006A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| 7008L25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l25j8-datasheets-7411.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 265mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| 7134LA20JG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134la20jg-datasheets-7369.pdf | PLCC | 19mm | 19mm | 5V | Lead Free | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | yes | 3.63mm | 2 | EAR99 | No | 1 | 240mA | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 24b | 4KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||
| 7050L25G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2001 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7050l25g-datasheets-7125.pdf | 30.48mm | 30.48mm | Contains Lead | 132 | 7 Weeks | 108 | no | 3.68mm | 4 | EAR99 | BATTERY BACKUP OPERATION | No | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | GULL WING | 240 | 5V | 2.54mm | 108 | COMMERCIAL | 5.5V | 4.5V | SRAMs | 5V | 0.305mA | S-PQFP-G132 | RAM, SRAM | 3-STATE | 1KX8 | 8192 bit | PARALLEL | 0.0006A | 25 ns | COMMON | 2V | |||||||||||||||||||||||||||||||
| IDT70825S35G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | CMOS | ASYNCHRONOUS | 5.207mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70825s35g-datasheets-3869.pdf | 27.94mm | 27.94mm | 84 | 84 | Parallel | EAR99 | AUTOMATIC POWER-DOWN | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | NO | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 5V | 2.54mm | 84 | COMMERCIAL | 5.5V | 4.5V | NOT SPECIFIED | Other Memory ICs | 5V | 0.34mA | Not Qualified | RAM | 8KX16 | 16 | 131072 bit | 0.015A | 35 ns | |||||||||||||||||||||||||||||||||||||
| 70V34L15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v34l15pf-datasheets-7121.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 72 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 185mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 9kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 12b | 4KX18 | 18b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||
| 7132LA25JI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la25ji-datasheets-7087.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.004A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||
| TH58NVG2S3HTA00 | Toshiba | $2.42 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-th58nvg2s3hta00-datasheets-3845.pdf | TFSOP | Parallel, Serial | yes | unknown | EEPROM, NAND | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71024S15YGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71024s15ygi-datasheets-7014.pdf | 20.9mm | 10.2mm | 5V | Lead Free | 32 | 7 Weeks | 5.5V | 4.5V | 32 | Parallel | 1 Mb | yes | 2.2mm | 1 | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 5V | 32 | INDUSTRIAL | SRAMs | 5V | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 17b | COMMON | ||||||||||||||||||||||||||||||||||||
| 7005L20G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l20g-datasheets-7000.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | 3.68mm | 2 | No | 240mA | 8kB | RAM, SDR, SRAM | 20 ns | 26b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V3576S133PFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3576s133pfgi8-datasheets-6966.pdf | LQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 30 | SRAMs | 0.26mA | RAM, SRAM | 3-STATE | 17b | 0.035A | 4.2 ns | COMMON | ||||||||||||||||||||||||||||||||
| 70V9169L9PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 40MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9169l9pf-datasheets-6844.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 144 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 230mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 18kB | RAM, SDR, SRAM | 3-STATE | 9 ns | 28b | 16KX9 | 0.003A | 9b | Synchronous | COMMON | 3V | ||||||||||||||||||||||||||
| 70V05S15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v05s15pf-datasheets-6805.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 215mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 26b | 8KX8 | 0.005A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||
| 7134SA45J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa45j-datasheets-6764.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 45 ns | 24b | 4KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||
| TH58BYG2S3HBAI6 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | RoHS Compliant | BGA | 67 | Parallel | EEPROM, NAND | 1.8V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71T75802S133BGGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s133bggi-datasheets-6666.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 119 | INDUSTRIAL | 2.625V | 2.375V | 30 | SRAMs | RAM, SRAM | 3-STATE | 20b | 0.06A | 4.2 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||
| 7025S15J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s15j-datasheets-6560.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 26b | 8KX16 | 0.015A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| IDT71V3579S85PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579s85pfi-datasheets-3674.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | SRAMs | 3.3V | 0.19mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 87MHz | 256KX18 | 18 | 4718592 bit | 0.035A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||
| IDT71V3558SA133BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3558sa133bg-datasheets-3670.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 3.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||
| IDT71V65703S85PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v65703s85pfi-datasheets-3650.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.06mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 90MHz | 256KX36 | 36 | 9437184 bit | 0.06A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||
| 7133SA35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133sa35pf8-datasheets-6501.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 32 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 295mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||
| 7024S35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024s35pf-datasheets-6484.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX16 | 0.015A | COMMON | |||||||||||||||||||||||||||||
| 7134LA70P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134la70p-datasheets-6268.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 32 kb | no | 3.8mm | 2 | EAR99 | AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | DUAL | 245 | 5V | 48 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 70 ns | 24b | 4KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||||||
| 7130SA55TF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa55tf8-datasheets-6266.pdf | TQFP | 10mm | 10mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 155mA | 2kB | RAM, SDR, SRAM | 55 ns | 20b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 709089L15PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 28.5MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709089l15pf8-datasheets-6245.pdf | TQFP | 14mm | 1.4mm | 14mm | 5V | Contains Lead | 285mA | 100 | 7 Weeks | 657.000198mg | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 285mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 32b | 64KX8 | 0.005A | 8b | Synchronous | COMMON |
