| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | Memory Size | Memory Type | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 7025S45J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025s45j-datasheets-8494.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | 3.63mm | 2 | No | 16kB | RAM, SDR, SRAM | 45 ns | 13b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3557SA75BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557sa75bqg-datasheets-6783.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | unknown | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 30 | SRAMs | 3.3V | 0.275mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 7.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 70V3579S5DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s5dr-datasheets-8301.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 1.1 Mb | no | 3.5mm | 2 | No | 1 | 360mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 30b | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||
| 70V28L15PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v28l15pf8-datasheets-8283.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | 1.4mm | 2 | No | 235mA | 128kB | RAM, SDR, SRAM | 15 ns | 32b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3557SA75BQ8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557sa75bq8-datasheets-6719.pdf | 165 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V321L25PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321l25pfi8-datasheets-8259.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | BATTERY BACKUP;AUTOMATIC POWER DOWN | No | 1 | 130mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | INDUSTRIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.004A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 7005S20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005s20j8-datasheets-8260.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | No | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX8 | 0.155A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| 70V3579S4BFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s4bfg-datasheets-8256.pdf | 15mm | 15mm | 3.3V | Lead Free | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 1.1 Mb | yes | 1.4mm | 2 | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | No | 1 | 460mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 208 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 7.5 ns | 30b | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70P265L65BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p265l65bygi8-datasheets-6683.pdf | TFBGA | 100 | 3V | 1.8V | 100 | Parallel | 256 kb | yes | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.07mA | 32kB | RAM, SDR, SRAM | 3-STATE | 65 ns | 28b | 16KX16 | 16 | 0.000008A | COMMON | |||||||||||||||||||||||||||||||
| 71321LA25TF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la25tf8-datasheets-8246.pdf | TQFP | 10mm | 10mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 170mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 709089L12PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709089l12pf-datasheets-8244.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | FLAT | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 0.305mA | 64kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 50MHz | 32b | 64KX8 | 0.005A | COMMON | ||||||||||||||||||||||
| 70P255L65BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p255l65bygi8-datasheets-6631.pdf | TFBGA | 100 | 16 Weeks | 3V | 1.8V | 100 | Parallel | 128 kb | yes | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.07mA | 16kB | RAM, SDR, SRAM | 3-STATE | 65 ns | 26b | 8KX16 | 16 | 0.000008A | COMMON | ||||||||||||||||||||||||||||||
| 70V3389S6PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 83.3MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3389s6prf-datasheets-8001.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.45V | 3.15V | 128 | Parallel | 1.1 Mb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | No | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 6 ns | 32b | 64KX18 | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V28L20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 70°C | 0°C | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v28l20pf8-datasheets-8002.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | 1.4mm | 2 | No | 128kB | RAM, SDR, SRAM | 20 ns | 32b | |||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3557SA75BQ | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557sa75bq-datasheets-6603.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 1mm | 165 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.275mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 7.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 70V9279S9PRF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 40MHz | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9279s9prf8-datasheets-7960.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 9 ns | 15b | 0.005A | 16b | Synchronous | COMMON | 3V | |||||||||||||||||||||||
| 70T651S10BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t651s10bci-datasheets-7911.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | INDUSTRIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 10 ns | 18b | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| 71V016SA15YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v016sa15yg-datasheets-7845.pdf | 28.6mm | 10.2mm | 3.3V | Lead Free | 44 | 12 Weeks | 3.6V | 3V | 44 | Parallel | 1 Mb | yes | 2.9mm | 1 | No | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 44 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 16b | 16b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| 71V67803S150PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 150MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67803s150pfg8-datasheets-7785.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 305mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.8 ns | 19b | 0.05A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70P255L65BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p255l65bygi-datasheets-7766.pdf | TFBGA | 6mm | 6mm | Lead Free | 100 | 16 Weeks | 3V | 1.8V | 100 | Parallel | 128 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.07mA | 16kB | RAM, SDR, SRAM | 3-STATE | 65 ns | 26b | 8KX16 | 0.000008A | COMMON | ||||||||||||||||||||||||||
| AT25DF081-SSHN-B | Microchip |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | SMD/SMT | 85°C | -40°C | 66MHz | RoHS Compliant | 1997 | https://pdf.utmel.com/r/datasheets/microchip-at25df081sshnb-datasheets-7717.pdf | SOIC | 5mm | 1.5mm | 3.99mm | 1.8V | No SVHC | 1.95V | 1.65V | 8 | SPI, Serial | 8 Mb | 12mA | 1MB | FLASH, NOR | 7 ns | 20b | 8b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| 71V321L55TF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v321l55tf-datasheets-7693.pdf | LQFP | 10mm | 10mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 85mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| IDT71V3557SA75BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 85°C | -40°C | 100MHz | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557sa75bgi8-datasheets-6493.pdf | BGA | 3.3V | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | 1 | not_compliant | 119 | RAM, SRAM | 7.5 ns | 17b | 36b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 7054L20PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7054l20prf-datasheets-7663.pdf | TQFP | 20mm | 14mm | 5V | Contains Lead | 128 | 7 Weeks | 5.5V | 4.5V | 128 | Parallel | 32 kb | no | 1.4mm | 4 | EAR99 | AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | No | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | QUAD | FLAT | 225 | 5V | 0.5mm | 128 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 12b | 0.0015A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 7019L20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7019l20pf8-datasheets-7623.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 1.1 Mb | 1.4mm | 2 | No | 300mA | RAM, SRAM | 20 ns | 34b | 9b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 7024L25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024l25j-datasheets-7555.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 24b | 4KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 70V3379S4BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s4bc-datasheets-7362.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 30b | 0.015A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||
| AT45DB161E-SHD-B | Microchip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1997 | https://pdf.utmel.com/r/datasheets/microchip-at45db161eshdb-datasheets-7350.pdf | 8 | 2MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3557SA75BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557sa75bgi-datasheets-6346.pdf | BGA | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 119 | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V7519S133BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7519s133bci-datasheets-7179.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 675mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 25 ns | 18b | 0.04A | 36b | Synchronous | COMMON |
Please send RFQ , we will respond immediately.