| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| IDT71V67803S133PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67803s133pfi8-datasheets-5531.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.28mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX18 | 18 | 9437184 bit | 0.07A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||
| 7008L55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l55j8-datasheets-5068.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 230mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 7143LA55G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143la55g-datasheets-5067.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.68mm | 2 | EAR99 | No | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||
| 7008S25J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008s25j8-datasheets-5049.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| 7024S55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024s55j-datasheets-5039.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX16 | 0.015A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||
| 71256SA20YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256sa20yg-datasheets-4991.pdf | 17.9mm | 7.6mm | 5V | Lead Free | 28 | 12 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | yes | 2.67mm | 1 | EAR99 | No | 1 | 145mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 15b | 32KX8 | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 71V3579S80PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3579s80pfg8-datasheets-5451.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8 ns | 18b | 0.03A | 18b | Synchronous | COMMON | |||||||||||||||||||||||
| 7130SA100P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130sa100p-datasheets-4878.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 5.5V | 4.5V | 48 | Parallel | 8 kb | 3.8mm | 2 | No | 155mA | 1kB | RAM, SDR, SRAM | 100 ns | 20b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 7025L20PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025l20pfi8-datasheets-4819.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | 320mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 26b | 8KX16 | 0.004A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||
| IDT71V016SA12PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa12phi-datasheets-5392.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.16mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 12 ns | COMMON | 3.15V | |||||||||||||||||||||||||||||
| IDT709389L9PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt709389l9pf-datasheets-5389.pdf | LQFP | 14mm | 14mm | 100 | Parallel | 2 | 3A991.B.2.A | FLOW-THROUGH OR PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 5.5V | 4.5V | 20 | SRAMs | 5V | 0.4mA | Not Qualified | S-PQFP-G100 | RAM, SRAM | 3-STATE | 66MHz | 64KX18 | 18 | 1179648 bit | 0.003A | 20 ns | COMMON | 4.5V | |||||||||||||||||||||||||
| 70P3519S200BCG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p3519s200bcg8-datasheets-5391.pdf | 17mm | 17mm | 1.8V | Lead Free | 256 | 256 | Parallel | 9 Mb | yes | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 1mm | 256 | COMMERCIAL | 1.9V | 1.7V | RAM, SRAM | 18b | 10 ns | |||||||||||||||||||||||||||||||||
| 70V09L15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v09l15pf-datasheets-4754.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 1 Mb | no | 1.4mm | 2 | No | 1 | 235mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 34b | 0.003A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||
| 7133SA45J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133sa45j8-datasheets-4712.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 290mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 45 ns | 22b | 0.0015A | 16b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||
| 71V3558SA166BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3558sa166bqg-datasheets-4603.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 3.465V | 3.135V | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | 350mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 18b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 7008L55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l55pf-datasheets-4544.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 230mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 32b | 64KX8 | 0.005A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||
| 71V432S5PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v432s5pfg-datasheets-4520.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 3.63V | 3.135V | 100 | Parallel | 1 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 5 ns | 15b | 32KX32 | 32b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V9279L12PRF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9279l12prf8-datasheets-4514.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 512 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 205mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 15b | 0.003A | 16b | Synchronous | COMMON | 3V | |||||||||||||||||||||||
| IDT709389L7PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt709389l7pf8-datasheets-5325.pdf | LQFP | 14mm | 14mm | 100 | Parallel | 2 | 3A991.B.2.A | FLOW-THROUGH OR PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 5.5V | 4.5V | 20 | SRAMs | 5V | 0.465mA | Not Qualified | S-PQFP-G100 | RAM, SRAM | 3-STATE | 83MHz | 64KX18 | 18 | 1179648 bit | 0.003A | 18 ns | COMMON | 4.5V | ||||||||||||||||||||||||
| 7024L17J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024l17j8-datasheets-4495.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 17 ns | 24b | 4KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 71V424L12YG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v424l12yg8-datasheets-4480.pdf | 23.4mm | 10.2mm | 3.3V | Lead Free | 36 | 12 Weeks | 3.6V | 3V | 36 | Parallel | 4 Mb | yes | 2.2mm | 1 | No | 1 | 155mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 36 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 12 ns | 19b | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||
| 7140SA35CB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 125°C | -55°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7140sa35cb-datasheets-4467.pdf | DIP | 61.72mm | 15.24mm | 5V | Contains Lead | 10 Weeks | 5.5V | 4.5V | 48 | Parallel | 8 kb | 3.3mm | 2 | No | 230mA | RAM, SRAM | 35 ns | 10b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 7132LA25JI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la25ji8-datasheets-4466.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.004A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||
| 70V9279L12PRF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9279l12prf-datasheets-4436.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 512 kb | no | 1.4mm | 2 | No | 205mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | COMMERCIAL | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 30b | 0.003A | 16b | Synchronous | COMMON | 3V | ||||||||||||||||||||||||||
| IDT709389L7PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt709389l7pf-datasheets-5208.pdf | LQFP | 14mm | 14mm | 100 | Parallel | 2 | 3A991.B.2.A | FLOW-THROUGH OR PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 5.5V | 4.5V | 20 | SRAMs | 5V | 0.465mA | Not Qualified | S-PQFP-G100 | RAM, SRAM | 3-STATE | 83MHz | 64KX18 | 18 | 1179648 bit | 0.003A | 18 ns | COMMON | 4.5V | |||||||||||||||||||||||||
| IDT71V3557S85BQI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557s85bqi8-datasheets-5191.pdf | 165 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7008L15J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008l15j8-datasheets-4224.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 512 kb | no | 3.63mm | 2 | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 32b | 64KX8 | 0.005A | COMMON | ||||||||||||||||||||||||||||
| 7024L70GB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024l70gb-datasheets-4222.pdf | 27.94mm | 27.94mm | 5V | Contains Lead | 84 | 84 | Parallel | 64 kb | no | 3.68mm | 2 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | PERPENDICULAR | PIN/PEG | 240 | 5V | 84 | MILITARY | 20 | SRAMs | 5V | 38535Q/M;38534H;883B | RAM, SRAM | 3-STATE | 24b | 4KX16 | 0.004A | 70 ns | COMMON | 2V | |||||||||||||||||||||||||||||
| 71V3558S166PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3558s166pfg-datasheets-4074.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | No | 1 | 350mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 18b | 0.04A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| 7164S25YG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.556mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7164s25yg-datasheets-4065.pdf | 17.9mm | 7.6mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 64 kb | yes | 2.67mm | 1 | EAR99 | No | 1 | 90mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | COMMERCIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 25 ns | 13b | 8KX8 | 8b | Asynchronous | COMMON |
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